Abstract: The present invention provides a high-temperature lead-free solder alloy which has no variation in strength of the soldered portion and has an excellent balance between strength and soldering properties, and a method for producing the alloy. The present invention relates to a lead-free jointing material made of an alloy of two elements A and B selected from elements other than Pb, wherein the element A has a melting point higher than a melting point of the element B, wherein the alloy is an alloy which has a room-temperature stable phase composed of the element B and a room-temperature stable phase AmBn composed of the elements A and B (provided that m and n are specific numerals in accordance with an alloy constituting a stable phase at room temperature) and satisfies AxB1-x (provided that 0<x<m(m+n)), and wherein the element A is supersaturatedly dissolved in the room-temperature stable phase composed of the element B.

Abstract: There are provided a surface coating material for a molten zinc bath member with improved zinc corrosion resistance, a production method thereof, and a molten zinc bath member. The surface coating material comprises WC powder particles and a binder metal. The binder metal comprises Co and a metal element electrochemically nobler than Co and constitutes an alloy structure having a single phase.

Abstract: Disclosed herein is an electronic apparatus produced using a high-temperature lead-free solder alloy which makes it possible to form soldered joints having no variations in strength and which has an excellent balance between strength and solderability. The lead-free solder alloy is an alloy which is made of an element A and an element B and which has a composition composed of AmBn being a stable phase and the element B in an equilibrium state at room temperature. When the lead-free solder alloy is solidified by quenching, the element A is dissolved in a room-temperature stable phase of the element B so that a supersaturated solid solution is formed, and when melted for soldering and then solidified, the alloy returns to its equilibrium state and has a composition composed of the stable phase AmBn and the element B and therefore maintains strength due to the presence of the stable phase AmBn even when reheated to a soldering temperature.

Abstract: An electrically conductive body includes: a first electrically conductive material; a second electrically conductive material; and a bonding material bonding the first electrically conductive material to the second electrically conductive material at least for electric conduction. The bonding material is made of a metallic structure containing copper-tin based intermetallic compound phases and tin-bismuth phases, the copper-tin based intermetallic compound phases being continuous between the first electrically conductive material and the second electrically conductive material, the tin-bismuth phases being surrounded by the copper-tin based intermetallic compound phases.

Abstract: Disclosed herein is an electronic apparatus produced using a high-temperature lead-free solder alloy which makes it possible to form soldered joints having no variations in strength and which has an excellent balance between strength and solderability. The lead-free solder alloy is an alloy which is made of an element A and an element B and which has a composition composed of AmBn being a stable phase and the element B in an equilibrium state at room temperature. When the lead-free solder alloy is solidified by quenching, the element A is dissolved in a room-temperature stable phase of the element B so that a supersaturated solid solution is formed, and when melted for soldering and then solidified, the alloy returns to its equilibrium state and has a composition composed of the stable phase AmBn and the element B and therefore maintains strength due to the presence of the stable phase AmBn even when reheated to a soldering temperature.

Abstract: The present invention provides a high-temperature lead-free solder alloy which has no variation in strength of the soldered portion and has an excellent balance between strength and soldering properties, and a method for producing the alloy. The present invention relates to a lead-free jointing material made of an alloy of two elements A and B selected from elements other than Pb, wherein the element A has a melting point higher than a melting point of the element B, wherein the alloy is an alloy which has a room-temperature stable phase composed of the element B and a room-temperature stable phase AmBn composed of the elements A and B (provided that m and n are specific numerals in accordance with an alloy constituting a stable phase at room temperature) and satisfies AxB1-x (provided that 0<x<m(m+n)), and wherein the element A is supersaturatedly dissolved in the room-temperature stable phase composed of the element B.

Abstract: There are provided a surface coating material for a molten zinc bath member with improved zinc corrosion resistance, a production method thereof, and a molten zinc bath member. The surface coating material comprises WC powder particles and a binder metal. The binder metal comprises Co and a metal element electrochemically nobler than Co and constitutes an alloy structure having a single phase.