Patents by Inventor Kathirgamasundaram Sooriakumar
Kathirgamasundaram Sooriakumar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10488288Abstract: Aspects of the disclosure provide a capacitive pressure sensor. The sensor can include a first substrate having a first surface and a second surface, a movable plate at a bottom of a first cavity recessed into the substrate from the first surface, and a second substrate bonded to the first substrate over the first surface. The second substrate includes a fixed plate disposed over the movable plate to form a capacitor. A second cavity is formed between the movable plate and the second surface.Type: GrantFiled: February 22, 2017Date of Patent: November 26, 2019Inventors: Kathirgamasundaram Sooriakumar, Anu Austin, Ian Rose Bihag, Dieter Naegele-Preissmann
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Publication number: 20190261110Abstract: An acoustic apparatus includes an anchored diaphragm that is actuated by mechanical energy and a transduction material that is disposed in the anchored diaphragm that generates the mechanical energy that actuates the anchored diaphragm. The acoustic apparatus further includes an extendable diaphragm that is actuated when the anchored diaphragm is actuated and a plurality of damping holes that are disposed about the extendable diaphragm and that allow the extendable diaphragm to actuate in a vertical direction.Type: ApplicationFiled: May 2, 2019Publication date: August 22, 2019Inventors: Kathirgamasundaram SOORIAKUMAR, Anu AUSTIN, Ian Rose BIHAG
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Patent number: 10284987Abstract: An acoustic apparatus includes an anchored diaphragm that is actuated by mechanical energy and a transduction material that is disposed in the anchored diaphragm that generates the mechanical energy that actuates the anchored diaphragm. The acoustic apparatus further includes an extendable diaphragm that is actuated when the anchored diaphragm is actuated and a plurality of damping holes that are disposed about the extendable diaphragm and that allow the extendable diaphragm to actuate in a vertical direction.Type: GrantFiled: October 18, 2017Date of Patent: May 7, 2019Inventors: Kathirgamasundaram Sooriakumar, Anu Austin, Ian Rose Bihag
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Publication number: 20190055119Abstract: Aspects of the disclosure provide a packaging technique for making a directional microphone which employs mechanical structures to cancel undesired background noise to realize the directional function instead of an extra sensor required in electronic noise-cancelling techniques, thus reducing the footprint and cost of a directional microphone. A directional microphone based on this technique can include an acoustic sensor and a housing enclosing the acoustic sensor. The acoustic sensor can include a sensing diaphragm, a cavity below the sensing diaphragm, and a first substrate. The directional microphone device can further includes a channel with an inlet open at an edge of the first substrate and an outlet connected with the cavity. The housing can include a cover attached to a second substrate supporting the first substrate. The cover can include a first opening over the sensing diaphragm and a second opening at a side of the cover.Type: ApplicationFiled: August 22, 2018Publication date: February 21, 2019Inventors: Kathirgamasundaram SOORIAKUMAR, Anu AUSTIN, Ian Rose BIHAG
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Patent number: 10081537Abstract: Aspects of the disclosure provide a packaging technique for making a directional microphone which employs mechanical structures to cancel undesired background noise to realize the directional function instead of an extra sensor required in electronic noise-cancelling techniques, thus reducing footprint and cost of a directional microphone. A directional microphone based on this technique can include an acoustic sensor and a housing enclosing the acoustic sensor. The acoustic sensor can include a sensing diaphragm, a cavity below the sensing diaphragm, and a first substrate. The directional microphone device can further includes a channel with an inlet open at an edge of the first substrate and an outlet connected with the cavity. The housing can include a cover attached to a second substrate supporting the first substrate. The cover can include a first opening over the sensing diaphragm and a second opening at a side of the cover.Type: GrantFiled: November 17, 2016Date of Patent: September 25, 2018Inventors: Kathirgamasundaram Sooriakumar, Anu Austin, Ian Rose Bihag
