Patents by Inventor Katsuaki NISHIKORI

Katsuaki NISHIKORI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11966161
    Abstract: A radiation-sensitive resin composition includes: a polymer including a structural unit including an acid-labile group; and a compound represented by formula (1). R1, R2, and R3 each independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; X1, X2, and X3 each independently represent a group represented by formula (2); a sum of d, e, and f is no less than 1; R4 represents a hydrocarbon group having 1 to 20 carbon atoms and R5 represents a hydrocarbon group having 1 to 20 carbon atoms, or R4 and R5 taken together represent a heterocyclic structure having 4 to 20 ring atoms, together with the sulfur atom to which R4 and R5 bond; n is 0 or 1; A? represents a monovalent sulfonic acid anion; and Y represents —COO—, —OCO—, or —N(R7)CO—.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: April 23, 2024
    Assignee: JSR CORPORATION
    Inventors: Takuhiro Taniguchi, Katsuaki Nishikori, Hayato Namai, Kazuya Kiriyama, Ken Maruyama
  • Publication number: 20240094634
    Abstract: A radiation-sensitive resin composition contains: a first polymer having a first structural unit including a partial structure obtained by substituting a hydrogen atom of a carboxy group or of a phenolic hydroxy group with an acid-labile group represented by formula (1); and a compound including: a monovalent radiation-sensitive onium cation moiety including an aromatic ring structure which includes a fluorine atom or a fluorine atom-containing group; and a monovalent organic acid anion moiety. Ar1 represents a group obtained by removing one hydrogen atom from a substituted or unsubstituted aromatic ring structure having 5 to 30 ring atoms; R 1 and R2 each independently represent a substituted or unsubstituted monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms; and * denotes a site bonding to an ethereal oxygen atom in the carboxy group or an oxygen atom in the phenolic hydroxy group.
    Type: Application
    Filed: August 21, 2023
    Publication date: March 21, 2024
    Applicant: JSR CORPORATION
    Inventors: Katsuaki NISHIKORI, Takahiro KAWAI
  • Publication number: 20230400767
    Abstract: A radiation-sensitive resin composition includes: a polymer including a first structural unit represented by formula (1); and a radiation-sensitive acid generator. In the formula (1), R1 represents a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; R2, R3, and R4 each independently represent a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; R5 represents a monovalent organic group having 1 to 20 carbon atoms; and L represents a single bond or a divalent organic group having 1 to 20 carbon atoms.
    Type: Application
    Filed: August 29, 2023
    Publication date: December 14, 2023
    Applicant: JSR CORPORATION
    Inventors: Takuya OMIYA, Katsuaki NISHIKORI, Kazuya KIRIYAMA, Natsuko KINOSHITA, Tetsurou KANEKO
  • Publication number: 20230384676
    Abstract: A radiation-sensitive resin composition includes: a resin including a structural unit represented by formula (1); a radiation-sensitive acid generator; and a solvent. R1 is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; L1 represents a single bond or —COO-L-; L represents a substituted or unsubstituted alkanediyl group; R2 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms; L2 represents a single bond or a divalent linking group; and Ar represents a group obtained by removing (n+1) hydrogen atoms from an aromatic ring. R3 is independently a halogen atom, a halogenated hydrocarbon group, a hydroxy group, a monovalent hydrocarbon group having 1 to 10 carbon atoms, or a monovalent alkyl ether group having 1 to 10 carbon atoms, and at least one R3 is a halogen atom or a halogenated hydrocarbon group.
    Type: Application
    Filed: April 18, 2023
    Publication date: November 30, 2023
    Applicant: JSR CORPORATION
    Inventors: Takuya OMIYA, Katsuaki NISHIKORI, Kazuya KIRIYAMA, Yuushi MATSUMURA, Natsuko KINOSHITA
  • Publication number: 20230244143
    Abstract: A radiation-sensitive resin composition includes: a polymer including a structural unit including an acid-labile group; and a compound represented by formula (1). R1, R2, and R3 each independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; X1, X2, and X3 each independently represent a group represented by formula (2); a sum of d, e, and f is no less than 1; R4 represents a hydrocarbon group having 1 to 20 carbon atoms and R5 represents a hydrocarbon group having 1 to 20 carbon atoms, or R4 and R5 taken together represent a heterocyclic structure having 4 to 20 ring atoms, together with the sulfur atom to which R4 and R5 bond; n is 0 or 1; A? represents a monovalent sulfonic acid anion; and Y represents —COO—, —OCO—, or —N(R7)CO—.
