Abstract: An optical pickup lens device includes, in the order from the light source side, collimating means for converting a bundle of rays into parallel rays or predetermined convergent or divergent rays, the collimating means being movably held along a direction of an optical axis of a bundle of rays emitted from a light source; an aberration correcting element for allowing a bundle of rays emitted from the collimating means to be transmitted therethrough; and an objective lens element having a numerical aperture of 0.8 or more, and converging a bundle of rays coming from the aberration correcting element onto the information recording medium to form a spot. The aberration correcting element and the objective lens element are integrally held together in a direction orthogonal to the optical axis so as to perform tracking on the information recording medium, and satisfy predetermined conditions.

Abstract: An optical pickup lens device includes, in the order from the light source side, collimating means for converting a bundle of rays into parallel rays or predetermined convergent or divergent rays, the collimating means being movably held along a direction of an optical axis of a bundle of rays emitted from a light source; an aberration correcting element for allowing a bundle of rays emitted from the collimating means to be transmitted therethrough; and an objective lens element having a numerical aperture of 0.8 or more, and converging a bundle of rays coming from the aberration correcting element onto the information recording medium to form a spot. The aberration correcting element and the objective lens element are integrally held together in a direction orthogonal to the optical axis so as to perform tracking on the information recording medium, and satisfy predetermined conditions.

Abstract: An optical pickup lens device includes, in the order from the light source side, collimating means for converting a bundle of rays into parallel rays or predetermined convergent or divergent rays, the collimating means being movably held along a direction of an optical axis of a bundle of rays emitted from a light source; an aberration correcting element for allowing a bundle of rays emitted from the collimating means to be transmitted therethrough; and an objective lens element having a numerical aperture of 0.8 or more, and converging a bundle of rays coming from the aberration correcting element onto the information recording medium to form a spot. The aberration correcting element and the objective lens element are integrally held together in a direction orthogonal to the optical axis so as to perform tracking on the information recording medium, and satisfy predetermined conditions.

Abstract: One block SB serving as a fundamental unit constituting a data reading circuit is constituted by four memory cells MS1 to MS4 connected electrically in series, four FETs S1 to S4 connected in parallel with the memory cells MS1 to MS4 in one-to-one correspondence, and an FET S0 connected to one of series connection ends of the memory cells MS1 to MS4. Each memory cell MS1-MS4 is formed out of a TMR element having two TMR element portions connected electrically in series. The two TMR element portions are connected in series to thereby form a series connection body. A sensing current flows in only through one end of the series connection body of the two TMR element portions, passes through the TMR element portions in turn, and then flows out only through the other end of the series connection body. Further, the TMR element 11 has two TMR element portions 11A and 11B. The TMR element portions 11A and 11B are disposed in a direction parallel with their laminated surfaces with respect to each other.

Abstract: An embodiment of the apparatus relates to a door opening and closing assisting device comprising: a spring force to urge the door in a closed direction when the door is half-opened or less and supplies no closing force when the door is more than half-opened. The assisting device is housed either in the door or the main body. The method relates to assisting in opening and closing a door comprising: elastically deforming a spring in response to the door being opened to a half-opened position; disconnecting the spring force if the door is more than half-opened and reconnecting the spring force to the door when the door is half-opened or less.

Abstract: A low-cost contact detection sensor and contact detection method for easily detecting a contact by a third party is provided. A contact detection sensor comprises an antireflection structure including structure elements having a predetermined shape which are put in an array periodically at a pitch smaller than a wavelength of visible spectrum; and a substrate including the antireflection structure in at least a part of a surface portion thereof. The antireflection structure distinguishes whether the detection target is contacted by a human body or not based on a change in reflectance which occurs to an area of the detection target contacted by the human body when the detection target is contacted by the human body.

Abstract: A COF flexible printed wiring board, used for a semiconductor device, contains an insulating layer, a wiring pattern formed of a conductor layer on one side of the insulating layer, on which a semiconductor chip is to be mounted, and a heat-resistant releasing layer, wherein the releasing layer is formed from a releasing agent and is provided on a surface of the insulating layer, which surface is opposite to the mounting side of the semiconductor chip, and the releasing layer and the insulating layer, as a whole, exhibit an optical transmittance of 50% or higher, excluding the area corresponding to the wiring pattern.

