Abstract: This invention provides an electrode on a heat-resisting and isolating substrate which is low-priced and has a stable character and the manufacturing process therefor. A paste which comprises 0.05 to 40 weight % of a metal material containing silver component of 0.5 to 100 weight % the remaining weight % of an organic vehicle, is formed on the substrate, and is heated at temperatures of 250.degree. to 900.degree. C. and consequently a metallic particle layer of 0.05 to 2 microns in thickness is formed on the substrate, and then an electrode of nickel and copper of 0.1 to 20 microns in thickness is built up on it by electroless plating.

Abstract: This invention provides an electrode on a heat-resisting and isolating substrate which is low-priced and has a stable character and the manufacturing process therefor. A paste which comprises 0.05 to 40 weight % of a metal material containing silver component of 0.5 to 100 weight % and the remaining weight % of an organic vehicle, is formed on the substrate, and is heated at temperatures of 250.degree. to 900.degree. C. and consequently a metallic particle layer of 0.05 to 2 microns in thickness is formed on the substrate, and then an electrode of nickel and copper of 0.1 to 20 microns in thickness is built up on it by electroless plating.

Abstract: Disclosed herein is a conductive paste useful for making conductors, including microcircuit conductors, and terminations for capacitors, resistors and piezo-electric transducer elements. The paste comprises an inert liquid vehicle having a metal powder and a glass powder both dispersed therein and is printed and fired in the conventional manner on dielectric substrates. The metal powder comprises an alloy powder, each particle comprising Cu, Al, and at least one of Zn and Ag. The first film of the paste is practically resistant to corrosion and practically conductive and the paste can be produced economically.

Abstract: This invention provides a method for electroless copper plating comprising: providing an electroless copper plating bath composition which comprises 0.005 to 0.3 mole per liter of a water soluble copper compound, 0.005 to 0.6 mole per liter of a cupric complexing agent, 0.02 to 3.0 mole per liter of formaldehyde, 0.01 to 1000 milligram per liter of additive agent selected from the group consisting of 2,2'-dipyridyl, 2,9-dimethyl-1,10-phenanthroline and 2-(2-phridyl)-benzimidazole, and alkaline compound to hold the pH of said aqueous solution 10.5 to 14 and immersing a material having catalytic action at the surface into said electroless copper plating bath composition kept at a temperature of 70.degree. to 90.degree. C whereby copper film with a high mechanical strength is deposited on said material.

Abstract: A connector which has bellows type contacts of spring metal and a holder which has a bottom, a longitudinal slot for receiving a circuit panel, a cavity for housing the bellows type contact, a hollow formed at upper portion of the cavity and partition wall for separating the adjacent contacts. The bellows type contact consists of a lower end portion, an attached portion, a first bent portion, a second bent portion, a straight portion, a third bent portion and an upper end portion. The straight portion is the portion contacting the panel circuit. The contact has a spring substrate which consists of phosphor bronze, a contact metal of tin or tin-lead alloy, and a layer of copper between the substrate and the contact metal. With the improved shape and material of the contact, there is provided better contact performance even for a contact of tin or tin-lead alloy which is very cheap compared to the conventional gold contact and it is thus advantageous for use in consumer type electric equipment.