Abstract: An probe body comprising: one or more light sources; one or more light sensors; an x-ray detector configured to detect, using at least one of the one or more light sensors, light from a scintillator for converting extra-orally applied x-rays to light; and a lower energy light detector configured to detect, using at least one of the one or more light sensors, light from an object illuminated by at least one of the one or more light sources.

Abstract: An apparatus, method and system wherein the apparatus comprises: a pump comprising an attachment portion configured to enable the pump to be attached to a user's skin, wherein the pump is configured to draw analytes from the user's body into the apparatus by reducing pressure on the user's skin in an area covered by the pump; at least one detector configured to detect one or more analytes or combinations of analytes which are drawn into the apparatus; the apparatus being arranged to be coupled to a controller to enable the pressure on the user's skin to be adjusted.

Abstract: An probe body comprising: one or more light sources; one or more light sensors; an x-ray detector configured to detect, using at least one of the one or more light sensors, light from a scintillator for converting extra-orally applied x-rays to light; and a lower energy light detector configured to detect, using at least one of the one or more light sensors, light from an object illuminated by at least one of the one or more light sources.

Abstract: An apparatus for receiving electromagnetically induced current, the apparatus comprising an antenna element for receiving electromagnetically induced current in a first apparatus operating mode, and also for near field communication in a second apparatus operating mode, wherein the apparatus comprises circuitry for switching the apparatus from the second apparatus operating mode to the first apparatus operating mode based on near field communication signalling received via the antenna element in the second apparatus operating mode.

Abstract: A filter device and a method for fabricating filter devices can package filters, especially acoustic wave filters, by bonding a carrier (substrate) wafer carrying manufactured filters to another wafer referred to as a capping wafer. A capping wafer/substrate eliminates the need for a conventional package to protect the sensitive filters, which reduces both product size and product costs significantly. Even though additional packaging is possible (i.e. in plastic molded packages, or in glob-top packages), it is not required for the reliability of the filters.

Abstract: A filter device and a method for fabricating filter devices can package filters, especially acoustic wave filters, by bonding a carrier (substrate) wafer carrying manufactured filters to another wafer referred to as a capping wafer. A capping wafer/substrate eliminates the need for a conventional package to protect the sensitive filters, which reduces both product size and product costs significantly. Even though additional packaging is possible (i.e. in plastic molded packages, or in glob-top packages), it is not required for the reliability of the filters.