Abstract: A method of manufacturing a laminated stator core includes: forming a band-shaped yoke core sub-piece having a shape that an outer half is developed in a straight line when a yoke portion of the laminated stator core is divided into two halves in the width direction by punching a metal plate; forming an outer laminated yoke body by winding and laminating the band-shaped yoke core sub-piece in a spiral shape and coupling it in a caulking manner; forming an inner yoke-attachment magnetic core sub-piece having an inner yoke sub-portion obtained by dividing the inner half in a unit of magnetic poles when the yoke portion of the laminated stator core is divided into two halves in the width direction, by punching a metal plate; forming an inner yoke-attachment laminated magnetic sub-body by laminating and coupling a predetermined number of the inner yoke-attachment magnetic core sub-pieces to each other in a caulking manner; forming an intermediate assembly in which the inner yoke sub-portions form a ring shape by

Abstract: Thin sheets of magnetic material are subjected to a pressing process to stamp many sheets of core pieces, and caulking projections defined in the core pieces are caused to go into connecting through holes defined in the core pieces for connecting and laminating to produce a laminated core. In lower layer of the core pieces having the caulking projections arranged in different positions seeing in plan, at least two sheets of core pieces and other core pieces having the connecting through holes are provided. The caulking projections defined in the core pieces have projecting length of at least twice of thickness of the core pieces, and are fitted in the connecting through holes, so that upper and lower laminated core pieces are unified.

Abstract: A method of manufacturing a laminated stator core includes: forming a band-shaped yoke core sub-piece having a shape that an outer half is developed in a straight line when a yoke portion of the laminated stator core is divided into two halves in the width direction by punching a metal plate; forming an outer laminated yoke body by winding and laminating the band-shaped yoke core sub-piece in a spiral shape and coupling it in a caulking manner; forming an inner yoke-attachment magnetic core sub-piece having an inner yoke sub-portion obtained by dividing the inner half in a unit of magnetic poles when the yoke portion of the laminated stator core is divided into two halves in the width direction, by punching a metal plate; forming an inner yoke-attachment laminated magnetic sub-body by laminating and coupling a predetermined number of the inner yoke-attachment magnetic core sub-pieces to each other in a caulking manner; forming an intermediate assembly in which the inner yoke sub-portions form a ring shape by

Abstract: A method of manufacturing a laminated stator core includes: forming a band-shaped yoke core piece having a shape that a yoke of the laminated stator core is developed in a straight line and having concave connection portions in the inner circumferential edge thereof by punching a metal plate; forming a laminated yoke body by winding and laminating the band-shaped yoke core piece in a spiral shape and coupling the laminated band-shaped yoke core piece in a caulking manner; forming a magnetic core piece having a convex connection portion at the base end thereof by punching a metal plate; forming a laminated magnetic body by laminating and coupling a predetermined number of the magnetic core pieces to each other in a caulking manner; and coupling the laminated yoke body and the laminated magnetic body to each other by winding a coil around the laminated magnetic body and then inserting the convex connection portions into the concave connection portions.

Abstract: A method of manufacturing a laminated stator core includes: forming a band-shaped yoke core piece having a shape that a yoke of the laminated stator core is developed in a straight line and having concave connection portions in the inner circumferential edge thereof by punching a metal plate; forming a laminated yoke body by winding and laminating the band-shaped yoke core piece in a spiral shape and coupling the laminated band-shaped yoke core piece in a caulking manner; forming a magnetic core piece having a convex connection portion at the base end thereof by punching a metal plate; forming a laminated magnetic body by laminating and coupling a predetermined number of the magnetic core pieces to each other in a caulking manner; and coupling the laminated yoke body and the laminated magnetic body to each other by winding a coil around the laminated magnetic body and then inserting the convex connection portions into the concave connection portions.

