Abstract: A method and system for analyzing a project. Values may be assigned to each factor of a predetermined set of factors relating to a project. A score representing a likely outcome of the project may be determined using the values.

Abstract: A method and apparatus are provided for predicting the outcome of a project and, if needed, increasing its likelihood of success. Numerical values are assigned to a set of predetermined factors affecting the outcome of the project. The values are assigned based on a subjective evaluation of each factor with respect to the project. The factors include the duration of the project, the performance integrity of persons involved in implementing the project, the perceived commitment of senior management to the project, the local commitment to the project and the effort required to implement the project. A score is calculated based on the values assigned to the factors. The score is applied to empirical data on prior project outcomes and scores to determine the probability of success of the project. If desired, project changes can be implemented and new values assigned to one or more factors to improve the score and increase the probability of success of the project.

Abstract: Apparatus and methods are provided for constructing balanced semiconductor chip package structures that minimize bowing, in-plane strain and/or other thermally induced mechanical strains that may arise during thermal cycling, to thus prevent structural damage to chip package structures.