Abstract: A structured abrasive article comprises a backing with a topographically structured abrasive layer secured thereto. The topographically structured abrasive layer comprises precisely-shaped abrasive composites. A solid overlayer comprising eroding particles with a Mohs scale hardness of at least 4 and a water-soluble polymer is disposed on at least a portion of the topographically structured abrasive layer. Methods of making and using the structured abrasive articles are also disclosed.

Abstract: A structured abrasive article comprises a backing with a topographically structured abrasive layer secured thereto. The topographically structured abrasive layer comprises precisely-shaped abrasive composites. A solid overlayer comprising eroding particles with a Mohs scale hardness of at least 4 and a water-soluble polymer is disposed on at least a portion of the topographically structured abrasive layer. Methods of making and using the structured abrasive articles are also disclosed.

Abstract: A radiation detackifiable adhesive composition comprising a (meth)acrylate copolymer including from 85 wt. % to 97.5 wt. % of a (meth)acrylate ester and from 2.5 wt. % to 15 wt. % of a copolymerizable carboxylate monomer and a multi-functional urethane acrylate oligomer combined with the (meth)acrylate copolymer to provide from 25 parts to 40 parts of the oligomer per 100 parts of the copolymer. The adhesive composition becomes progressively detackified during exposure to ultraviolet radiation. Properties of adhesive compositions may be maintained at elevated temperatures, from about 115° C. to about 155° C., when they include a thermally stable free radical initiator to overcome premature adhesive detackification. The present invention further provides a clear adhesive coated sheet for supporting a silicon wafer during manufacture of semiconductor microchips. The coated sheet comprises a transparent film substrate coated with a radiation detackifiable adhesive composition.

Abstract: A radiation detackifiable adhesive composition comprising a (meth)acrylate copolymer including from 85 wt. % to 97.5 wt. % of a (meth)acrylate ester and from 2.5 wt. % to 15 wt. % of a copolymerizable carboxylate monomer and a multi-functional urethane acrylate oligomer combined with the (meth)acrylate copolymer to provide from 25 parts to 40 parts of the oligomer per 100 parts of the copolymer. The adhesive composition becomes progressively detackified during exposure to ultraviolet radiation. Properties of adhesive compositions may be maintained at elevated temperatures, from about 115° C. to about 155° C., when they include a thermally stable free radical initiator to overcome premature adhesive detackification.

Abstract: A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

Abstract: A radiation detackifiable adhesive composition comprising a (meth)acrylate copolymer including from about 85 wt. % to about 97.5 wt. % of a (meth)acrylate ester and from about 2.5 wt. % to about 15 wt. % of a copolymerizable carboxylate monomer and a multi-functional urethane acrylate oligomer combined with the (meth)acrylate copolymer to provide from about 25 parts to about 40 parts of the oligomer per 100 parts of the copolymer. The adhesive composition becomes progressively detackified during exposure to ultraviolet radiation. The present invention further provides a clear adhesive coated sheet for supporting a silicon wafer during manufacture of semiconductor microchips. The coated sheet comprises a transparent film substrate coated with a radiation detackifiable adhesive composition.

Abstract: A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

Abstract: A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

Abstract: The present invention provides a novel one-piece capstan for a tape cartridge which provides good static dissipative properties and wear resistance. The capstan material of the present invention has a charge decay time of no more than 5 seconds as measured according to Mil B-81705C standard. The capstan material also has a flexural modulus of at least 200,000 psi (1379 MPa). The capstan comprises a hard, dimensionally stable polymer and a static dissipating polymer. The capstan also has an improved structure and geometry which enables the part to be easily molded, reduces drive force requirements with a reduction of material from the prior art design, but with no significant loss of performance properties.