Patents by Inventor Katsuaki Sakai

Katsuaki Sakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7599187
    Abstract: A semiconductor module in which a plurality of kinds of semiconductor devices having different heat generating amounts in being operated are mixedly present, heat conducting sheets are interposed between a module main body mounted to a board and outer faces of the semiconductor devices, and heat radiating plates are mounted thereto by covering outer faces of the semiconductor devices over two pieces or more of the semiconductor devices, wherein the heat conducting sheet having a heat conductivity higher than a heat conductivity of the heat conducting sheet used for the semiconductor device having a heat generating amount smaller than a heat generating amount of the semiconductor device is used for the semiconductor device having a large heat generating amount in the semiconductor devices.
    Type: Grant
    Filed: July 10, 2007
    Date of Patent: October 6, 2009
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Shuzo Aoki, Hisateru Iijima, Katsuaki Sakai, Meisou Chin
  • Publication number: 20080013286
    Abstract: A semiconductor module in which a plurality of kinds of semiconductor devices having different heat generating amounts in being operated are mixedly present, heat conducting sheets are interposed between a module main body mounted to a board and outer faces of the semiconductor devices, and heat radiating plates are mounted thereto by covering outer faces of the semiconductor devices over two pieces or more of the semiconductor devices, wherein the heat conducting sheet having a heat conductivity higher than a heat conductivity of the heat conducting sheet used for the semiconductor device having a heat generating amount smaller than a heat generating amount of the semiconductor device is used for the semiconductor device having a large heat generating amount in the semiconductor devices.
    Type: Application
    Filed: July 10, 2007
    Publication date: January 17, 2008
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Shuzo Aoki, Hisateru Iijima, Katsuaki Sakai, Meisou Chin
  • Patent number: 6151583
    Abstract: A workflow management method in a workflow system including a workflow server and tables for holding processes includes storing in a table a plurality of definition information sets for individually defining workflows for a plurality of processes included in a job for processing a plurality of works to be circulated, wherein the plurality of definition information sets each have a process ID, a process name, and a user role ID, and at least one of the plurality of definition information set has predetermined data for connecting processing defined by another definition information set in the user role ID, and storing in a table a work management information set created for each of the plurality of works subjected to processing by the job, the work management information set having a process ID, a process name, a user role ID, and a flag representative of whether or not workflow processing corresponding to processing of each work has been terminated.
    Type: Grant
    Filed: September 26, 1997
    Date of Patent: November 21, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Yoshihide Ohmura, Takashi Kobayashi, Katsuaki Sakai, Nobuo Nagai, Shoko Ogoshi