Patents by Inventor Katsuhide Oohashi

Katsuhide Oohashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11070001
    Abstract: Airtightness of a connector molding is improved. There is provided a connector molding in which a conductor and a fixing member are integrally molded with a molded body including a connector portion. The conductor is fixed to the fixing member, and is integrally molded with the molded body in a state in which an external connection end portion protrudes into a space within the connector portion. A part of the fixing member is exposed to the space within the connector portion and the remaining portion is covered by the molded body, or the entire fixing member is covered by the molded body.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: July 20, 2021
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Yusuke Kitai, Katsuhide Oohashi, Ko Sasaki, Takayuki Hagiya, Takuya Igarashi, Michimori Watanabe
  • Publication number: 20200161797
    Abstract: Airtightness of a connector molding is improved. There is provided a connector molding in which a conductor and a fixing member are integrally molded with a molded body including a connector portion. The conductor is fixed to the fixing member, and is integrally molded with the molded body in a state in which an external connection end portion protrudes into a space within the connector portion. A part of the fixing member is exposed to the space within the connector portion and the remaining portion is covered by the molded body, or the entire fixing member is covered by the molded body.
    Type: Application
    Filed: May 24, 2018
    Publication date: May 21, 2020
    Inventors: Yusuke KITAI, Katsuhide OOHASHI, Ko SASAKI, Takayuki HAGIYA, Takuya IGARASHI, Michimori WATANABE
  • Patent number: 8784715
    Abstract: A pre-molded part is formed by pre-molding an insert with a pre-molded member, and then the pre-molded part is inserted into an over-molded member composed of thermo plastic resin. After applying a heat treatment with a temperature lower than a crystalline melting point of the pre-molded part to the pre-molded part surrounding the insert, a firm contact between the insert and the resin surrounding the insert without a gap at the interface between those parts is obtained.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: July 22, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Katsuhide Oohashi, Shigeo Amagi, Osamu Miyo
  • Publication number: 20100052213
    Abstract: A pre-mold part is formed by pre-molding the insert with the pre-molded part, and then the pre-molded part is inserted into the over-molded part composed of thermo plastic resin. After applying a heat treatment with the temperature lower than a crystalline melting point of the pre-molded part to the pre-molded part surrounding the insert formed as the composite mold part surrounding the pre-mold part, a firm contact between the insert and the resin surrounding the insert part without no gap at the interface between those parts is obtained.
    Type: Application
    Filed: November 12, 2009
    Publication date: March 4, 2010
    Applicant: Hitachi, Ltd.
    Inventors: Katsuhide OOHASHI, Shigeo AMAGI, Osamu MIYO
  • Patent number: 7255610
    Abstract: An integrally multiple-molded part for electronic devices is provided capable of absorbing and relieving the internal stresses of a multiple-molded part, preventing the occurrence of clearances between the bonding side face of each electrical connection terminal and a resin, obtaining stable frictional force at the contact region between the bonding surface of the electrical connection terminal and an aluminum wire, obtaining the energy required for bonding, and achieving high bondability. The surface of the molded electrical connection terminal section formed as a primary-molded article becomes exposed after secondary molding, and a stress-absorbing structure is formed in the primary molding resin section of the primary-molded article that serves as a transmission path for stresses associated with the resin shrinkage occurring when the secondary molding resin is cured.
    Type: Grant
    Filed: December 30, 2005
    Date of Patent: August 14, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Katsuhide Oohashi, Shigeo Amagi, Osamu Miyo
  • Publication number: 20060186522
    Abstract: An integrally multiple-molded part for electronic devices is provided capable of absorbing and relieving the internal stresses of a multiple-molded part, preventing the occurrence of clearances between the bonding side face of each electrical connection terminal and a resin, obtaining stable frictional force at the contact region between the bonding surface of the electrical connection terminal and an aluminum wire, obtaining the energy required for bonding, and achieving high bondability. The surface of the molded electrical connection terminal section formed as a primary-molded article becomes exposed after secondary molding, and a stress-absorbing structure is formed in the primary molding resin section of the primary-molded article that serves as a transmission path for stresses associated with the resin shrinkage occurring when the secondary molding resin is cured.
    Type: Application
    Filed: December 30, 2005
    Publication date: August 24, 2006
    Applicant: HITACHI, LTD.
    Inventors: Katsuhide Oohashi, Shigeo Amagi, Osamu Miyo
  • Publication number: 20060001192
    Abstract: A pre-mold part is formed by pre-molding the insert part composed of composite materials composed of metal, ceramic, resin or any combination of those materials with the pre-mold part composed of thermo plastic resin having crystallinity, and then, the pre-mold part is inserted into the over-mold part composed of thermo plastic resin. After applying the heat treatment with the temperature lower than the crystalline melting point of the pre-mold part to the pre-mold part surrounding the insert part formed as the composite mold part surrounding the pre-mold part, the insert molding is completed finally. Mold parts having high-reliable insert parts enable to establish firm contact between the insert part and the resin surrounding the insert part without no gap at the interface between those parts can be obtained by a low-cost production method.
    Type: Application
    Filed: June 28, 2005
    Publication date: January 5, 2006
    Applicant: Hitachi, Ltd.
    Inventors: Katsuhide Oohashi, Shigeo Amagi, Osamu Miyo