Patents by Inventor Kashi Vishwanath Machani

Kashi Vishwanath Machani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pillar structure for use in packaging integrated circuit products and methods of making such a pillar structure
    Patent number: 8957524
    Abstract: One illustrative pillar disclosed herein includes a bond pad conductively coupled to an integrated circuit and a pillar comprising a base that is conductively coupled to the bond pad, wherein the base has a first lateral dimension, and an upper portion that is conductively coupled to the base, wherein the upper portion has a second lateral dimension that is less than the first lateral dimension. A method disclosed herein of forming a pillar includes forming a base such that it is conductively coupled to a bond pad on an integrated circuit product and, after forming the base, forming an upper portion such that it is conductively coupled to the base.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: February 17, 2015
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Dirk Breuer, Frank Kuechenmeister, Jens Paul, Kashi Vishwanath Machani
  • NOVEL PILLAR STRUCTURE FOR USE IN PACKAGING INTEGRATED CIRCUIT PRODUCTS AND METHODS OF MAKING SUCH A PILLAR STRUCTURE
    Publication number: 20140264890
    Abstract: One illustrative pillar disclosed herein includes a bond pad conductively coupled to an integrated circuit and a pillar comprising a base that is conductively coupled to the bond pad, wherein the base has a first lateral dimension, and an upper portion that is conductively coupled to the base, wherein the upper portion has a second lateral dimension that is less than the first lateral dimension. A method disclosed herein of forming a pillar includes forming a base such that it is conductively coupled to a bond pad on an integrated circuit product and, after forming the base, forming an upper portion such that it is conductively coupled to the base.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: GLOBALFOUNDRIES INC.
    Inventors: Dirk Breuer, Frank Kuechenmeister, Jens Paul, Kashi Vishwanath Machani
  • Semiconductor device with chip mounted on a substrate
    Patent number: 8410595
    Abstract: A semiconductor device is disclosed. At least one semiconductor chip is mounted on a substrate and is contacted to contact elements of the substrate. The encapsulation of the semiconductor chip includes the substrate, a cover and a pocket within the connected substrate and cover. The pocket is able to fix the chip in its position, and the cover is composed of the same material as the substrate.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: April 2, 2013
    Assignee: Qimonda AG
    Inventors: Steffen Kroehnert, Kerstin Nocke, Juergen Grafe, Kashi Vishwanath Machani
  • Semiconductor Device with Chip Mounted on a Substrate
    Publication number: 20080157330
    Abstract: A semiconductor device is disclosed. At least one semiconductor chip is mounted on a substrate and is contacted to contact elements of the substrate. The encapsulation of the semiconductor chip includes the substrate, a cover and a pocket within the connected substrate and cover. The pocket is able to fix the chip in its position, and the cover is composed of the same material as the substrate.
    Type: Application
    Filed: December 28, 2007
    Publication date: July 3, 2008
    Inventors: Steffen Kroehnert, Kerstin Nocke, Juergen Grafe, Kashi Vishwanath Machani