Patents by Inventor Kathiravan D

Kathiravan D has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230337406
    Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
    Type: Application
    Filed: December 23, 2020
    Publication date: October 19, 2023
    Inventors: Ritu BAWA, Ruander CARDENAS, Kathiravan D, Jia Yan GO, Chin Kung GOH, Jeff KU, Prakash Kurma RAJU, Baomin LIU, Twan Sing LOO, Mikko MAKINEN, Columbia MISHRA, Juha PAAVOLA, Prasanna PICHUMANI, Daniel RAGLAND, Kannan RAJA, Khai Ern SEE, Javed SHAIKH, Gokul SUBRAMANIAM, George Baoci SUN, Xiyong TIAN, Hua YANG, Mark CARBONE, Vivek PARANJAPE, Nehakausar PINJARI, Hari Shanker THAKUR, Christopher MOORE, Gustavo FRICKE, Justin HUTTULA, Gavin SUNG, Sammi WY LIU, Arnab SEN, Chun-Ting LIU, Jason Y. JIANG, Gerry JUAN, Shih Wei NIEN, Lance LIN, Evan KUKLINSKI
  • Patent number: 11573055
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: February 7, 2023
    Assignee: Intel Corporation
    Inventors: Juha Tapani Paavola, Mark Carbone, Vivek Paranjape, Prakash Kurma Raju, Mikko Antero Makinen, Christopher M. Moore, Gustavo Fricke, Kathiravan D, Ritu Bawa, Nehakausar Shaikh Ramjan Pinjari, Hari Shanker Thakur
  • Patent number: 11474568
    Abstract: A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: October 18, 2022
    Assignee: INTEL CORPORATION
    Inventors: Bijendra Singh, Prakash Kurma Raju, Prasanna Pichumani, Kathiravan D
  • Publication number: 20220225536
    Abstract: Synthetic jet systems and related methods are disclosed. An electronic device includes a heat spreader including a first surface and a second surface opposite the first surface. A synthetic jet is coupled to the first surface of the heat spreader. The synthetic jet and the heat spreader define a fluid flow passageway having an inlet, a first outlet and a second outlet. The synthetic jet and the heat spreader to bifurcate airflow from the inlet such that the first outlet is to exhaust airflow from the passageway adjacent the first surface of the heat spreader and the second outlet is to exhaust airflow from the passageway adjacent the second surface of the heat spreader.
    Type: Application
    Filed: April 1, 2022
    Publication date: July 14, 2022
    Inventors: Arunpandi R., Kathiravan D, Triplicane Gopikrishnan Babu, Doddi Raghavendra, Ritu Bawa, Bijendra Singh
  • Patent number: 11206748
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a hinge that rotatably couples the first housing to the second housing, and a flexible heat spreader that extends from the second housing, through the hinge, and to the first housing. The hinge can accommodate deformations in the flexible heat spreader when the first housing is rotated relative to the second housing.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Raghavendra Doddi, Ravishankar Srikanth, Kathiravan D, Prakash Kurma Raju
  • Publication number: 20210232184
    Abstract: A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.
    Type: Application
    Filed: April 12, 2021
    Publication date: July 29, 2021
    Inventors: Bijendra Singh, Prakash Kurma Raju, Prasanna Pichumani, Kathiravan D
  • Publication number: 20210112684
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 15, 2021
    Applicant: Intel Corporation
    Inventors: Penchala Pratap Binni Boyina, Kathiravan D, Babu Triplicane Gopikrishnan, Prakash Kurma Raju, Deepak Sekar, Hari Shanker Thakur
  • Patent number: 10976782
    Abstract: A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: April 13, 2021
    Assignee: Intel Corporation
    Inventors: Bijendra Singh, Prakash Kurma Raju, Prasanna Pichumani, Kathiravan D
  • Publication number: 20200132391
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.
    Type: Application
    Filed: December 27, 2019
    Publication date: April 30, 2020
    Applicant: Intel Corporation
    Inventors: Juha Tapani Paavola, Mark Carbone, Vivek Paranjape, Prakash Kurma Raju, Mikko Antero Makinen, Christopher M. Moore, Gustavo Fricke, Kathiravan D, Ritu Bawa, Nehakausar Shaikh Ramjan Pinjari, Hari Shanker Thakur
  • Publication number: 20200120832
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a hinge that rotatably couples the first housing to the second housing, and a flexible heat spreader that extends from the second housing, through the hinge, and to the first housing. The hinge can accommodate deformations in the flexible heat spreader when the first housing is rotated relative to the second housing.
    Type: Application
    Filed: December 13, 2019
    Publication date: April 16, 2020
    Applicant: Intel Corporation
    Inventors: Raghavendra Doddi, Ravishankar Srikanth, Kathiravan D, Prakash Kurma Raju
  • Publication number: 20190179377
    Abstract: A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.
    Type: Application
    Filed: February 13, 2019
    Publication date: June 13, 2019
    Inventors: Bijendra Singh, Prakash Kurma Raju, Prasanna Pichumani, Kathiravan D
  • Patent number: D933059
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: October 12, 2021
    Assignee: Intel Corporation
    Inventors: Babu Triplicane Gopikrishnan, Kathiravan D, Prakash Kurma Raju, Prasanna Pichumani