Abstract: An identifier of choice is correlated (102) with a predetermined task that potentially comprises a plurality of discrete human-enabled events. At least some of these discrete human-enabled events are then associated (104) with a corresponding capacitively-coupled radio frequency identification tag and the identifier then used (105) to monitor effectuation of the predetermined task. By one approach this monitoring comprises, at least in part, monitoring human-based task effectuation events via the capacitively-coupled radio frequency identification tags.

Abstract: A self supported underfill film (18) adhesively bonds surface mount integrated circuit packages (14) to a printed circuit board (10). The printed circuit board has conductive traces (12) and exposed conductive pads (13) on the surface. A film adhesive is strategically positioned on the printed circuit board near the conductive pads, and the surface mount integrated circuit package is then placed on the board so that the conductive pads (16) on the package align with the conductive pads on the board. The film adhesive softens when the package is soldered to the board, and the film ultimately serves as an underfill to increase the mechanical integrity of the solder joints.

Abstract: A method and apparatus are provided to aide in emergency egress of a structure. More particularly, egress indicators are co-located with hazard sensors. During detection of a hazard condition, locations of sensors detecting the hazard are identified and a pathway directing traffic away from the hazard is determined. Finally, the egress indicators are operated to direct traffic down the determined pathway.

Abstract: An alternating current (AC) powered self organizing wireless node (100, 400, 600) includes a self organizing wireless receiver-transmitter (115), an AC branch connection (105), an AC to direct current (DC) converter (110), a secondary power function (120), and a housing (150). The self organizing wireless receiver-transmitter can communicate information throughout a network of compatible self organizing nodes solely using radio transmission to and reception from nearby self-organizing nodes. The secondary power function can couple power to the AC to DC converter for powering the self organizing wireless receiver-transmitter when AC power is not provided. The AC powered self organizing wireless node is designed and fabricated for agency certification. The AC powered self organizing wireless node may include one or more sensors (125), sensor inputs (135), transducers (130), or control outputs (155).

Abstract: A self supported underfill film adhesively bonds surface mount integrated circuit packages to a printed circuit board. The printed circuit board has conductive traces and exposed conductive pads on the surface. Solder paste is printed on the conductive pads, and one or more additional solder paste deposits are printed in an area outside the conductive pads to serve as tack pads for a film adhesive. The film adhesive is strategically positioned on the printed circuit board over the tack pads and near the conductive pads, and the surface mount integrated circuit package is then placed on the board so that the conductive pads on the package align with the conductive pads on the board. The film adhesive softens when the package is soldered to the board, and the film ultimately serves as an underfill to increase the mechanical integrity of the solder joints.

Abstract: A self supported underfill film (18) adhesively bonds surface mount integrated circuit packages (14) to a printed circuit board (10). The printed circuit board has conductive traces (12) and exposed conductive pads (13) on the surface. A film adhesive is strategically positioned on the printed circuit board near the conductive pads, and the surface mount integrated circuit package is then placed on the board so that the conductive pads (16) on the package align with the conductive pads on the board. The film adhesive softens when the package is soldered to the board, and the film ultimately serves as an underfill to increase the mechanical integrity of the solder joints.