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Publication number: 20180220247Abstract: An acoustic apparatus includes an anchored diaphragm that is actuated by mechanical energy and a transduction material that is disposed in the anchored diaphragm that generates the mechanical energy that actuates the anchored diaphragm. The acoustic apparatus further includes an extendable diaphragm that is actuated when the anchored diaphragm is actuated and a plurality of damping holes that are disposed about the extendable diaphragm and that allow the extendable diaphragm to actuate in a vertical direction.Type: ApplicationFiled: October 18, 2017Publication date: August 2, 2018Inventors: Kathirgamasundaram Sooriakumar, Anu Austin, Ian Rose Bihag
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Patent number: 9807532Abstract: An acoustic apparatus includes an anchored diaphragm that is actuated by mechanical energy and a transduction material that is disposed in the anchored diaphragm that generates the mechanical energy that actuates the anchored diaphragm. The acoustic apparatus further includes an extendable diaphragm that is actuated when the anchored diaphragm is actuated and a plurality of damping holes that are disposed about the extendable diaphragm and that allow the extendable diaphragm to actuate in a vertical direction.Type: GrantFiled: May 23, 2016Date of Patent: October 31, 2017Inventors: Kathirgamasundaram Sooriakumar, Anu Austin, Ian Rose Bihag
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Publication number: 20170241855Abstract: Aspects of the disclosure provide a capacitive pressure sensor. The capacitive pressure sensor can include a first substrate having a first surface and a second surface, a movable plate at a bottom of a first cavity recessed into the substrate from the first surface, and a second substrate bonded to the first substrate over the first surface. A second cavity is formed between the movable plate and the second surface. The second substrate includes a fixed plate disposed over the movable plate to form a capacitor. The second substrate further includes a third cavity between a surface of the fixed plate opposite to the movable plate and a surface of the second substrate opposite to the first substrate.Type: ApplicationFiled: February 22, 2017Publication date: August 24, 2017Inventors: Kathirgamasundaram SOORIAKUMAR, Anu AUSTIN, Ian Rose BIHAG, Dieter NAEGELE-PREISSMANN
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Publication number: 20170241854Abstract: Aspects of the disclosure provide a capacitive pressure sensor. The sensor can include a first substrate having a first surface and a second surface, a movable plate at a bottom of a first cavity recessed into the substrate from the first surface, and a second substrate bonded to the first substrate over the first surface. The second substrate includes a fixed plate disposed over the movable plate to form a capacitor. A second cavity is formed between the movable plate and the second surface.Type: ApplicationFiled: February 22, 2017Publication date: August 24, 2017Inventors: Kathirgamasundaram SOORIAKUMAR, Anu AUSTIN, Ian Rose BIHAG, Dieter NAEGELE-PREISSMANN
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Publication number: 20170142524Abstract: Aspects of the disclosure provide a packaging technique for making a directional microphone which employs mechanical structures to cancel undesired background noise to realize the directional function instead of an extra sensor required in electronic noise-cancelling techniques, thus reducing footprint and cost of a directional microphone. A directional microphone based on this technique can include an acoustic sensor and a housing enclosing the acoustic sensor. The acoustic sensor can include a sensing diaphragm, a cavity below the sensing diaphragm, and a first substrate. The directional microphone device can further includes a channel with an inlet open at an edge of the first substrate and an outlet connected with the cavity. The housing can include a cover attached to a second substrate supporting the first substrate. The cover can include a first opening over the sensing diaphragm and a second opening at a side of the cover.Type: ApplicationFiled: November 17, 2016Publication date: May 18, 2017Inventors: Kathirgamasundaram SOORIAKUMAR, Anu AUSTIN, Ian Rose BIHAG
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Publication number: 20170137282Abstract: Aspects of the disclosure provide a waterproof packaging technique for fabricating waterproof microphones in mobile devices. A device based on the waterproof packaging technique can include a microelectromechanical system (MEMS) device, a housing enclosing the MEMS device, and a liquid-resistant air inlet passive device (LRAPD) on the housing. The LRAPD can include at least one channel connecting an exterior of the housing with a chamber formed between the housing and the MEMS device. An inside surface of the channel can be coated with a liquid-repellant coating. In some examples, the liquid-repellant coating can be a self-assembled monolayer (SAM) coating.Type: ApplicationFiled: November 17, 2016Publication date: May 18, 2017Inventors: Kathirgamasundaram SOORIAKUMAR, Anu AUSTIN, Ian Rose BIHAG
