Patents by Inventor Katsuhiko Iwase

Katsuhiko Iwase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10504638
    Abstract: Provided are a thermistor and a device using the thermistor by which ohmic contact can be ensured between electrodes formed on a thermistor composition and wiring lines connected to the electrodes, and by which high accuracy temperature detection is possible. A thermistor is provided with a thermistor composition, a pair of electrodes that are formed on the thermistor composition and that contain a noble metal, wires that are joined to the electrodes and that have a passivation film formed on a surface thereof, and a junction material that contains a noble metal oxide which joins the electrodes to the wires.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: December 10, 2019
    Assignee: SEMITEC Corporation
    Inventor: Katsuhiko Iwase
  • Publication number: 20180374614
    Abstract: Provided are a thermistor and a device using the thermistor by which ohmic contact can be ensured between electrodes formed on a thermistor composition and wiring lines connected to the electrodes, and by which high accuracy temperature detection is possible. A thermistor is provided with a thermistor composition, a pair of electrodes that are formed on the thermistor composition and that contain a noble metal, wires that are joined to the electrodes and that have a passivation film formed on a surface thereof, and a junction material that contains a noble metal oxide which joins the electrodes to the wires.
    Type: Application
    Filed: December 13, 2016
    Publication date: December 27, 2018
    Applicant: SEMITEC Corporation
    Inventor: Katsuhiko IWASE
  • Patent number: 9715568
    Abstract: The wiring length measurement apparatus includes a distance calculation unit, by using a plurality of coordinates of bending points and a wiring width of CAD data of a high-density wiring including a meander wiring, seeking each endpoint that exists on an edge in a wiring width direction and is a flexion point of each inner circuit side, and calculating distances between each adjacent endpoint and a measurement unit measuring a wiring length of the high-density wiring by calculating a sum of the distances between each endpoint calculated by the distance calculation unit.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: July 25, 2017
    Assignee: LIQUID DESIGN SYSTEMS INC.
    Inventors: Shinichi Maeda, Katsuhiko Iwase
  • Publication number: 20160267213
    Abstract: The wiring length measurement apparatus includes a distance calculation unit, by using a plurality of coordinates of bending points and a wiring width of CAD data of a high-density wiring including a meander wiring, seeking each endpoint that exists on an edge in a wiring width direction and is a flexion point of each inner circuit side, and calculating distances between each adjacent endpoint and a measurement unit measuring a wiring length of the high-density wiring by calculating a sum of the distances between each endpoint calculated by the distance calculation unit.
    Type: Application
    Filed: June 6, 2014
    Publication date: September 15, 2016
    Inventors: Shinichi Maeda, Katsuhiko Iwase
  • Patent number: 4407179
    Abstract: Process and apparatus for cutting an elongate complex structure composed of materials having different properties, e.g. a liner and a core which are relatively soft and flexible and susceptible to rupture or crushing and a facing of hard material such as a metal plate. The facing may have an upwardly turned portion, flange portion and groove portion at each side thereof. A carriage and a base frame are movable in the direction of the travel of the complex structure and in the direction perpendicular thereto, respectively. Various types of cutters are mounted on the carriage. The complex structure is instantaneously cut in the direction of the width thereof while it is travelling at a high speed. The cut composite structure has smooth and fine cut edges, and is useful for e.g. a siding of a building.
    Type: Grant
    Filed: September 10, 1981
    Date of Patent: October 4, 1983
    Assignee: IG-Technical Research Inc.
    Inventors: Katsuhiko Iwase, Minoru Saito