Patents by Inventor Katharina Maier

Katharina Maier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DEVICES WITH THINNED WAFER
    Publication number: 20160332873
    Abstract: Methods, apparatuses and devices are described where a main wafer is irreversibly bonded to a carrier wafer and thinned to reduce a thickness of the main wafer, for example down to a thickness of 300 ?m or below.
    Type: Application
    Filed: July 29, 2016
    Publication date: November 17, 2016
    Inventors: Andre Brockmeier, Christian Kalousek, Katharina Maier, Peter Zorn, Kai-Alexander Schreiber, Francesco Solazzi
  • Devices with thinned wafer
    Patent number: 9428381
    Abstract: Methods, apparatuses and devices are described where a main wafer is irreversibly bonded to a carrier wafer and thinned to reduce a thickness of the main wafer, for example down to a thickness of 300 ?m or below.
    Type: Grant
    Filed: March 3, 2014
    Date of Patent: August 30, 2016
    Assignee: Infineon Technologies AG
    Inventors: Andre Brockmeier, Christian Griessler, Katharina Maier, Peter Zorn, Kai-Alexander Schreiber, Francesco Solazzi
  • DEVICES WITH THINNED WAFER
    Publication number: 20150246809
    Abstract: Methods, apparatuses and devices are described where a main wafer is irreversibly bonded to a carrier wafer and thinned to reduce a thickness of the main wafer, for example down to a thickness of 300 ?m or below.
    Type: Application
    Filed: March 3, 2014
    Publication date: September 3, 2015
    Applicant: Infineon Technologies AG
    Inventors: Andre Brockmeier, Christian Griessler, Katharina Maier, Peter Zorn, Kai-Alexander Schreiber, Francesco Solazzi