Abstract: In a laminated iron core in which plural iron core pieces are laminated through caulking projections and caulking holes in which the caulking projections are fitted, and in the iron core pieces except a lowermost layer, the caulking projections and the caulking holes are formed at different positions of a same radius from a rotation center at skewing of the iron core pieces, and the caulking hole is longer in a circumferential direction than the caulking projection fitted in the caulking hole, and when the caulking projection of the iron core piece of an upper layer is fitted in the caulking hole of the iron core piece, a gap is formed in the circumferential direction of each of the caulking holes.

Abstract: An amorphous laminated core and a method of making an amorphous laminated core by punching core pieces from amorphous thin sheet material, laminating the plural sheets of core pieces, and forming caulking through-holes by punching. Rod shaped materials are directed into the caulking through-holes of the laminated core pieces.

Abstract: In a laminated iron core (10) in which plural iron core pieces (13, 14, 15) are laminated through caulking projections (22, 24) and caulking holes (21, 23, 25) in which the caulking projections are fitted, and in the iron core pieces except a lowermost layer, the caulking projections and the caulking holes are formed at different positions of a same radius from a rotation center at skewing of the iron core pieces, and the caulking hole is longer in a circumferential direction than the caulking projection fitted in the caulking hole, and when the caulking projection of the iron core piece of an upper layer is fitted in the caulking hole of the iron core piece, a gap is formed in the circumferential direction of each of the caulking holes.

Abstract: A lead frame according to this invention comprises: a semiconductor chip mounting part having an engagement hole formed on its one side; and a lead part including a supporting lead fit in said engagement hole of the semiconductor chip mounting part so as to support said semiconductor chip mounting part, said supporting lead being made of a thinner-walled material than that of the semiconductor chip mounting part and an outer lead arranged in parallel to said supporting lead. The supporting lead involves a fitting portion having a wider width than a lead width of the supporting lead and fit in said engagement hole of said semiconductor chip mounting part.

Abstract: The invention is to provide a method of making an amorphous laminated core having sufficient caulking strength and core shaping precision and having high precision in shaping the core and the caulking strength even if the amorphous laminated core has the minimum size for pocket telephones, and to provide such an amorphous laminated core. That is, a method of making the amorphous laminated core by punching core pieces from the amorphous thin sheet material, laminating the plural sheets of core pieces and caulking them, comprises a step of laminating the plural sheets of the core pieces having the caulking through-holes formed by punching, a step of inserting rod shaped materials into the caulking through-holes of the laminated core pieces, and a step of pushing back the inserted rod materials, thereby to caulk the core pieces of the plurality of laminated sheets. Further, in the amorphous laminated core, non-magnetic rod shaped materials are put in the caulking through-holes.

Abstract: A lead frame according to this invention comprises: a semiconductor chip mounting part having an engagement hole formed on its one side; and a lead part including a supporting lead fit in said engagement hole of the semiconductor chip mounting part so as to support said semiconductor chip mounting part, said supporting lead being made of a thinner-walled material than that of the semiconductor chip mounting part and an outer lead arranged in parallel to said supporting lead. The supporting lead involves a fitting portion having a wider width than a lead width of the supporting lead and fit in said engagement hole of said semiconductor chip mounting part.

Abstract: Thin sheets of magnetic material are subjected to a pressing process to stamp many sheets of core pieces, and caulking projections defined in the core pieces are caused to go into connecting through holes defined in the core pieces for connecting and laminating to produce a laminated core. In lower layer of the core pieces having the caulking projections arranged in different positions seeing in plan, at least two sheets of core pieces and other core pieces having the connecting through holes are provided. The caulking projections defined in the core pieces have projecting length of at least twice of thickness of the core pieces, and are fitted in the connecting through holes, so that upper and lower laminated core pieces are unified.

Abstract: A lead frame and a method of forming the same for a semiconductor device includes a pad section (20a) and a lead section (20b) which are formed separately. The former comprises a die pad (21) upon which a semiconductor element is to be mounted, and a pair of support bars (26) extending outwardly from opposite side edges thereof. The lead section (20b) includes frame members (25), outer leads (24), inner leads (22), and tie bars (23) interconnecting the outer and inner leads together in an integral manner.

Abstract: In a lead frame for a semiconductor device, inner leads are formed by etching and outer leads are formed by pressing.