Patents by Inventor Kathryn Ann Schuck

Kathryn Ann Schuck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for electroplating a MEMS device
    Patent number: 11230783
    Abstract: In described examples, a method for electroplating a semiconductor device includes: forming a metal foil; forming an inert anode support; attaching the metal foil to the inert anode support to form an anode; forming a cathode using a semiconductor substrate; immersing the anode and the cathode within an electrolyte solution; forming a circuit with a current source, the anode and the cathode; generating a current through the circuit; and electroplating a metal from the electrolyte solution onto the semiconductor substrate.
    Type: Grant
    Filed: June 1, 2020
    Date of Patent: January 25, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Donald Charles Abbott, Kathryn Ann Schuck
  • METHOD AND SYSTEM FOR ELECTTROPLATING A MEMS DEVICE
    Publication number: 20200291539
    Abstract: In described examples, a method for electroplating a semiconductor device includes: forming a metal foil; forming an inert anode support; attaching the metal foil to the inert anode support to form an anode; forming a cathode using a semiconductor substrate; immersing the anode and the cathode within an electrolyte solution; forming a circuit with a current source, the anode and the cathode; generating a current through the circuit; and electroplating a metal from the electrolyte solution onto the semiconductor substrate.
    Type: Application
    Filed: June 1, 2020
    Publication date: September 17, 2020
    Inventors: Donald Charles Abbott, Kathryn Ann Schuck
  • Method and system for electroplating a MEMS device
    Patent number: 10704156
    Abstract: In described examples, a method for electroplating a semiconductor device includes: forming a metal foil; forming an inert anode support; attaching the metal foil to the inert anode support to form an anode; forming a cathode using a semiconductor substrate; immersing the anode and the cathode within an electrolyte solution; forming a circuit with a current source, the anode and the cathode; generating a current through the circuit; and electroplating a metal from the electrolyte solution onto the semiconductor substrate.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: July 7, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Donald Charles Abbott, Kathryn Ann Schuck
  • METHOD AND SYSTEM FOR ELECTROPLATING A MEMS DEVICE
    Publication number: 20170175283
    Abstract: In described examples, a method for electroplating a semiconductor device includes: forming a metal foil; forming an inert anode support; attaching the metal foil to the inert anode support to form an anode; forming a cathode using a semiconductor substrate; immersing the anode and the cathode within an electrolyte solution; forming a circuit with a current source, the anode and the cathode; generating a current through the circuit; and electroplating a metal from the electrolyte solution onto the semiconductor substrate.
    Type: Application
    Filed: December 19, 2016
    Publication date: June 22, 2017
    Inventors: Donald Charles Abbott, Kathryn Ann Schuck