Patents by Inventor Katsuhiko Hasegawa

Katsuhiko Hasegawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088452
    Abstract: A catalytic solution for a halide ion battery, which is an aqueous solution containing a quaternary ammonium halide salt or a hydrate thereof at 9.0 mol/kg to 11.0 mol/kg, is an electrolyte for a halide ion battery that has excellent safety and a wide potential window.
    Type: Application
    Filed: March 4, 2022
    Publication date: March 14, 2024
    Applicant: AISIN CORPORATION
    Inventors: Toru JOBOJI, Katsuhiko SAGUCHI, Norifumi HASEGAWA
  • Publication number: 20080086898
    Abstract: An assisting apparatus assists an operating section. The operating section produces effect on a target surface. The assisting apparatus includes a retaining section for detachably retaining the operating section. An arranging section is placed on the target surface so as to arrange the retaining section on the target surface. An actuating section actuates the operating section such that the operating section produces effect on the target surface in a state where the retaining section retains the operating section. Therefore, an assisting apparatus that allow an operating section to easily and stably act on a target surface is provided.
    Type: Application
    Filed: October 17, 2006
    Publication date: April 17, 2008
    Applicant: HASEGAWA HAMONO KABUSHIKI KAISHA
    Inventor: Katsuhiko Hasegawa
  • Patent number: 7124508
    Abstract: A pair of scissors including a pair of scissor pieces, each having a handle and a blade, and a pin, which connects the two scissor pieces so that they may be opened and closed. The cutting edges of the two blades intersect each other at an intersecting point that moves along a predetermined movement path when the two blades are opened and closed. A cap accommodates the two blades. The cap includes an engaging slit detachably engaged with at least the pin to keep the two blades accommodated in the cap. A slit is formed in the cap. The slit is located at a portion of the cap, which accommodates the two blades, corresponding to the movement path. The scissors improves safety regardless of whether or not the scissors are being used.
    Type: Grant
    Filed: February 4, 2004
    Date of Patent: October 24, 2006
    Assignee: Hasegawa Hamono Kabushiki Kaisha
    Inventor: Katsuhiko Hasegawa
  • Publication number: 20040158993
    Abstract: A pair of scissors including a pair of scissor pieces, each having a handle and a blade, and a pin, which connects the two scissor pieces so that they may be opened and closed. The cutting edges of the two blades intersect each other at an intersecting point that moves along a predetermined movement path when the two blades are opened and closed. A cap accommodates the two blades. The cap includes an engaging slit detachably engaged with at least the pin to keep the two blades accommodated in the cap. A slit is formed in the cap. The slit is located at a portion of the cap, which accommodates the two blades, corresponding to the movement path. The scissors improves safety regardless of whether or not the scissors are being used.
    Type: Application
    Filed: February 4, 2004
    Publication date: August 19, 2004
    Applicant: HASEGAWA HAMONO KABUSHIKI KAISHA
    Inventor: Katsuhiko Hasegawa
  • Patent number: 6674017
    Abstract: A multilayer-wiring substrate having a via hole structure and method for fabricating the same. Referring to FIGS. 1(a) and 1(b), after a via-hole 5 is formed by exposure and development in lithography or by laser-drilling, a bottom portion of the via-hole 5 is subjected to resin-etching so as to expose a surface 4A of a lower conductor 4 as shown in FIG. 3(b). The exposed surface 4A of the lower conductor 4 is chemically etched so that the conductor 4 is undercut. As a result, undesired material 5B such as adhered residual resin shown in FIG. 3(b) is completely removed. In etching the conductor 4 at the bottom of the via hole 5, the lower conductor 4 is preferably etched in an amount of 5-30% of the thickness of the lower conductor 4 to form a depression or recess 6A at a via hole bottom 5C as shown in FIG. 3(b), thereby reliably establishing electrical continuity between the lower conductor 4 and the upper conductor 8 by means of a via-hole conductor 7 as shown in FIG. 3(c).
    Type: Grant
    Filed: December 23, 1999
    Date of Patent: January 6, 2004
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Kozo Yamasaki, Osamu Hisada, Katsuhiko Hasegawa, Naoki Kito, Satoshi Hirano
  • Patent number: 6139904
    Abstract: A method of making a printed board is provided. The printed board has a base provided with a plurality of through via conductors having through holes extending completely between upper and lower surfaces of the base and closed by resin fillings and a plurality of blind via conductors having depressions closed by resin fillings.
    Type: Grant
    Filed: October 20, 1999
    Date of Patent: October 31, 2000
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Kozo Yamasaki, Osamu Hisada, Katsuhiko Hasegawa, Naoki Kito, Satoshi Hirano, Yutaro Kameyama
  • Patent number: D536938
    Type: Grant
    Filed: November 24, 2003
    Date of Patent: February 20, 2007
    Assignee: Hasegawa Hamono Kabushiki Kaisha
    Inventors: Katsuhiko Hasegawa, Satoshi Nakagawa