Patents by Inventor Kathrin Salwiczek

Kathrin Salwiczek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240084086
    Abstract: A polymeric blend contains a polyether block amide and a thermoplastic polymer, where the polyether block amide is based on a subunit 1 and a subunit 2. Subunit 1 is composed of at least one linear aliphatic diamine containing 5 to 15 carbon atoms and at least one linear aliphatic dicarboxylic acid containing 6 to 16 carbon atoms. Subunit 2 is composed of at least one polyether diol containing at least 3 carbon atoms per ether oxygen and primary OH groups at the chain ends. The sum total of the carbon atoms from diamine and dicarboxylic acid is an odd number and is 19 or 21 carbon atoms. The number-average molar mass of the subunit 2 is 200 to 900 g/mol. The thermoplastic polymer is selected from an ethylene/vinylene acetate, a thermoplastic polyester elastomer, a polyolefin elastomer, thermoplastic polyurethane, or any mixture thereof.
    Type: Application
    Filed: December 23, 2021
    Publication date: March 14, 2024
    Applicant: Evonik Operations GmbH
    Inventors: Chenyu Ye, Kathrin Salwiczek, Dominik Vogel, Beiyuan Zhu, Michael Gerhard Hagemann
  • Publication number: 20230037314
    Abstract: A moulding composition contains a) 75 wt. % to 98.5 wt. % of a polyether block amide, based on a total weight of the moulding composition. The polyether block amide contains a subunit 1, composed of at least one lactam or ?,?-aminocarboxylic acid having 6 to 14 carbon atoms, and a subunit 2, composed of at least one amino- or hydroxy-terminated polyether having at least two carbon atoms per ether oxygen and at least two primary amino or at least two hydroxy groups at the chain ends. The moulding composition also contains b) 1.5 wt. % to 25 wt. % of at least one polyalkenamer, based on a total weight of the moulding composition. The at least one polyalkenamer contains at least one cycloalkene having 5 to 12 carbon atoms. A moulded article can be produced from the moulding composition, which can be a moulding, a film, a bristle, a fibre or a foam.
    Type: Application
    Filed: December 19, 2019
    Publication date: February 9, 2023
    Applicant: Evonik Operations GmbH
    Inventors: Chenyu Ye, Kathrin Salwiczek, Urs Welz-Biermann, Klaus Hülsmann, Peter Hannen, He Zhang
  • Publication number: 20220363899
    Abstract: A moulding composition contains polyetheramide (PEA) based on a subunit 1, made of at least one linear aliphatic diamine having 15 C atoms and at least one linear aliphatic or aromatic dicarboxylic acid having 6 to 14 C atoms. Furthermore, the PEA also contains a subunit 2, made of at least one polyether diamine having at least 2.3 C-5 atoms per ether oxygen and NH2 groups at the chain ends. The moulding composition contains a maximum of 2.5% by weight of a rubber containing functional groups. The number of C atoms of at least one component of subunit 1 selected from diamine and dicarboxylic acid is at least 13, and the average molar mass number of subunit 2 is between 200 to 900 g/mol. A moulded object can be created from the moulding compound. The object can be a moulded part, a film, a bristle, a fiber, or a foam.
    Type: Application
    Filed: September 30, 2020
    Publication date: November 17, 2022
    Applicant: Evonik Operations GmbH
    Inventors: Franz-Erich BAUMANN, Kathrin Salwiczek
  • Publication number: 20220363901
    Abstract: A mixture contains at least one polyether block amide (PEBA) and at least one poly(meth)acrylate, selected from poly(meth)acrylimides, poly-alkyl(meth)acrylates, and mixtures thereof. The mass ratio of PEBA to poly(meth)acrylate is 95:5 to 60:40. The polyalkyl(meth)acrylate contains 80% by weight to 99% by weight of methyl methacrylate (MMA) units and 1% by weight to 20% by weight of C1-C10-alkyl acrylate units, based on the total weight of polyalkyl(meth)acrylate. The mixture can be processed to give foamed mouldings. The mouldings can he used in footwear soles, stud material, insulation or insulating material, damping components, lightweight components, or in a sandwich structure.