Abstract: The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, to thereby enhance reliability and productivity of a semiconductor chip mounting line, and also provides a method of producing the COF flexible printed wiring board. The COF flexible printed wiring board contains an insulating layer, a wiring pattern, on which a semiconductor chip being mounted, formed of a conductor layer provided on at least one side of the insulating layer and a releasing layer, wherein the releasing layer is formed from a releasing agent containing at least one species selected from a silane compound and silica sol and is provided on a surface of the insulating layer, which is opposite to the mounting side of the semiconductor chip.

Abstract: Provision of a releasing layer transfer film which can form, in a simple manner, a releasing layer on a COF flexible printed wiring board, the releasing layer preventing melt adhesion of an insulating layer to a heating tool, thereby enhancing productivity and reliability of semiconductor devices produced by use of a semiconductor chip mounting line. The releasing layer transfer film 1 for forming a releasing layer onto an insulating layer serving as a component layer of a COF flexible printed wiring board, the releasing layer transfer film includes a transfer film substrate 2 and a transferable releasing layer 3 provided on a surface of the transfer film substrate 2, wherein the transferable releasing layer 3 is formed from a releasing agent and can be transferred onto the insulating layer.

Abstract: An object of the present invention is to provide a high frequency module which can efficiently radiate heat generated from a semiconductor chip. A high frequency module according to the present invention employs a substrate 11, a semiconductor chip 13 fixed on the substrate 11, a roof plate 15 being contact with an upper surface 13a of the semiconductor chip 13, and a cap, which is contact with an upper surface of the roof plate, having a flat portion 16a and extended portions 16b leaded out below from opposite ends of the flat portion 16a. The extended portions 16b of the cap 16 are contact with side surfaces of the substrate 11. Thus, a wide area contact between the extended portions 16b of the cap 16 and the side surfaces of the substrate 11 can be ensured even if the height of the semiconductor chip 13 fluctuates or the shape of the cap 16 fluctuates. This results that heat generated from the semiconductor chip 13 is efficiently radiated to the substrate 11.

Abstract: One block SB serving as a fundamental unit constituting a data reading circuit is constituted by four memory cells MS1 to MS4 connected electrically in series, four FETs S1 to S4 connected in parallel with the memory cells MS1 to MS4 in one-to-one correspondence, and an FET S0 connected to one of series connection ends of the memory cells MS1 to MS4. Each memory cell MS1-MS4 is formed out of a TMR element having two TMR element portions connected electrically in series. The two TMR element portions are connected in series to thereby form a series connection body. A sensing current flows in only through one end of the series connection body of the two TMR element portions, passes through the TMR element portions in turn, and then flows out only through the other end of the series connection body. Further, the TMR element 11 has two TMR element portions 11A and 11B. The TMR element portions 11A and 11B are disposed in a direction parallel with their laminated surfaces with respect to each other.

Abstract: A method for easily designing a high-frequency electronic component constituted of a multilayer substrate incorporating multiple passive elements comprises a first step of specifying parameters required by passive elements included in circuitry of a high-frequency electronic component to be fabricated, separately for each passive element, a second step of selecting the specified parameters and patterns corresponding thereto from a database storing parameters and patterns corresponding thereto of multiple passive elements, a third step of virtually laying out the selected patterns laterally (horizontally) of one another, and a fourth step of providing virtual wiring among the laid-out patterns.

Abstract: A 2-metal layer TAB and a both-sided CSP.BGA tape having an insulating substrate and a wiring layer provided on at least both sides of the substrate, the substrate having evenly spaced sprocket holes on both width direction edges in the longitudinal direction thereof and also having through-holes formed with a punching press, and the through-holes being filled with a conductor by means of a punching press such that the conductor and the wiring layers are electrically connected, which is characterized by having round pilot holes between the sprocket holes formed in the longitudinal direction thereof; and a process of producing the same.

Abstract: A printed circuit board comprising an insulating substrate, a through-hole formed in the insulating substrate, an implant material filling the through-hole, and a wiring pattern formed on both faces of the insulating substrate and electrically connected with the implant material, characterized in that one face of a conductor wiring layer wherein a bump penetrates from one face to the other face and protrudes is adhered to the insulating substrate so as to be electrically connected to the implant material. This bump conductor wiring layer of this printed circuit board has a large degree of freedom in forming a wiring pattern, through-hole, and bump and is unlike conventional handled separately from the insulating substrate. Therefore, the effect arises that this circuit board is the target of commercial trading by itself.

