Patents by Inventor Kasyap Venkata Seethamraju

Kasyap Venkata Seethamraju has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads
    Patent number: 6657297
    Abstract: A flexible plastic thermally conductive multilayer semiconductor mounting pad having a highly thermally conductive bulk layer with thermally conductive surface skin layers bonded integrally to opposed major surfaces thereof. The bulk layer and the surface skin layers are each filled with a finely divided thermally conductive particulate, with the skin layers being harder than the bulk layer and being blended with an amount of filler which is less than that present in the bulk layer.
    Type: Grant
    Filed: August 15, 2002
    Date of Patent: December 2, 2003
    Assignee: The Bergquist Company
    Inventors: Radesh Jewram, Kasyap Venkata Seethamraju, Kevin L. Hanson