Patents by Inventor Katsuhiko KAGAWA

Katsuhiko KAGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11864355
    Abstract: A thermal conductor includes a plurality of thermal conducting portions; and joint portions made of a material having flexibility and configured to join the respective thermal conducting portions with each other, having voids where neither the thermal conducting portion nor the joint portion is present, and satisfying a condition of 0.5?[(S1?S0)/S0]×100?20 when an area of the thermal conductor in a planar view in a first direction is expressed by S0 [cm2] and an area of the thermal conductor in the planar view in the first direction in a pressed state that the thermal conductor is pressed by 0.2 MPa in the first direction is expressed by S1 [cm2]. Accordingly, the thermal conductor satisfies both ensuring adhesiveness to a member in contact with the thermal conductor in use and suppressing excessive deformation of the thermal conductor in a compressed state.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: January 2, 2024
    Assignee: SHOWA MARUTSUTSU COMPANY, LTD.
    Inventors: Katsuhiko Kagawa, Takayuki Yamaguchi
  • Publication number: 20230328929
    Abstract: A thermal conductor includes a plurality of thermal conducting portions; and joint portions made of a material having flexibility and configured to join the respective thermal conducting portions with each other, having voids where neither the thermal conducting portion nor the joint portion is present, and satisfying a condition of 0.5 ? [(S1 -S0)/ S0] x 100 ? 20 when an area of the thermal conductor in a planar view in a first direction is expressed by SO [cm2] and an area of the thermal conductor in the planar view in the first direction in a pressed state that the thermal conductor is pressed by 0.2 MPa in the first direction is expressed by S1 [cm2]. Accordingly, the thermal conductor satisfies both ensuring adhesiveness to a member in contact with the thermal conductor in use and suppressing excessive deformation of the thermal conductor in a compressed state.
    Type: Application
    Filed: May 28, 2021
    Publication date: October 12, 2023
    Applicant: SHOWA MARUTSUTSU COMPANY, LTD.
    Inventors: Katsuhiko KAGAWA, Takayuki YAMAGUCHI
  • Publication number: 20220276011
    Abstract: A heat conducting sheet has an overall sheet structure with a plurality of heat conducting regions. Each heat conducting region is continuous between the two primary surfaces of the heat conducting sheet, and connecting regions connect adjacent side-walls of the plurality of heat conducting regions stacked laterally between the primary surfaces. The heat conducting regions include vacancies. The connecting regions consist of material that includes flexible resin material and unfilled layers are formed in part of the connecting regions. Some of the resin material can ingress into part of heat conducting region vacancies. This structure can achieve a highly elastic and flexible heat conducting sheet due to vacancies in the heat conducting regions and unfilled layers in the connecting region.
    Type: Application
    Filed: June 25, 2020
    Publication date: September 1, 2022
    Applicant: SHOWA MARUTSUTSU COMPANY, LTD.
    Inventors: Eiichi TOYA, Koji MATSUI, Yuya TOYOKAWA, Kazuki SHIBATA, Katsuhiko KAGAWA, Takayuki YAMAGUCHI