Patents by Inventor Kathleen O. O'Donnell

Kathleen O. O'Donnell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stress isolation features for stacked dies
    Patent number: 10287161
    Abstract: An integrated device package is disclosed. The package can include a carrier, such as first integrated device die, and a second integrated device die stacked on the first integrated device die. The package can include a buffer layer which coats at least a portion of an exterior surface of the first integrated device die and which is disposed between the second integrated device die and the first integrated device die. The buffer layer can comprise a pattern to reduce transmission of stresses between the first integrated device die and the second integrated device die.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: May 14, 2019
    Assignee: ANALOG DEVICES, INC.
    Inventors: Xiaojie Xue, Michael J. Zylinski, Thomas M. Goida, Kathleen O. O'Donnell
  • STRESS ISOLATION FEATURES FOR STACKED DIES
    Publication number: 20170022051
    Abstract: An integrated device package is disclosed. The package can include a carrier, such as first integrated device die, and a second integrated device die stacked on the first integrated device die. The package can include a buffer layer which coats at least a portion of an exterior surface of the first integrated device die and which is disposed between the second integrated device die and the first integrated device die. The buffer layer can comprise a pattern to reduce transmission of stresses between the first integrated device die and the second integrated device die.
    Type: Application
    Filed: April 6, 2016
    Publication date: January 26, 2017
    Inventors: Xiaojie Xue, Michael J. Zylinski, Thomas M. Goida, Kathleen O. O'Donnell