Abstract: An object of the present invention is to provide a high frequency module which can efficiently radiate heat generated from a semiconductor chip. A high frequency module according to the present invention employs a substrate 11, a semiconductor chip 13 fixed on the substrate 11, a roof plate 15 being contact with an upper surface 13a of the semiconductor chip 13, and a cap, which is contact with an upper surface of the roof plate, having a flat portion 16a and extended portions 16b leaded out below from opposite ends of the flat portion 16a. The extended portions 16b of the cap 16 are contact with side surfaces of the substrate 11. Thus, a wide area contact between the extended portions 16b of the cap 16 and the side surfaces of the substrate 11 can be ensured even if the height of the semiconductor chip 13 fluctuates or the shape of the cap 16 fluctuates. This results that heat generated from the semiconductor chip 13 is efficiently radiated to the substrate 11.

Abstract: A printed circuit board comprising an insulating substrate, a via hole (16) formed in the insulating substrate, an implant material (15) filled in the via hole, and wiring patterns formed on the opposite surfaces of the substrates and electrically connected by the implant material, wherein the implant material is selected from a group consisting of acid-free copper, phosphorus-deoxidized copper and tough-pitch copper. Since the via hole comprises high-heat-resisting acid-free copper, phosphorus-deoxidized copper and tough-pitch copper, the printed circuit board is not likely to be deteriorated even when exposed, as is often the case, to a condition that heating/cooling between high temperatures and low temperatures is repeated, and can be used for an extended time while keeping an excellent heat resistance.

Abstract: A battery packet (50) comprises a battery case (51) formed by processing a battery case forming laminated sheet (10), a battery 50a contained in the battery case (51), and tabs (59, 60) extending outside from the battery case (51). The battery case forming laminated sheet (10) is formed by laminating a first base film layer (1a), i.e., an outermost layer, a metal foil layer (2), and a heat-adhesive resin layer (3) in that order. The first base film layer (1a) is a biaxially oriented polyethylene terephthalate resin film or a biaxially oriented nylon resin film. The metal foil layer (2) is an aluminum or copper foil. The heat-adhesive resin layer (3) is formed of a polyolefin resin, more preferably, of an acid-denatured polyolefin resin.

Abstract: The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, to thereby enhance reliability and productivity of a semiconductor chip mounting line, and also provides a method of producing the COF flexible printed wiring board. The COF flexible printed wiring board contains an insulating layer, a wiring pattern, on which a semiconductor chip being mounted, formed of a conductor layer provided on at least one side of the insulating layer and a releasing layer, wherein the releasing layer is formed from a releasing agent containing at least one species selected from a silane compound and silica sol and is provided on a surface of the insulating layer, which is opposite to the mounting side of the semiconductor chip.

Abstract: An integrated thin-film photoelectric conversion module includes a multi-layered film including a first electrode layer, a semiconductor layer and a second electrode layer stacked on a main surface of a substrate. The multi-layered film includes a cell region including a plurality of photoelectric conversion cells connected in series, a bypass diode region and a connection region. The connection region does not connect the bypass diode to the cell during reverse bias treatment of the cell and the bypass diode, while the connection region connects the bypass diode in antiparallel to at least one of the plurality of cells connected in series after the reverse bias treatment.

Abstract: A method for the manufacture of a Fresnel lens sheet is disclosed. The Fresnel lens sheet have arranged thereon a multiplicity of sawtooth-like Fresnel lenses composed of a Fresnel lens surface demonstrating a convex lens function and a rise surface located between the adjacent Fresnel lens surfaces. This sheet has a layer containing a light-diffusing material or a light-absorbing material on the rise surfaces. The method comprises the steps of, coating a photoresist on the Fresnel lens surfaces and rise surfaces, and forming the layer containing a light-diffusing material or a light-absorbing material on the rise surfaces by exposing the photoresist at mutually different light exposure doses per unit surface area on the Fresnel lens surfaces and rise surfaces.