Patents by Inventor Katharina Teichmann

Katharina Teichmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING WET ETCHING AND DRY ETCHING AND SEMICONDUCTOR DEVICE
    Publication number: 20240318320
    Abstract: A semiconductor device includes a semiconductor substrate, a TiW layer arranged on the semiconductor substrate a Ti layer arranged on the TiW layer, a Ni alloy layer arranged on the Ti layer, and an Ag layer arranged on the Ni alloy layer, wherein the Ag layer and the Ni alloy layer comprise side faces fabricated by at least one wet etching process, and wherein the Ti layer and the TiW layer comprise side faces fabricated by a dry etching process.
    Type: Application
    Filed: June 3, 2024
    Publication date: September 26, 2024
    Inventors: Saurabh Roy, Matteo Dainese, Michael Ehmann, Hiroshi Narahashi, Johanna Schlaminger, Katharina Teichmann, Sigrid Wabnig
  • Method for fabricating a semiconductor device using wet etching and dry etching and semiconductor device
    Patent number: 12018387
    Abstract: A method for fabricating a semiconductor device comprises depositing a TiW layer on a semiconductor substrate, depositing a Ti layer on the TiW layer, depositing a Ni alloy layer on the Ti layer, depositing an Ag layer on the Ni alloy layer, at least partially covering the Ag layer with photoresist, wet etching the Ag layer and the Ni alloy layer, and dry etching the Ti layer and the TiW layer.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: June 25, 2024
    Assignee: Infineon Technologies Austria AG
    Inventors: Saurabh Roy, Matteo Dainese, Michael Ehmann, Hiroshi Narahashi, Johanna Schlaminger, Katharina Teichmann, Sigrid Wabnig
  • METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING WET ETCHING AND DRY ETCHING AND SEMICONDUCTOR DEVICE
    Publication number: 20220235470
    Abstract: A method for fabricating a semiconductor device comprises depositing a TiW layer on a semiconductor substrate, depositing a Ti layer on the TiW layer, depositing a Ni alloy layer on the Ti layer, depositing an Ag layer on the Ni alloy layer, at least partially covering the Ag layer with photoresist, wet etching the Ag layer and the Ni alloy layer, and dry etching the Ti layer and the TiW layer.
    Type: Application
    Filed: January 24, 2022
    Publication date: July 28, 2022
    Inventors: Saurabh Roy, Matteo Dainese, Michael Ehmann, Hiroshi Narahashi, Johanna Schlaminger, Katharina Teichmann, Sigrid Wabnig
  • Electronic module with an electrically conductive press-fit terminal having a press-fit section
    Patent number: 11114780
    Abstract: An electronic assembly includes an electronic module and an electric part. The electronic module includes an electrically conductive press-fit terminal. The electrically conductive press-fit terminal has a press-fit section. The electric part has a contact hole. The press-fit section is inserted in the contact hole and plastically deformed therein, such that the press-fit section both mechanically and electrically contacts the electric part in the plastically deformed state. A corresponding method of assembly is also described.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: September 7, 2021
    Assignee: Infineon Technologies AG
    Inventors: Katharina Teichmann, Alexander Herbrandt
  • Electronic Module with an Electrically Conductive Press-Fit Terminal Having a Press-Fit Section
    Publication number: 20200251839
    Abstract: An electronic assembly includes an electronic module and an electric part. The electronic module includes an electrically conductive press-fit terminal. The electrically conductive press-fit terminal has a press-fit section. The electric part has a contact hole. The press-fit section is inserted in the contact hole and plastically deformed therein, such that the press-fit section both mechanically and electrically contacts the electric part in the plastically deformed state. A corresponding method of assembly is also described.
    Type: Application
    Filed: April 21, 2020
    Publication date: August 6, 2020
    Inventors: Katharina Teichmann, Alexander Herbrandt
  • Method for electrically connecting an electronic module and electronic assembly
    Patent number: 10693248
    Abstract: An electronic assembly has an electronic module and an electric part. The electronic module has an electric terminal having a press-fit section. The press-fit section includes at least one of the following CuFeP; CuZr; CuCrZr; CuMg; CuCrTiSi; CuCrAgFeTiSi; and CuNiSiMg. The electric part has a contact hole. The electronic assembly includes a press-fit connection between the press-fit section and the electric part. In that press-fit connection, the press-fit section both mechanically and electrically contacts the electric part.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: June 23, 2020
    Assignee: Infineon Technologies AG
    Inventors: Katharina Teichmann, Alexander Herbrandt
  • Method for Electrically Connecting an Electronic Module and Electronic Assembly
    Publication number: 20180337475
    Abstract: An electronic assembly has an electronic module and an electric part. The electronic module has an electric terminal having a press-fit section. The press-fit section includes at least one of the following CuFeP; CuZr; CuCrZr; CuMg; CuCrTiSi; CuCrAgFeTiSi; and CuNiSiMg. The electric part has a contact hole. The electronic assembly includes a press-fit connection between the press-fit section and the electric part. In that press-fit connection, the press-fit section both mechanically and electrically contacts the electric part.
    Type: Application
    Filed: May 16, 2018
    Publication date: November 22, 2018
    Inventors: Katharina Teichmann, Alexander Herbrandt