Abstract: To prevent interfacial peeling due to the stress of an insulating layer in a capacitor-inductor integrated electronic component having three or more conductor layers. An electronic component includes: a conductor layer M1 including a conductor pattern constituting an inductor; a conductor pattern overlapping a part of the conductor pattern through a dielectric film; an insulating layer covering the conductor layer M1 and conductor pattern; a conductor layer M2 provided on the insulating layer and including a conductor pattern constituting the inductor; and an insulating layer covering the conductor layer M2. The conductor layer M2 is formed to be branching from or independently of the conductor pattern and further includes a dummy pattern overlapping the conductor pattern. This prevents the stress of the insulating layer from being directly applied to the conductor pattern to thereby prevent peeling at the interface between the conductor layer M1 and the dielectric film.

Abstract: The coil component includes a magnetic core 130 and conductors 210 and 220. The magnetic core 130 includes through-holes that are made by grooves 111 and 112. The conductors 210 and 220 are provided in the grooves 111 and 112, respectively. The magnetic core 130 includes a nonmagnetic portion in which the grooves 111 and 112 are communicated, and a distance between the conductors 210 and 220 through the nonmagnetic portion is shorter than a distance between the conductors 210 and 220 in surfaces 110c and 110d in which the conductors 210 and 220 are exposed. Therefore, necessity to provide a large cavity in the magnetic core is eliminated, and a risk of the short circuit between terminal electrodes exposed in the surfaces 110c and 110d is also eliminated.

Abstract: The coil component includes a magnetic core 130 and conductors 210 and 220. The magnetic core 130 includes through-holes that are made by grooves 111 and 112. The conductors 210 and 220 are provided in the grooves 111 and 112, respectively. The magnetic core 130 includes a nonmagnetic portion in which the grooves 111 and 112 are communicated, and a distance between the conductors 210 and 220 through the nonmagnetic portion is shorter than a distance between the conductors 210 and 220 in surfaces 110c and 110d in which the conductors 210 and 220 are exposed. Therefore, necessity to provide a large cavity in the magnetic core is eliminated, and a risk of the short circuit between terminal electrodes exposed in the surfaces 110c and 110d is also eliminated.

Abstract: A multilayer hybrid circuit having a laminated body having at least one of a plurality of dielectric layers, dielectric magnetic layers, and conductive patterns on said dielectric layers and said magnetic layers, is produced through a printing process and a sintering process, and comprises capacitors, inductors, and resistors. An external connection is effected by side terminals positioned on side walls of the laminated body. A coupling conductor which is perpendicular to a dielectric plane is provided for coupling elements on different planes. Said coupling conductor is a succession of essentially S-shaped conductor chips or lines with the ends connected to adjacent conductor chips on different planes. That coupling conductor functions via a through hole conductor in a prior printed circuit board, and has high operational reliability in a component which is produced through a sintering process.

Abstract: A composite electric part of a stacked multi-layer structure is composed of a capacor layer and a coil layer. The coil layer comprises a plurality of coils buried in a magnetic material. At least one of the coils includes a plurality of coil conductors which comprises combinations each of two coil conductors would spirally in opposite directions around respective winding axes extending substantially coaxially with each other, and mutually connected such that magnetic fields are generated in a same direction by the two coil conductors. A miniature size of composite electric part exhibiting a high inductance value is realized.