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Publication number: 20160345105Abstract: An acoustic apparatus includes an anchored diaphragm that is actuated by mechanical energy and a transduction material that is disposed in the anchored diaphragm that generates the mechanical energy that actuates the anchored diaphragm. The acoustic apparatus further includes an extendable diaphragm that is actuated when the anchored diaphragm is actuated and a plurality of damping holes that are disposed about the extendable diaphragm and that allow the extendable diaphragm to actuate in a vertical direction.Type: ApplicationFiled: May 23, 2016Publication date: November 24, 2016Inventors: Kathirgamasundaram SOORIAKUMAR, Anu AUSTIN, Ian Rose BIHAG
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Patent number: 8569850Abstract: A sensor for acoustic applications such as a silicone microphone is provided containing a backplate provided with apertures and a flexible diaphragm formed from a silicon on insulator (SOI) wafer which includes a layer of heavily doped silicon, a layer of silicon and an intermediate oxide layer that is connected to, and insulated from the backplate. The arrangement of the diaphragm in relation to the rest of the sensor and the sensor location, being mounted over the aperture in a PCB, reduces the acoustic signal pathway which allows the sensor to be both thinner and more importantly, enables there to be a greater back volume.Type: GrantFiled: October 10, 2007Date of Patent: October 29, 2013Assignee: Sensfab Pte LtdInventors: Kitt-Wai Kok, Kok Meng Ong, Kathirgamasundaram Sooriakumar, Bryan Keith Patmon
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Publication number: 20100187646Abstract: A sensor including: a backplate of electrically conductive or semi-conductive material, the backplate including a plurality of backplate holes; a diaphragm of electrically conductive or semi-conductive material that is connected to, and insulated from the backplate, the diaphragm defining a flexible member and an air gap associated with the flexible member; a bond pad formed on an area of the backplate surrounding the cavity; and a bond pad formed on an area of the diaphragm surrounding the air gap; wherein the flexible member and air gap defined by the diaphragm extend beneath the plurality of backplate holes.Type: ApplicationFiled: October 10, 2007Publication date: July 29, 2010Applicant: Mems Technology BHDInventors: Kitt-Wai Kok, Kok Meng Ong, Kathirgamasundaram Sooriakumar, Bryan Keith Patmon
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Publication number: 20080185669Abstract: A silicon microphone includes a diaphragm that is able to flex over an aperture, an area allowing electrical connection to the diaphragm, a backplate parallel to and spaced apart from the diaphragm and extending over the aperture, the backplate being fixed, the backplate and diaphragm forming the parallel plates of a capacitor, the backplate and diaphragm being attached to and insulated from each other around at least a portion the boundary of the aperture, and a backplate support attached to the backplate around the boundary of the aperture, the backplate support not forming an electrical connection with the backplate.Type: ApplicationFiled: October 18, 2005Publication date: August 7, 2008Applicant: SENSFAB PTE, LTD.Inventors: Kitt-Wai Kok, Kok Meng Ong, Kathirgamasundaram Sooriakumar, Bryan Keith Patmon
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Publication number: 20080175417Abstract: A silicon microphone comprising a backplate of electrically conductive or semi-conductive material comprising a rigid aperture area and a surrounding area, a diaphragm of electrically conductive or semi-conductive material comprising a flexible member that extends over the aperture area and a surrounding area that is at least partially connected to, and insulated from, the surrounding area of the backplate, the aperture area of the backplate and flexible member of the diaphragm forming two parallel plates of a capacitor spaced apart by a cavity, a bond pad formed on the surrounding area of the diaphragm, a bond pad formed on the surrounding area of the backplate, a channel formed in the diaphragm surrounding the bond pad formed on the surrounding area of the backplate, at least one air channel formed in the surrounding area of the diaphragm and open into the cavity between the flexible member and the aperture area of the backplate, and at least one vent through the surrounding area of the diaphragm connectedType: ApplicationFiled: May 15, 2006Publication date: July 24, 2008Applicant: Sensfab Pte Ltd.Inventors: Kitt-Wai Kok, Kok Meng Ong, Kathirgamasundaram Sooriakumar, Bryan Keith Patmon
