Patents by Inventor Katja STENGER

Katja STENGER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170260427
    Abstract: An electrically conductive composition containing: (A) 2 to 35 vol.-% electrically conductive particles having an average particle size in the range of 1 to 25 ?m and exhibiting an aspect ratio in the range of 5 to 30:1, (B) 10 to 70 vol.-% non-metallic particles having an average particle size in the range of 1 to 25 ?m, exhibiting an aspect ratio in the range of 1 to 3:1, (C) 30 to 80 vol.-% of a curable resin system, and (D) 0 to 10 vol.-% of at least one additive, in which the sum of the vol.-% of particles (A) and (B) totals 25 to 65 vol.-%.
    Type: Application
    Filed: June 29, 2015
    Publication date: September 14, 2017
    Inventors: Tanja DICKEL, Sebastian FRITZSCHE, Daniel HANSELMANN, Katja STENGER
  • Publication number: 20100055828
    Abstract: For production of an electrically conductive or thermally conductive connection for contacting two elements, an elemental metal, in particular silver, is formed from a metal compound, in particular a silver compound, between the contact surfaces. In this production, the processing temperature for the use of a silver solder can be decreased below 240° C. and the processing pressure can be reduced to normal pressure. A contacting paste for this purpose contains a metal compound, in particular a silver compound, which decomposes below 400° C. while forming elemental silver. As a result, a metal is generated in situ from a chemical compound for producing a contact, which is usable above the temperature necessary for its production.
    Type: Application
    Filed: November 10, 2009
    Publication date: March 4, 2010
    Applicant: W.C. HERAEUS GMBH
    Inventors: Wolfgang SCHMITT, Tanja DICKEL, Katja STENGER
  • Publication number: 20090134206
    Abstract: For production of an electrically conductive or thermally conductive connection for contacting two elements, an elemental metal, in particular silver, is formed from a metal compound, in particular a silver compound, between the contact surfaces. In this production, the processing temperature for the use of a silver solder can be decreased below 240° C. and the processing pressure can be reduced to normal pressure. A contacting paste for this purpose contains a metal compound, in particular a silver compound, which decomposes below 400° C. while forming elemental silver. As a result, a metal is generated in situ from a chemical compound for producing a contact, which is usable above the temperature necessary for its production.
    Type: Application
    Filed: September 25, 2008
    Publication date: May 28, 2009
    Applicant: W. C. Heraeus GmbH
    Inventors: Wolfgang SCHMITT, Tanja DICKEL, Katja STENGER