    Type: Application
    Filed: October 16, 2019
    Publication date: November 17, 2022
    Applicants: Röhm GmbH, Evonik Operations GmbH
    Inventors: Kathrin Salwiczek, Alexander Richter, Christine Weiß, Wolfgang Luley, Andreas Weber, Lukas Friedrich Dössel, David Bailey, Ralf Richter, Steffen Krill, Johannes Vorholz, Maren Kuhn
  • Publication number: 20220195145
    Abstract: A polyamide composition contains a) 88.5-98 wt. % of at least one aliphatic polyamide, wherein at least one monomer unit has 10 to 14 carbon atoms, and wherein the aliphatic polyamide is semi-crystalline; and b) 2-11.5 wt. % of an S glass fiber. The weight percentages of a) and b) are based on a total weight of the polyamide composition. The polyamide composition contains neither a polyolefinic impact modifier nor a core-shell modifier. A moulding material containing the polyamide composition is useful, and a moulded article can be produced from the moulding material. A shoe outsole containing the polyamide composition is also useful.
    Type: Application
    Filed: May 9, 2020
    Publication date: June 23, 2022
    Applicants: Evonik Operations GmbH, Evonik Specialty Chemicals (Shanghai) Co., Ltd.
    Inventors: Kathrin Salwiczek, Chenyu Ye, Urs Welz-Biermann, Klaus Hülsmann, Fei Teng, Zhisheng Wang, Juan Guo
  • Publication number: 20220025118
    Abstract: A molding compound contains polyether block amide (PEBA) based on a subunit 1 made of at least one linear aliphatic diamine having 5 to 15 C atoms and at least one linear aliphatic or aromatic dicarboxylic acid having 6 to 16 C atoms. The PEBA also contains a subunit 2 made of at least one polyether diol having at least 3 C atoms per ether oxygen and primary OH groups at the chain ends. The sum of the C atoms of diamine and dicarboxylic acid is odd and is 19 or 21, and the number-average molar mass of the subunit 2 is 200 to 900 g/mol. A molded object can be created from the molding compound, which can be a molded part, a film, a bristle, a fiber, or a foam.
    Type: Application
    Filed: October 9, 2019
    Publication date: January 27, 2022
    Applicant: Evonik Operations GmbH
    Inventors: Franz-Erich Baumann, Kathrin Salwiczek, Alexander Richter
  • Publication number: 20210371651
    Abstract: A mixture contains at least one amino-regulated polyether block amide (PEBA) and at least one poly(meth)acrylate selected from poly(meth)acrylimides, polyalkyl(meth)acrylates, and mixtures thereof. The mass ratio of PEBA to poly(meth)acrylate is 95:5 to 60:40. The polyalkyl(meth)acrylate contains 80% by weight to 99% by weight of methyl methacrylate (MMA) units and 1% by weight to 20% by weight of C1-C10-alkyl acrylate units, based on the total weight of polyalkyl(meth)acrylate. The mixture can be processed to give foamed mouldings. The mouldings can be used in footwear soles, stud material, insulation or insulating material, damping components, lightweight components, or in a sandwich structure.
    Type: Application
    Filed: October 11, 2019
    Publication date: December 2, 2021
    Applicants: Evonik Operations GmbH, Röhm GmbH
    Inventors: Kathrin Salwiczek, Alexander Richter, Christine Weiß, Wolfgang Luley, Andreas Weber, Lukas Friedrich Dössel, David Bailey, Ralf Richter, Steffen Krill, Johannes Vorholz, Maren Kuhn
  • Patent number: 10941293
    Abstract: A polymer composition includes a linear aliphatic polyamide having on average 10 to 14 carbon atoms in the monomer units, an S glass fibre, and a polyolefinic impact modifier. The polymer composition can achieve higher stiffness and impact strength without impairing the ductility. The polymer composition can be used as a moulding material.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: March 9, 2021
    Assignees: Evonik Operations GmbH, Evonik Specialty Chemicals (Shanghai) Co., Ltd.
    Inventors: Jianmin Yang, Urs Welz-Biermann, Klaus Hülsmann, Fei Teng, Juan Guo, Chenyu Ye, Zhisheng Wang, Kathrin Salwiczek
  • Patent number: 10844222
    Abstract: A polymer composite includes a linear aliphatic semi-crystalline polyamide having on average 10 to 14 carbon atoms in the monomer units, or the compound thereof, an S glass fiber, and a core-shell impact modifier. The polymer composite can achieve higher stiffness and impact strength without impairing the transparency significantly. The polymer composite can be used as molding material.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: November 24, 2020
    Assignees: Evonik Operations GmbH, Evonik Specialty Chemicals (Shanghai) Co., Ltd.
