Patents by Inventor Kathleen O'Donnell
Kathleen O'Donnell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220361974Abstract: A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.Type: ApplicationFiled: July 18, 2022Publication date: November 17, 2022Applicant: President and Fellows of Harvard CollegeInventors: Joshua B. Gafford, Samuel B. Kesner, Conor J. Walsh, Michael Karpelson, Robert J. Wood, Zivthan Dubrovsky, Benjamin I. Goldberg, Kathleen O'Donnell, Michael J. Smith
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Patent number: 11419693Abstract: A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.Type: GrantFiled: July 30, 2019Date of Patent: August 23, 2022Assignee: President and Fellows of Harvard CollegeInventors: Joshua B. Gafford, Samuel B. Kesner, Conor J. Walsh, Michael Karpelson, Robert J. Wood, Zivthan Dubrovsky, Benjamin I. Goldberg, Kathleen O'Donnell, Michael J. Smith
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Publication number: 20200015920Abstract: A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.Type: ApplicationFiled: July 30, 2019Publication date: January 16, 2020Applicant: President and Fellows of Harvard CollegeInventors: Joshua B. Gafford, Samuel B. Kesner, Conor J. Walsh, Michael Karpelson, Robert J. Wood, Zivthan Dubrovsky, Benjamin I. Goldberg, Kathleen O'Donnell, Michael J. Smith
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Patent number: 10376326Abstract: A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.Type: GrantFiled: August 4, 2014Date of Patent: August 13, 2019Assignee: President and Fellows of Harvard CollegeInventors: Joshua B. Gafford, Samuel B. Kesner, Conor J. Walsh, Michael Karpelson, Robert J. Wood, Zivthan Dubrovsky, Benjamin I. Goldberg, Kathleen O'Donnell, Michael J. Smith
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Patent number: 10086516Abstract: In a method for interactive marking by a mobile robot on a vertical surface, a mobile robot that includes a sensor and an actuated marker is displaced across a vertical surface. Features on, in or behind the vertical surface are detected with the sensor. Displacement of the mobile robot and actuation of the actuated marker is controlled in response to the detection of these features.Type: GrantFiled: September 30, 2016Date of Patent: October 2, 2018Assignee: President and Fellows of Harvard CollegeInventors: Zivthan A. Dubrovsky, Raphael G. Cherney, Michael Mogenson, Justin Werfel, Kathleen O'Donnell, Radhika Nagpal, Nils Napp, Hani M. Sallum, Julian U. da Silva Gillig
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Publication number: 20170036349Abstract: In a method for interactive marking by a mobile robot on a vertical surface, a mobile robot that includes a sensor and an actuated marker is displaced across a vertical surface. Features on, in or behind the vertical surface are detected with the sensor. Displacement of the mobile robot and actuation of the actuated marker is controlled in response to the detection of these features.Type: ApplicationFiled: September 30, 2016Publication date: February 9, 2017Applicant: President and Fellows of Harvard CollegeInventors: Zivthan A. Dubrovsky, Raphael G. Cherney, Michael Mogenson, Justin Werfel, Kathleen O'Donnell, Radhika Nagpal, Nils Napp, Hani M. Sallum, Julian U. da Silva Gillig
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Patent number: 9533878Abstract: Various low stress compact device packages are disclosed herein. An integrated device package can include a first integrated device die and a second integrated device die. An interposer can be disposed between the first integrated device die and the second integrated device die such that the first integrated device die is mounted to and electrically coupled to a first side of the interposer and the second integrated device die is mounted to and electrically coupled to a second side of the interposer. The first side can be opposite the second side. The interposer can comprise a hole through at least the second side of the interposer. A portion of the second integrated device die can extend into the hole.Type: GrantFiled: December 11, 2014Date of Patent: January 3, 2017Assignee: ANALOG DEVICES, INC.Inventors: Thomas M. Goida, Kathleen O'Donnell, Michael Delaus
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Publication number: 20160184041Abstract: A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.Type: ApplicationFiled: August 4, 2014Publication date: June 30, 2016Applicant: President and Fellows of Harvard CollegeInventors: Joshua B. Gafford, Samuel B. Kesner, Conor J. Walsh, Michael Karpelson, Robert J. Wood, Zivthan Dubrovsky, Benjamin I. Goldberg, Kathleen O'Donnell, Michael J. Smith
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Publication number: 20160167951Abstract: Various low stress compact device packages are disclosed herein. An integrated device package can include a first integrated device die and a second integrated device die. An interposer can be disposed between the first integrated device die and the second integrated device die such that the first integrated device die is mounted to and electrically coupled to a first side of the interposer and the second integrated device die is mounted to and electrically coupled to a second side of the interposer. The first side can be opposite the second side. The interposer can comprise a hole through at least the second side of the interposer. A portion of the second integrated device die can extend into the hole.Type: ApplicationFiled: December 11, 2014Publication date: June 16, 2016Inventors: Thomas M. Goida, Kathleen O'Donnell, Michael Delaus
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Patent number: 8842859Abstract: A packaged microphone has a base with a top face, a lid coupled to the base and forming an interior, and a MEMS microphone (i.e., a die or chip) secured to the top face of the base within the interior. The packaged microphone also includes a circuit chip secured to the top face of the base within the interior. The circuit chip has a top surface with a top pad, a bottom surface with a bottom pad, and a via. The bottom pad is electrically connected to the base, and the via electrically connects the top pad with the bottom pad. A wire bond is connected between the MEMS microphone and the top pad on the circuit chip. The MEMS microphone is electrically connected to the bottom pad and the base through the via.Type: GrantFiled: January 24, 2012Date of Patent: September 23, 2014Assignee: Invensense, Inc.Inventors: Michael D. Delaus, Kathleen O'Donnell
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Publication number: 20120189144Abstract: A packaged microphone has a base with a top face, a lid coupled to the base and forming an interior, and a MEMS microphone (i.e., a die or chip) secured to the top face of the base within the interior. The packaged microphone also includes a circuit chip secured to the top face of the base within the interior. The circuit chip has a top surface with a top pad, a bottom surface with a bottom pad, and a via. The bottom pad is electrically connected to the base, and the via electrically connects the top pad with the bottom pad. A wire bond is connected between the MEMS microphone and the top pad on the circuit chip. The MEMS microphone is electrically connected to the bottom pad and the base through the via.Type: ApplicationFiled: January 24, 2012Publication date: July 26, 2012Applicant: ANALOG DEVICES, INC.Inventors: Michael D. Delaus, Kathleen O'Donnell