Abstract: The present invention relates to the use of water soluble and air stable phosphaadamantanes as stabilizers in electrolytes for electroless metal deposition. An electrolyte, as well as a method for the electroless deposition of metals is disclosed. The plated metal layers can comprise nickel, copper, cobalt, boron, silver, palladium or gold, as well as alloys comprising at least one of the aforementioned metals as an alloying metal. The present invention further relates to an organic stabilizer for electroless plating processes, and an electrolyte for the electroless deposition of a metal layer on a substrate, comprising a metal ion source for the metal to be deposited, a reducing agent, a complexing agent, a stabilizer and preferably an accelerator. A method for the electroless deposition of a metal layer on a surface from an electrolyte according to the invention is also disclosed.