Abstract: An interconnection structure has a first printed circuit board including an insulating substrate made of a thermoplastic resin and a first board conductive pattern with a land, a second printed circuit board overlapped with the first printed circuit board, and including a second board conductive pattern with a land that is electrically interconnected with the land of the first printed circuit board to form an interconnection portion between the first board conductive pattern and the second board conductive pattern. A part of the thermoplastic resin constituting the insulating substrate of the first printed circuit board extends to seal the interconnection portion. The insulating substrate of the first printed circuit board is adhered to an insulating substrate of the second printed circuit through an adhesion enhancing layer in which a material for lowering a modulus of elasticity of the insulating substrate of the first printed circuit board is dispersed therein.

Abstract: A PEI film to be bonded is disposed on a glass epoxy substrate through an alkane film, and a position to be adhered is heated to a temperature not less than the glass transition point Tg of the PEI film, thereby forming an adhesion-improving layer in which the alkane is dispersed into the PEI film, in the PEI film at the interface with the glass epoxy substrate. That is, the PEI film is bonded to the glass epoxy substrate through the adhesion-improving layer. Therefore, an adhesive strength is improved because the adhesion-improving layer has an elastic modulus lower than that of the PEI film.

Abstract: An interconnection structure has a first printed circuit board including an insulating substrate made of a thermoplastic resin and a first board conductive pattern with a land, a second printed circuit board overlapped with the first printed circuit board, and including a second board conductive pattern with a land that is electrically interconnected with the land of the first printed circuit board to form an interconnection portion between the first board conductive pattern and the second board conductive pattern. A part of the thermoplastic resin constituting the insulating substrate of the first printed circuit board extends to seal the interconnection portion. The insulating substrate of the first printed circuit board is adhered to an insulating substrate of the second printed circuit through an adhesion enhancing layer in which a material for lowering a modulus of elasticity of the insulating substrate of the first printed circuit board is dispersed therein.

Abstract: In interconnecting printed circuit boards: preparing a first and second printed circuit board is accomplished with the first having an insulating substrate of thermoplastic resin and a conductive pattern with a land, while the second has a conductive pattern with a land; overlapping the land of the first with the land of the second is done to form an interconnection portion; and heating the interconnection portion at a temperature approximately higher than a glass transition temperature of the thermoplastic resin while applying pressure to the interconnection portion to create an electrical interconnection sealed with a part of the thermoplastic resin constituting the insulating substrate of the first board is accomplished. The insulating substrate of the first board is overlapped with an insulating substrate of the second printed board to interpose a film, the film including material to reduce a modulus of elasticity of the insulating substrate of the first board.

Abstract: A hemopoietic stem cell augmenting agent in which at least one type of hepatocyte growth factor is contained as an active component is provided. The hepatocyte growth factor has an augmenting activity on undifferentiated pluripotent hemopoietic stem cells and is useful as a hemopoietic stem cell augmenting agent for treatment of bone marrow suppression and for treatment of bone marrow malfunctions and furthermore is useful for in vitro growth of peripheral blood stem cells and bone marrow stem cells. Furthermore, a hepatocyte growth factor derived from human normal fibroblasts which is considered to be a type of hepatocyte growth factor can be obtained by genetic recombination techniques, and said factor is also useful as a hemopoietic stem cells augmenting agent.

Abstract: A drug for prevention and therapy of diseases caused by fibrinoid formation or thrombus formation, as well as a model animal of fibrinoid formation or thrombus formation in the lung is disclosed. The drug for preventing and treating diseases caused by fibrinoid formation or thrombus formation in the lung according to the present invention comprises an inhibitor of interleukin 6 as an effective ingredient. The model animal of the diseases caused by fibrinoid formation or thrombus formation in the lung is a rat in which fibrinoid formation or thrombus formation actually occurs by induction with interleukin 6.

Abstract: Disclosed are an electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, the plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and 1.2.times.10.sup.-4 to 1.2.times.10.sup.-3 mole/l of an iron ion compound as a reaction initiator and/or 1.92.times.10.sup.-4 to 1.92.times.10.sup.

Abstract: An 18 kDa protein, denominated FDF-3, has been isolated from cultures of human fibroblasts and has been found to potentiate the growth- and differentiation-promoting activities of certain cytokines toward hematopoietic progenitor cells. The amino acid sequence of the FDF-3 protein, shown in SEQ ID NO: 14, corresponds to the sequence of a C-terminal domain of human fibronectin. The protein is useful in combination with IL-3, G-CSF, GM-CSF, or SCF (stem cell factor) in the expansion of hematopoietic cell populations in vitro or in therapeutic methods to promote recovery from leukopenia or myelosuppresion in vivo.

Abstract: Disclosed are an electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, the plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and 1.2.times.10.sup.-4 to 1.2.times.10.sup.-3 mole/l of an iron ion compound as a reaction initiator and/or 1.92.times.10.sup.-4 to 1.92.times.10.sup.