Abstract: Devices, systems, and methods for offloading data service operations from an application critical path are disclosed. A storage service control apparatus can include a compute resource interface configured to communicatively couple to a compute resource, a memory interface configured to communicatively couple to a memory resource, an out of band (oob) channel interface configured to communicatively couple to an oob channel, and a data service controller communicatively coupled to the oob channel interface. The data service controller is configured to identify a data service operation to be performed by the compute resource on data stored in the memory resource, load a data service agent configured to facilitate the data service operation, and perform the data service operation on the data to generate serviced data via the data service agent over the oob channel by an oob compute resource, thus freeing the compute resource from performing the data service operation.

Abstract: An interconnect structure, such as a flip-chip structure, including a base pad and a stud formed on the base pad and extending from the base pad is disclosed. The stud and base pad are formed to be continuous and of substantially the same electrically conductive base material. Typically, a solder structure is formed on the stud wherein the solder structure is exposed for subsequent reflow attachment to another structure. The present invention relates to packaging integrated circuits, more particularly to the structure and processing of a stud and bump without the standard under bump metallurgy.