    Type: Application
    Filed: June 30, 2022
    Publication date: August 3, 2023
    Applicant: JSR CORPORATION
    Inventors: Takuhiro TANIGUCHI, Katsuaki NISHIKORI, Hayato NAMAI, Kazuya KIRIYAMA, Ken MARUYAMA
  • Publication number: 20230236501
    Abstract: A radiation-sensitive resin composition includes: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid; a radiation-sensitive acid generator; and a compound represented by formula (1). Ar1 represents a group obtained by removing (a+b+2) hydrogen atoms from an aromatic hydrocarbon ring having 6 to 30 ring atoms; R1 represents a halogen atom or a monovalent organic group having 1 to 20 carbon atoms; L1 represents a divalent linking group; R2 represents a substituted or unsubstituted monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms; a is an integer of 0 to 10, b is an integer of 1 to 10, wherein a sum of a and b is no greater than 10; and X+ represents a monovalent radiation-sensitive onium cation.
    Type: Application
    Filed: January 23, 2023
    Publication date: July 27, 2023
    Applicant: JSR CORPORATION
    Inventors: Natsuko KINOSHITA, Takuhiro TANIGUCHI, Katsuaki NISHIKORI, Kazuya KIRIYAMA
  • Publication number: 20230236506
    Abstract: A radiation-sensitive resin composition includes a polymer and a compound. The compound includes a first structural unit including an aromatic carbon ring to which no less than two hydroxy groups bond, and a second structural unit including an acid-labile group which is dissociable by an action of an acid to give a carboxy group. The compound is represented by formula (1). R1 represents a monovalent organic group having 1 to 30 carbon atoms; and X+ represents a monovalent radiation-sensitive onium cation. A weight average molecular weight of the polymer is no greater than 10,000.
    Type: Application
    Filed: July 19, 2022
    Publication date: July 27, 2023
    Applicant: JSR CORPORATION
    Inventors: Katsuaki NISHIKORI, Kazuya KIRIYAMA, Takuhiro TANIGUCHI, Ken MARUYAMA
  • Publication number: 20230229082
    Abstract: A radiation-sensitive resin composition includes: a polymer which has a first structural unit including a phenolic hydroxyl group, and a second structural unit represented by formula (1); and a radiation-sensitive acid generating agent which has a compound represented by formula (2). R1 represents a hydrogen atom, or the like; R2 represents a hydrogen atom or the like; and R3 represents a divalent monocyclic alicyclic hydrocarbon group having 3 to 12 ring atoms. Ar1 represents a group obtained by removing (q+1) hydrogen atoms on an aromatic ring from an arene formed by condensation of at least two benzene rings; R4 represents a monovalent organic group having 1 to 20 carbon atoms; q is an integer of 0 to 7; and R5 represents a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms, or the like.
    Type: Application
    Filed: December 7, 2021
    Publication date: July 20, 2023
    Applicant: JSR CORPORATION
    Inventor: Katsuaki NISHIKORI
  • Publication number: 20230104260
    Abstract: A radiation-sensitive resin composition includes a resin, a radiation-sensitive acid generator, and a solvent. The resin includes a structural unit A represented by formula (1) and a structural unit B having an acid-dissociable group. The structural unit represented by the formula (1) is excluded from the structural unit B. In the formula (1), A is a monovalent aromatic hydrocarbon group in which —ORY is bonded to a carbon atom adjacent to a carbon atom to which L? is bonded, and hydrogen atoms on other carbon atoms are unsubstituted, or a part or all of the hydrogen atoms are substituted with a cyano group, a nitro group, an alkyl group, an alkoxy group, an alkoxycarbonyl group, an alkoxycarbonyloxy group, an acyl group, or an acyloxy group.
    Type: Application
    Filed: January 20, 2021
    Publication date: April 6, 2023
    Applicant: JSR CORPORATION
    Inventors: Takuya OMIYA, Katsuaki NISHIKORI, Kazuya KIRIYAMA, Natsuko KINOSHITA
  • Publication number: 20230103682
    Abstract: Provided are a method for forming a resist pattern that demonstrates excellent performance in sensitivity, resolution, etc. in an exposure step when a next-generation exposure technique is applied, and a radiation-sensitive resin composition. The method for forming a resist pattern includes step (1) of forming a resist film in which a content of a radiation-sensitive acid generator (C) is 0.1% by mass or less, step (2) of exposing the resist film to EUV or an electron beam (EB), and step (3) of developing the resist film exposed in the step (2).
