Abstract: A curable composition comprising 20 wt. % to 60 wt. %, optionally 30 wt. % to 58 wt. %, or optionally 40 wt. % to 55 wt. % of an acrylic block copolymer, 5 wt. % to 60 wt. %, optionally 20 wt. % to 50 wt. %, or optionally 15 wt. % to 45 wt. %, of an epoxy resin; 1 wt. % to 60 wt. %, optionally 5 wt. % to 50 wt. %, or optionally 15 wt. % to 45 wt. %, of a polyol; and 0.5 wt. % to 10 wt. %, optionally 0.75 wt. % to 8 wt. %, or optionally 1 wt. % to 5 wt. %, of a curing agent. The curable composition may be used to prepare a tape that is initially soft (i.e., low-modulus), which enables a water-tight seal during an electronics assembly process at ambient temperatures, and then cures after UV-activation into a more rigid (i.e., higher modulus) tape that has a desirable balance of impact resistance (both tensile and shear impact), dynamic shear resistance, and pushout resistance.