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Patent number: 7361523Abstract: The invention comprises a method of fabricating a three-axis accelerometer. A first wafer having a first and a second major surface provided with etching at least two cavities in the first major surface of the first wafer and patterning metal onto the first major surface of the first wafer to form electrical connections for a third accelerometer. A second wafer, etching a portion of a first major surface of the second wafer and bonding the first major surface of the first wafer to the first major surface of the second wafer. The etching and bonding of the surfaces deposit and pattern metallizating, and deposit and pattern a masking layer on the second major surface of the second wafer, defining the shape of a first, a second and the third accelerometer. The first and second accelerometers are formed over the cavities etched in the first major surface of the first wafer.Type: GrantFiled: August 11, 2004Date of Patent: April 22, 2008Assignee: Sensfab Pte LtdInventors: Kathirgamasundaram Sooriakumar, Kitt-Wai Kok, Bryan Keith Patmon
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Patent number: 7247248Abstract: The invention relates to a method for forming silicon atomic force microscope tips. The method includes the steps of depositing a masking layer onto a first layer of doped silicon so that some square or rectangular areas of the first layer of doped silicon are not covered by the masking layer, etching pyramidal apertures in the first layer of doped silicon, removing the masking layer, depositing a second layer of doped silicon onto the first layer of doped silicon, the second layer of doped silicon being oppositely doped to the first layer of doped silicon and etching away the first layer of doped silicon. Further steps may be added to form the atomic force microscope tips at the end of cantilevers.Type: GrantFiled: May 20, 2003Date of Patent: July 24, 2007Assignee: Sensfab Pte LtdInventors: Lay Har Angeline Tee, Kim Pong Daniel Chir, Kitt-Wai Kok, Kathirgamasundaram Sooriakumar, Bryan Keith Patmon
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Publication number: 20070065968Abstract: A silicon microphone is formed using the steps of providing a first wafer including a layer of heavily doped silicon, a layer of silicon and an intermediate layer of oxide between the two silicon layers. The first wafer has a first major surface on one surface of the layer of heavily doped silicon and a second major surface on the layer of silicon. A second wafer of silicon has a first major surface and a second major surface. A layer of oxide is formed on at least the first major surfaces of the first and second wafers. A cavity is etched through the oxide layer on the first major surface of the first wafer and into the layer of heavily doped silicon. The first major surface of the first wafer is bonded to the first major surface of the second wafer. A metal layer is formed on the second major surface of the second wafer. Acoustic holes are patterned and etched in the metal layer and in the second major surface of the second wafer.Type: ApplicationFiled: May 26, 2004Publication date: March 22, 2007Inventors: Kit-Wai Kok, Kok Ong, Kathirgamasundaram Sooriakumar, Bryan Patmon
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Publication number: 20070059857Abstract: The invention comprises a method of fabricating a three-axis accelerometer. A first wafer having a first and a second major surface provided with etching at least two cavities in the first major surface of the first wafer and patterning metal onto the first major surface of the first wafer to form electrical connections for a third accelerometer. A second wafer, etching a portion of a first major surface of the second wafer and bonding the first major surface of the first wafer to the first major surface of the second wafer. The etching and bonding of the surfaces deposit and pattern metallizating, and deposit and pattern a masking layer on the second major surface of the second wafer, defining the shape of a first, a second and the third accelerometer. The first and second accelerometers are formed over the cavities etched in the first major surface of the first wafer.Type: ApplicationFiled: August 11, 2004Publication date: March 15, 2007Inventors: Kathirgamasundaram Sooriakumar, Kitt-Wai Kok, Bryan Patmon