    Type: Application
    Filed: January 12, 2021
    Publication date: April 6, 2023
    Applicant: JSR CORPORATION
    Inventors: Kazuki KASAHARA, Katsuaki NISHIKORI, Sosuke OSAWA, Miki TAMADA, Motohiro SHIRATANI
  • Patent number: 11609495
    Abstract: A radiation-sensitive resin composition includes a polymer including a phenolic hydroxyl group, a compound represented by formula (1-1) or formula (1-2), and a compound represented by formula (2). In the formula (1-1), a sum of a, b, and c is no less than 1; at least one of R1, R2, and R3 represents a fluorine atom or the like; and R4 and R5 each independently represent a hydrogen atom, a fluorine atom, or the like. In the formula (1-2), in a case in which d is 1, R6 represents a fluorine atom or the like, and in a case in which d is no less than 2, at least one of the plurality of R6s represents a fluorine atom or the like; and R8 represents a single bond or a divalent organic group having 1 to 20 carbon atoms.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: March 21, 2023
    Assignee: JSR CORPORATION
    Inventors: Katsuaki Nishikori, Kazuya Kiriyama, Takuhiro Taniguchi, Ken Maruyama
  • Patent number: 11592746
    Abstract: A radiation-sensitive resin composition contains: a polymer that includes a structural unit including an acid-labile group; and a radiation-sensitive acid generating agent. The radiation-sensitive acid generating agent includes a sulfonate anion and a radiation-sensitive cation. The sulfonate anion includes two or more rings, and an iodine atom and a monovalent group having 0 to 10 carbon atoms which includes at least one of an oxygen atom and a nitrogen atom bond to at least one of the two or more rings. The ring is preferably an aromatic ring. The radiation-sensitive acid generating agent is preferably a compound represented by formula (1). In the formula (1), A1 represents a group obtained from a compound which includes a ring having 3 to 20 ring atoms by removing (p+q+r+1) hydrogen atoms on the ring.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: February 28, 2023
    Assignee: JSR CORPORATION
    Inventors: Kazuya Kiriyama, Katsuaki Nishikori, Takuhiro Taniguchi, Ken Maruyama
  • Publication number: 20220413385
    Abstract: The radiation-sensitive resin composition contains: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid, and which has a structural unit represented by the following formula (1); and a radiation-sensitive acid generating agent. L represents a single bond, —COO—, —O—, or —CONH—. X represents a single bond, —O—, -G-O—, —CH2—, —S—, —SO2—, —NRA—, or —CONH—, wherein G represents a divalent aliphatic hydrocarbon group having 1 to 20 carbon atoms, and RA represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms. R2 and R3 each independently represent a halogen atom, a hydroxy group, a sulfanyl group, or an organic group having 1 to 20 carbon atoms.
    Type: Application
    Filed: June 1, 2022
    Publication date: December 29, 2022
    Applicant: JSR CORPORATION
    Inventors: Kazuya KIRIYAMA, Takuhiro Taniguchi, Katsuaki Nishikori, Natsuko Kinoshita
  • Publication number: 20220382152
    Abstract: A radiation-sensitive resin composition includes a polymer and a compound. The compound includes a first structural unit including an aromatic carbon ring to which no less than two hydroxy groups bond, and a second structural unit including an acid-labile group which is dissociable by an action of an acid to give a carboxy group. The compound is represented by formula (1). R1 represents a monovalent organic group having 1 to 30 carbon atoms; and X represents a monovalent radiation-sensitive onium cation. A weight average molecular weight of the polymer is no greater than 10,000.
    Type: Application
    Filed: July 19, 2022
    Publication date: December 1, 2022
    Applicant: JSR CORPORATION
    Inventors: Katsuaki NISHIKORI, Kazuya KIRIYAMA, Takuhiro TANIGUCHI, Ken MARUYAMA
  • Publication number: 20220334481
    Abstract: A radiation-sensitive resin composition includes: a polymer including a structural unit including an acid-labile group; and a compound represented by formula (1). R1, R2, and R3 each independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; X1, X2, and X3 each independently represent a group represented by formula (2); a sum of d, e, and f is no less than 1; R4 represents a hydrocarbon group having 1 to 20 carbon atoms and R5 represents a hydrocarbon group having 1 to 20 carbon atoms, or R4 and R5 taken together represent a heterocyclic structure having 4 to 20 ring atoms, together with the sulfur atom to which R4 and R5 bond; n is 0 or 1; A? represents a monovalent sulfonic acid anion; and Y represents —COO—, —OCO—, or —N(R7)CO—.
