Abstract: A chip-type electronic component with high reliability, which is able to suppress and prevent fatal damage to a ceramic body due to cracking even if a substrate with the chip-type electronic component mounted thereon undergoes a deflection. The chip-type electronic component includes a ceramic body having internal electrodes; resin electrode layers formed in a region including at least end surfaces of the ceramic body, and connected to the internal electrodes directly or indirectly and connected with the ceramic body; and plating metal layers covering the resin electrode layers, wherein the adhesion strength between the ceramic body and the resin electrode layer is higher than the adhesion strength between the resin electrode layer and the plating metal layer.

Abstract: A resin electrode paste characterized by rapid drying of solvent and efficient formation of a electrode with high shape accuracy contains conductive material powder, solvent, and dissolved in the solvent, a first resin having a softening point maintaining a solid state at the drying temperature and 10 to 40 weight % of the combined resins of a second resin having a softening point at least 45° C. lower and which is liquid at the drying heating temperature. The conductive powder is dispersed in a cured resin by removing solvent by heating and curing the resin. An electronic component a surface resin electrode formed with the resin electrode paste is described.

Abstract: A chip-type electronic component with high reliability, which is able to suppress and prevent fatal damage to a ceramic body due to cracking even if a substrate with the chip-type electronic component mounted thereon undergoes a deflection. The chip-type electronic component includes a ceramic body having internal electrodes; resin electrode layers formed in a region including at least end surfaces of the ceramic body, and connected to the internal electrodes directly or indirectly and connected with the ceramic body; and plating metal layers covering the resin electrode layers, wherein the adhesion strength between the ceramic body and the resin electrode layer is higher than the adhesion strength between the resin electrode layer and the plating metal layer.