    Inventors: Jianmin Yang, Urs Welz-Biermann, Klaus Hülsmann, Fei Teng, Juan Guo, Chenyu Ye, Zhisheng Wang, Kathrin Salwiczek
  • Publication number: 20200299508
    Abstract: A polymer composition includes a linear aliphatic polyamide having on average 10 to 14 carbon atoms in the monomer units, an S glass fibre, and a polyolefinic impact modifier. The polymer composition can achieve higher stiffness and impact strength without impairing the ductility. The polymer composition can be used as a moulding material.
    Type: Application
    Filed: November 14, 2017
    Publication date: September 24, 2020
    Applicants: Evonik Operations GmbH, Evonik Specialty Chemicals (Shanghai) Co., Ltd.
    Inventors: Jianmin Yang, Urs Welz-Biermann, Klaus Hülsmann, Fei Teng, Juan Guo, Chenyu Ye, Zhisheng Wang, Kathrin Salwiczek
  • Publication number: 20190153221
    Abstract: A polymer composite includes a linear aliphatic semi-crystalline polyamide having on average 10 to 14 carbon atoms in the monomer units, or the compound thereof, an S glass fiber, and a core-shell impact modifier. The polymer composite can achieve higher stiffness and impact strength without impairing the transparency significantly. The polymer composite can be used as molding material.
    Type: Application
    Filed: November 21, 2018
    Publication date: May 23, 2019
    Applicants: Evonik Degussa GmbH, Evonik Specialty Chemicals (Shanghai) Co., Ltd.
    Inventors: Jianmin YANG, Urs WELZ-BIERMANN, Klaus HUELSMANN, Fei TENG, Juan GUO, Chenyu YE, Zhisheng WANG, Kathrin SALWICZEK
  • Patent number: 9334356
    Abstract: The invention relates to a molding compound, comprising the following components: a) 60 to 96% by weight polyaryletherketone, b) 2 to 25% by weight hexagonal bornite, and c) 2 to 25% by weight talcum, wherein the sum of the parts by weight of components a), b), and c) is 100. Said compounds can be used to produce a film having a thickness of 5 to 1200 ?m, which is suitable for producing dimensionally stable circuit boards.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: May 10, 2016
    Assignee: Evonik Degussa GmbH
    Inventors: Joerg Blaschke, Kirsten Luetzeler, Walter Zink, Ricardo Luiz Willemann, Kathrin Salwiczek, Georg Schaefer
  • Patent number: 8450399
    Abstract: The invention relates to a polymer composition which is characterized in that it comprises a mixture (A) consisting of formula (A1) and/or formula (A2), phenolic resin (B) and a stabilizer (C) in the form of a HALS compound.
    Type: Grant
    Filed: April 2, 2009
    Date of Patent: May 28, 2013
    Assignee: Evonik Degussa GmbH
    Inventors: Marianne Omeis, Kathrin Salwiczek, Elke Fiebig-Bauer
  • Publication number: 20120196113
    Abstract: The invention relates to a molding compound, comprising the following components: a) 60 to 96% by weight polyaryletherketone, b) 2 to 25% by weight hexagonal bornite, and c) 2 to 25% by weight talcum, wherein the sum of the parts by weight of components a), b), and c) is 100. Said compounds can be used to produce a film having a thickness of 5 to 1200 ?m, which is suitable for producing dimensionally stable circuit boards.
    Type: Application
    Filed: October 19, 2010
    Publication date: August 2, 2012
    Applicant: Evonik Degussa GmbH
    Inventors: Joerg Blaschke, Kirsten Luetzeler, Walter Zink, Ricardo Luiz Willemann, Kathrin Salwiczek, Georg Schaefer
  • Publication number: 20110152411
    Abstract: The invention relates to a polymer composition which is characterized in that it comprises a mixture (A) consisting of formula (A1)) and/or formula (A2), phenolic resin (B) and a stabilizer (C) in the form of a HALS compound
    Type: Application
    Filed: April 2, 2009
    Publication date: June 23, 2011
    Applicant: Evonik Degussa GmbH
    Inventors: Marianne Omeis, Frank Bauer, Elke Fiebig-Bauer, Kathrin Salwiczek