    Type: Application
    Filed: June 30, 2022
    Publication date: October 20, 2022
    Applicant: JSR CORPORATION
    Inventors: Takuhiro TANIGUCHI, Katsuaki NISHIKORI, Hayato NAMAI, Kazuya KIRIYAMA, Ken MARUYAMA
  • Publication number: 20220299873
    Abstract: A radiation-sensitive resin composition includes: a first polymer including a structural unit including an acid-labile group; a second polymer including a structural unit represented by formula (1); and a radiation-sensitive acid generator. In the formula (1), A represents an oxygen atom or a sulfur atom; a sum of m and n is 2 or 3, wherein m is 1 or 2, and n is 1 or 2; X represents a single bond or a divalent organic group having 1 to 20 carbon atoms; and R1 represents a monovalent organic group including a fluorine atom.
    Type: Application
    Filed: June 1, 2022
    Publication date: September 22, 2022
    Applicant: JSR CORPORATION
    Inventors: Ryuichi NEMOTO, Ryotaro TANAKA, Taiichi FURUKAWA, Katsuaki NISHIKORI, Hiromitsu NAKASHIMA
  • Publication number: 20220283498
    Abstract: A radiation-sensitive resin composition includes: a resin having a polystyrene-equivalent weight-average molecular weight of 8,000 or less; a radiation-sensitive acid generator; and a solvent. The resin includes: a structural unit A represented by formula (1); a structural unit B having a phenolic hydroxyl group; and a structural unit C having an acid-dissociable group. The structural unit B is other than the structural unit A; and the structural unit C is other than the structural unit A or B. In the formula (1), RX is a hydrogen atom or a methyl group; and Ar is a monovalent aromatic hydrocarbon group having a substituent represented by —ORY. The substituent is bonded to a carbon atom next to a carbon atom bonded to a main chain of the resin. RY is a hydrogen atom or a protective group to be deprotected by action of an acid.
    Type: Application
    Filed: February 11, 2022
    Publication date: September 8, 2022
    Applicant: JSR CORPORATION
    Inventors: Katsuaki NISHIKORI, Kazuya Kiriyama, Natsuko Kinoshita, Takuhiro Taniguchi
  • Publication number: 20220269172
    Abstract: Provided are: a radiation-sensitive resin composition, a method of forming a resist pattern, and a polymer which enable forming a resist pattern with favorable sensitivity to exposure light and superiority in terms of CDU performance and resolution. The radiation-sensitive resin composition contains: a polymer having: a first structural unit represented by formula (1), and a second structural unit derived from a (meth)acrylic acid ester including an acid-labile group; and a radiation-sensitive acid generator.
    Type: Application
    Filed: February 17, 2022
    Publication date: August 25, 2022
    Applicant: JSR CORPORATION
    Inventors: Katsuaki NISHIKORI, Kazuya KIRIYAMA, Takuhiro TANIGUCHI, Ken MARUYAMA
  • Publication number: 20220177424
    Abstract: A radiation-sensitive resin composition contains: an onium salt compound represented by formula (1); a resin containing a structural unit having an acid-dissociable group; and a solvent. R1 is a substituted or unsubstituted monovalent organic group having a cyclic structure, or a chain hydrocarbon group having 2 or more carbon atoms. X is an oxygen atom, a sulfur atom, or —NR?—. R? is a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms. Z+ is a monovalent onium cation.
    Type: Application
    Filed: February 24, 2022
    Publication date: June 9, 2022
    Applicant: JSR CORPORATION
    Inventors: Ryuichi NEMOTO, Katsuaki Nishikori, Ryosuke Nakamura, Takuhiro Taniguchi
  • Patent number: 11320735
    Abstract: A radiation-sensitive resin composition contains: a polymer having an acid-labile group, a radiation-sensitive acid generator, a compound represented by the following formula (1), and a solvent. In the formula (1), X represents an oxygen atom or a sulfur atom; R1 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; R2 to R5 each independently represent a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms, and optionally two or more of R2 to R5 taken together represent an alicyclic structure having 3 to 20 ring atoms or an aliphatic heterocyclic structure having 3 to 20 ring atoms together with the carbon atom to which the two or more of R2 to R5 bond; Zn+ represents a cation having a valency of n; and n is an integer of 1 to 3.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: May 3, 2022
    Assignee: JSR CORPORATION
    Inventors: Katsuaki Nishikori, Satoshi Okazaki