Abstract: An image sensor able to capture an image with a suitable dynamic range even in a case where a bright/dark difference within an imaging range is large is provided. An image sensor 1 is provided with a substrate 2, a plurality of first photodiodes 5 arranged on the substrate 2 corresponding to a plurality of pixels 3, receiving light incident upon a first principal surface S1, and generating charges in accordance with the amounts of light received, and a plurality of second photodiodes 6 arranged at positions in behind side of the plurality of first photodiodes 5 corresponding to the plurality of pixels 3, receiving light incident upon the first principal surface S1 and passing through at least one of the plurality of first photodiodes 5 and the substrate 2, and generating charges in accordance with amounts of light received.

Abstract: An image sensor able to capture an image with a suitable dynamic range even in a case where a bright/dark difference within an imaging range is large is provided. An image sensor 1 is provided with a substrate 2, a plurality of first photodiodes 5 arranged on the substrate 2 corresponding to a plurality of pixels 3, receiving light incident upon a first principal surface S1, and generating charges in accordance with the amounts of light received, and a plurality of second photodiodes 6 arranged at positions in behind side of the plurality of first photodiodes 5 corresponding to the plurality of pixels 3, receiving light incident upon the first principal surface S1 and passing through at least one of the plurality of first photodiodes 5 and the substrate 2, and generating charges in accordance with amounts of light received.

Abstract: In an optical interconnection module used for data communication, or the like, a semiconductor laser for emitting laser light and a photodiode for monitoring irradiation of the light by the laser are fixed on a first mounting base member made of a single crystalline silicon. An optical fiber is held on a V-shaped groove on the first mounting base member for facing the light emitting layer of the laser. At least a gap between the laser and the optical fiber is filled by a transparent resin having a refractive index equal to or larger than that of the optical fiber but smaller than the light wave guide layer of the laser. The transparent resin portion is further covered by non-transparent resin. The first mounting base member is fixed on a second mounting base member made of ceramic material having thermal expansion coefficient larger than that of the first mounting base but smaller than a circuit substrate made of epoxy resin.

Abstract: In an optical interconnection module used for data communication, or the like, a semiconductor laser for emitting laser light and a photodiode for monitoring irradiation of the light by the laser are fixed on a first mounting base member made of a single crystalline silicon. An optical fiber is held on a V-shaped groove on the first mounting base member for facing the light emitting layer of the laser. At least a gap between the laser and the optical fiber is filled by a transparent resin having a refractive index equal to or larger than that of the optical fiber but smaller than the light wave guide layer of the laser. The transparent resin portion is further covered by non-transparent resin. The first mounting base member is fixed on a second mounting base member made of ceramic material having thermal expansion coefficient larger than that of the first mounting base but smaller than a circuit substrate made of epoxy resin.