Patents by Inventor Kathlene Nicole Reeve

Kathlene Nicole Reeve has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder
    Patent number: 10625378
    Abstract: A solder alloy includes Sn, optional Ag, Cu, and Al wherein the solder alloy composition together with the solder alloy superheat temperature and rapid cooling rate from the superheat temperature are controlled to provide a dispersion of fine hard Cu—Al intermetallic particles in an as-solidified solder alloy microstructure wherein the particles are retained even after multiple solder reflow cycles often used in modern electronic assembly procedures to provide a particle strengthening to the solder joint microstructure as well as exert a grain refining effect on the solder joint microstructure, providing a strong, impact- and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: April 21, 2020
    Assignee: Iowa State University Research Foundation, Inc.
    Inventors: Iver E. Anderson, Kathlene Nicole Reeve