Abstract: A case, a coil spring, a sliding disc and a rotational disc are contained, and the following construction is equipped. The case has a positioning recess portion on the inner wall thereof. On the peripheral surface of the sliding disc is provided a projecting portion which is engaged with the positioning recess portion of the case to suppress the rotation thereof with respect to the case. One end face of the sliding disc and one end face of the rotational disc are confronted to each other, and cam portions which are engaged with or separated from each other in connection with the rotation of the rotational disc are formed on both the confronting end faces. The cam portion formed on the sliding disc projects to the outside of the outer peripheral surface of the sliding disc.

Abstract: In a method of resin-sealing a semiconductor device having a circuit board with an IC thereon, a metal mold formed of upper and lower metal molds is prepared. The upper metal mold has a pressing member, and the lower metal mold has a cavity for mounting the circuit board therein, a pinpoint gate formed at a lower portion of the cavity and a runner section formed below the cavity and communicating with the pinpoint gate. The circuit board is positioned in the cavity of the lower metal mold, and is set such that the IC faces downward. A rear surface of the circuit board where the IC is not mounted is pressed by the pressing member, and a resin is filled in the cavity through the runner section and the pinpoint gate to thereby seal the IC mounted on the circuit board by the resin.