Patents by Inventor Katja Engelkemeier

Katja Engelkemeier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240071853
    Abstract: A power semiconductor module includes a power semiconductor die arranged on a power substrate, a housing enclosing the power semiconductor die and the power substrate, wherein an interior volume formed by the housing is divided by interior walls into at least a first compartment and a second compartment, wherein the power semiconductor die is arranged within the first compartment, a first encapsulation material encapsulating the power semiconductor die and at least partially filling the first compartment, and a second encapsulation material different from the first encapsulation material, the second encapsulation material encapsulating the first encapsulation material and at least partially filling the second compartment, wherein the first encapsulation material is arranged within the first compartment but not within the second compartment.
    Type: Application
    Filed: April 27, 2023
    Publication date: February 29, 2024
    Inventors: Hans Hartung, Martin Goldammer, Carsten Ehlers, Katja Engelkemeier, Guido Bönig