Abstract: Workpiece storage device having at least one sensor; a control device; and pick-up device with receptacles individually adapted to shapes of workpieces to be received in the receptacles. The at least one sensor is configured to acquire sensor data to determine the presence and/or location of workpieces in the receptacles, and to transmit the sensor data to the control device. The control device is configured to receive the sensor data of the sensor and to feed the received sensor data as input values to at least one machine learning model, and the machine learning model is trained to calculate at least one binary output value from the input values. The at least one binary output value is indicative of whether a statement about a loading state of the pick-up device is applicable, and the control device is configured to generate a signal including the at least one binary output value.

Abstract: Workpiece storage device having at least one sensor; a control device; and pick-up device with receptacles individually adapted to shapes of workpieces to be received in the receptacles. The at least one sensor is configured to acquire sensor data to determine the presence and/or location of workpieces in the receptacles, and to transmit the sensor data to the control device. The control device is configured to receive the sensor data of the sensor and to feed the received sensor data as input values to at least one machine learning model, and the machine learning model is trained to calculate at least one binary output value from the input values. The at least one binary output value is indicative of whether a statement about a loading state of the pick-up device is applicable, and the control device is configured to generate a signal including the at least one binary output value.

Abstract: A method for assessing the quality of a multi-channel micro- and/or subwavelength-optical projection unit is disclosed. The method comprises the following steps: At least a predefined portion of the optical projection unit is illuminated so that an image is generated by at least two channels of the predefined portion of the multi-channel optical projection unit. At least one characteristic quantity is determined based on the analysis of the image, wherein a value of the characteristic quantity is associated with a characteristic feature of the projection unit, a defect of the projection unit and/or a defect class of the projection unit. The quality of the projection unit is assessed based on the at least one characteristic quantity. Moreover, a test system for assessing the quality of a multi-channel micro- and/or subwavelength-optical projection unit and a computer program are disclosed.

Abstract: A method for assessing the quality of a multi-channel micro- and/or subwavelength-optical projection unit is disclosed. The method comprises the following steps: At least a predefined portion of the optical projection unit is illuminated so that an image is generated by at least two channels of the predefined portion of the multi-channel optical projection unit. At least one characteristic quantity is determined based on the analysis of the image, wherein a value of the characteristic quantity is associated with a characteristic feature of the projection unit, a defect of the projection unit and/or a defect class of the projection unit. The quality of the projection unit is assessed based on the at least one characteristic quantity.

Abstract: A method for aligning a first substrate, in particular a mask, with a second substrate, in particular a wafer, comprises inserting the first substrate and the second substrate into a positioning means; capturing at least one joint image of the first substrate and the second substrate; displaying the image; a plurality of image points in the image being marked by a user; and determining a control command for actuating the positioning means on the basis of the marked image points in such a way that the substrates are aligned with one another.

Abstract: A chuck for aligning a first planar substrate in parallel to a second planar substrate includes a top plate having a top surface for arrangement of the first planar substrate. A bottom plate is at least one distance measuring sensor configured to measure a distance between the top surface of the top plate and a surface of the second planar substrate, and at least three linear actuators in contact with the top plate and the bottom plate. The method for setting a gap between the first and second planar substrate includes measuring the thickness of the first planar substrate and measuring between a surface of the second planar substrate and the top surface of the top plate. The tilt adjusts between a top surface of the first planar substrate or the chuck and the surface of the second planar substrate by using at least three linear actuators of the chuck.

Abstract: The chuck for aligning a first planar substrate, e.g., a wafer, in parallel to a second planar substrate, e.g. a mask, comprises: a top plate having a top surface for arrangement of the first planar substrate, a bottom plate, at least one distance measuring sensor configured to measure a distance between the top surface of the top plate and a surface of the second planar substrate, and at least three linear actuators in contact with the top plate and the bottom plate. The method for setting a gap between a first planar substrate, e.g. a wafer, on a top plate of a chuck, and a second planar substrate, e.g.