Abstract: Testing to detect intermittent electrical pathways is described. Applied currents may be reversed to fully test all components of a workpiece. Various testing methodologies may be employed. These methodologies may include Time Domain Reflectometry (TDR), mechanical agitation, dark current/voltage testing, (dark IV), i.e., electrical testing of a workpiece using applied electricity, and thermographic imaging, e.g., infra-red thermal imaging. The sensed voltage during agitation may be compared to a benchmark voltage to determine whether or not an intermittent failure exists.

Abstract: Testing to detect intermittent electrical pathways is described. Applied currents may be reversed to fully test all components of a workpiece. Various testing methodologies may be employed. These methodologies may include Time Domain Reflectometry (TDR), mechanical agitation, dark current/voltage testing, (dark IV), i.e., electrical testing of a workpiece using applied electricity, and thermographic imaging, e.g., infra-red thermal imaging. The sensed voltage during agitation may be compared to a benchmark voltage to determine whether or not an intermittent failure exists.

Abstract: Testing to detect intermittent electrical pathways is described. Applied currents may be reversed to fully test all components of a workpiece. Various testing methodologies may be employed. These methodologies may include Time Domain Reflectometry (TDR), mechanical agitation, dark current/voltage testing, (dark IV), i.e., electrical testing of a workpiece using applied electricity, and thermographic imaging, e.g., infra-red thermal imaging. The sensed voltage during agitation may be compared to a benchmark voltage to determine whether or not an intermittent failure exists.

Abstract: Cyclical testing of electrically conductive bonding (ECB) is provided. Cyclical testing comprises high current flows using multiples of max operating currents and monitoring sensors with periods of no current to accelerate testing of electrical connections employing ECBs.

Abstract: Cyclical testing of electrically conductive bonding (ECB) is provided. Cyclical testing comprises high current flows using multiples of max operating currents and monitoring sensors with periods of no current to accelerate testing of electrical connections employing ECBs.

Abstract: Testing to detect intermittent electrical pathways is described. Applied currents may be reversed to fully test all components of a workpiece. Various testing methodologies may be employed. These methodologies may include Time Domain Reflectometry (TDR), mechanical agitation, dark current/voltage testing, (dark IV), i.e., electrical testing of a workpiece using applied electricity, and thermographic imaging, e.g., infra-red thermal imaging. The sensed voltage during agitation may be compared to a benchmark voltage to determine whether or not an intermittent failure exists.

Abstract: Improved system and method of X-ray laser microscopy that combines information obtained from both X-ray diffraction and X-ray imaging methods. The sample is placed in an ultra-cold, ultra-low pressure vacuum chamber, and exposed to brief bursts of coherent X-ray illumination further concentrated using X-ray mirrors and pinhole collimation methods. Higher resolution data from a sample is obtained using hard X-ray lasers, such as free electron X-ray lasers, and X-ray diffraction methods. Lower resolution data from the same sample can be obtained using any of hard or soft X-ray laser sources, and X-ray imaging methods employing nanoscale etched zone plate technology. In some embodiments both diffraction and imaging data can be obtained simultaneously. Data from both sources are combined to create a more complete representation of the sample.

Abstract: Improved system and method of X-ray laser microscopy that combines information obtained from both X-ray diffraction and X-ray imaging methods. The sample is placed in an ultra-cold, ultra-low pressure vacuum chamber, and exposed to brief bursts of coherent X-ray illumination further concentrated using X-ray mirrors and pinhole collimation methods. Higher resolution data from a sample is obtained using hard X-ray lasers, such as free electron X-ray lasers, and X-ray diffraction methods. Lower resolution data from the same sample can be obtained using any of hard or soft X-ray laser sources, and X-ray imaging methods employing nanoscale etched zone plate technology. In some embodiments both diffraction and imaging data can be obtained simultaneously. Data from both sources are combined to create a more complete representation of the sample.