Abstract: A dispersion of nanoplatelets or particles suspended in a carrier liquid is disclosed. The nanoplatelets or particles, e.g. graphene nanoplatelets, are derived from a layered material. The loading amount of nanoplatelets or particles in the dispersion is at least 20 mg nanoplatelets or particles per 1 ml of dispersion. The dispersion optionally further including a dispersant, the volume ratio of dispersant to the nanoplatelets or particles being less than 1:1. A process for manufacturing the dispersion includes mixing the carrier liquid and the nanoplatelets or particles under high shear conditions. The dispersion can be used as an ink system, as a functional additive within an ink, coating or adhesive formulation, and/or in the manufacture of a nanoplatelet-polymer composite or a particle-polymer composite.

Abstract: A known method of forming organic semiconductor devices employs the deposition of a conductive polymer onto a substrate to form electrodes or conductive tracks and then to apply an electrical material such as an organic semiconductor on top of these tracks. Although the conductive polymer serves as a highly efficient injector of electrons into the semiconductor, it is not a good conductor. This introduces undesirable inefficient in the supply of current to and from the semiconductor. Worse still the conductivity may deteriorate with time. A solution to this problem has been found by printing the polymer (7) onto a conductive layer (6) carried on a substrate (5). The printed polymer (7) is then used as a resist during a process in which parts of the conductive polymer not protected by the polymer are removed. The resulting device benefits from the good electron injection qualities of the conductive polymer (7) and efficient conduction by virtue of the underlying conductive layer (6).

Abstract: The invention provides a method of making an electrical device, particularly a semiconductor device, having a substrate and etched electrodes formed on the substrate. The method employs flexography to print a resist pattern (7) onto a substrate (5) carrying a metal layer (8). Metal not protected by the resist can be etched away and then the resist (7) removed to leave exposed electrodes. Further materials (10, 11) can be disposed onto the exposed metal, such as organic semiconductors, to form transistors or diodes.

Abstract: An article (1) includes a substrate (5) having indicia (6) printed thereon and an electronic device (2) having at least one input device (3) and at least one output device (4). The indicia (6) include one or more directions or questions (61) in response to which a user provides input to the electronic device via the at least one input device. The indicia further include a link (62) to a source of additional directions or questions.

Abstract: A printed electronic tag (2) for packaging comprising a first set of spaced, electrically-conductive lines (4) overlying a substrate (5), an electrically-insulating layer (6) overlying at least a portion of the first set of lines, a second set of spaced, electrically-conductive lines (8) overlying the insulating layer, arranged to cross the first set of lines, the insulating layer configured to provide at least one region (10) for providing electrical contact between a line in the first set of the conductive lines and a line in the second set of lines.

Abstract: Apparatus comprise a printed article (2) supporting at least one user input device (6), at least one output device (8) and a controller (7). The controller is configured, in response to receiving an input signal from a user input device, to cause an output device to produce an output signal in dependence upon a previous input signal received by the input device or another input device and/or upon an updatable parameter indicating one of at least two states.

Abstract: Trading cards (1, 2) each include part (17, 18) of a circuit. When the trading cards are inserted into a game card (3), a circuit is completed. Depending on the circuit, one of four light emitting diodes (291, 292, 293, 294) on the game card is lit. No semiconductor chip is required in the card.

Abstract: A printed electronic tag (2) for packaging comprising a first set of spaced, electrically-conductive lines (4) overlying a substrate (5), an electrically-insulating layer (6) overlying at least a portion of the first set of lines, a second set of spaced, electrically-conductive lines (6) overlying the insulating layer, arranged to cross the first set of lines, the insulating layer configured to provide at least one region (10) for providing electrical contact between a line in the first set of the conductive lines and a line in the second set of lines.

Abstract: Conventionally, organic semiconductor devices are usually formed by either laser ablation, photolithography or by conductive inkjet printing. All these methods have short coming such as either being unsuitable for high volume production, slow, expensive or as is particularly the case in inject printing, the choice of metals used is restricted to those which can be formed as inks. The present invention employs flexography to print a resist pattern (7) onto a substrate (5) carrying a metal layer (8). Metal not protected by the resist can be etched away and then the resist (7) removed to leave exposed electrodes. Further materials (10, 11) can be disposed onto the exposed metal, such as organic semiconductors, to form transistors or diodes.

Abstract: Trading cards (1, 2) each include part (17, 18) of a circuit. When the trading cards are inserted into a game card (3), a circuit is completed. Depending on the circuit, one of four light emitting diodes (291, 292, 293, 294) on the game card is lit. No semiconductor chip is required in the card.

Abstract: A known method of forming organic semiconductor devices employs the deposition of a conductive polymer onto a substrate to form electrodes or conductive tracks and then to apply an electrical material such as an organic semiconductor on top of these tracks. Although the conductive polymer serves as a highly efficient injector of electrons into the semiconductor, it is not a good conductor. This introduces undesirable inefficient in the supply of current to and from the semiconductor. Worse still the conductivity may deteriorate with time. A solution to this problem has been found by printing the polymer (7) onto a conductive layer (6) carried on a substrate (5). The printed polymer (7) is then used as a resist during a process in which parts of the conductive polymer not protected by the polymer are removed. The resulting device benefits from the good electron injection qualities of the conductive polymer (7) and efficient conduction by virtue of the underlying conductive layer (6).