Patents by Inventor Katsuhiko Kamiya

Katsuhiko Kamiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190331736
    Abstract: A main object of the present disclosure is to provide a method for testing an all solid state battery with which the presence of short circuit or the presence of defect causing short circuit can be detected with high accuracy by a comparatively simple method in which a voltage is applied to a battery and the current value thereof is measured. The present disclosure achieves the object by providing a method for testing an all solid state battery, the method comprising steps of: a resistance increasing step of increasing resistance of an all solid state battery to 3.
    Type: Application
    Filed: April 17, 2019
    Publication date: October 31, 2019
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Katsuhiko Nagaya, Masato Kamiya, Shinobu Okayama
  • Publication number: 20190280350
    Abstract: A main object of the present disclosure is to provide a method for testing an all solid state battery with which the presence of short circuit or the presence of defect causing short circuit can be detected with high accuracy by a comparatively simple method in which a voltage is applied to a battery and the current value thereof is measured. The present disclosure achieves the object by providing a method for testing an all solid state battery, the method comprising steps of: a resistance increasing step of increasing resistance of an all solid state battery to 3.2*105 ?·cm2 or more; a voltage applying step of applying voltage to an all solid state battery of which the resistance is increased; and a judging step of judging acceptability of the all solid state battery based on a current value measured in the voltage applying step.
    Type: Application
    Filed: February 27, 2019
    Publication date: September 12, 2019
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Masato KAMIYA, Katsuhiko NAGAYA, Norihiro YAMADA, Shinobu OKAYAMA, Takayuki HOJO
  • Publication number: 20190111641
    Abstract: The invention relates to a functionalized laminated optical element comprising: —An optical base element; —A functional film structure consisting of a single layer or a multilayer structure; —A layer of a pressure-sensitive adhesive of optical quality, placed between one surface of the optical base element and the functional film structure so as to permanently retain said functional film structure on the surface of the optical base element. Said functionalized laminated optical element maintains its integrity after typical processing of an optical article which includes wheel edging. More particularly the invention relates to the use of a specific adhesive system for improving the wheel edging resistance of functionalized laminated optical element. The functional laminated optical may be an ophthalmic lens.
    Type: Application
    Filed: March 29, 2016
    Publication date: April 18, 2019
    Inventors: Violaine COUE, Catherine BERGER, Manuela DESOUSA, Tatsuya SUZUKI, Katsuhiko KAMIYA, Kiyoe SHIGETOMI, Shinji HOSHINO, Junichi NAKAYAMA
  • Patent number: 9657197
    Abstract: A pressure-sensitive adhesive of the invention include a (meth)acryl-based polymer obtained by polymerization of a monomer component including 30 to 99.5% by weight of an alkyl (meth)acrylate having an alkyl group of 10 to 18 carbon atoms at an ester end and 0.5 to 50% by weight of a cyclic nitrogen-containing monomer. The pressure-sensitive adhesive has a satisfactory level of adhesive performance and can form a pressure-sensitive adhesive layer with a lower dielectric constant and reliable moisture resistance.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: May 23, 2017
    Assignee: NITTO DENKO CORPORATION
    Inventors: Masatsugu Higashi, Kiyoe Shigetomi, Koji Shitara, Akiko Tanaka, Katsuhiko Kamiya, Azusa Iseki
  • Patent number: 9650547
    Abstract: Provided is a pressure-sensitive adhesive capable of realizing a pressure-sensitive adhesive layer having satisfactory adhesion performance and a high ink step absorbability. A radiation-curable pressure-sensitive adhesive, which contains a (meth)acryl-based polymer obtained by polymerizing a monomer component containing 30 to 90% by weight of an alkyl(meth)acrylate having an alkyl group of 10 to 22 carbon atoms at an ester end, and having a radically polymerizable functional group containing a carbon-carbon double bond.
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: May 16, 2017
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kiyoe Shigetomi, Shou Takarada, Masahiko Ando, Katsuhiko Kamiya, Takahiro Nonaka
  • Publication number: 20170002235
    Abstract: A pressure-sensitive adhesive of the invention include a (meth)acryl-based polymer obtained by polymerization of a monomer component including 30 to 99.5% by weight of an alkyl (meth)acrylate having an alkyl group of 10 to 18 carbon atoms at an ester end and 0.5 to 50% by weight of a cyclic nitrogen-containing monomer. The pressure-sensitive adhesive has a satisfactory level of adhesive performance and can form a pressure-sensitive adhesive layer with a lower dielectric constant and reliable moisture resistance.
    Type: Application
    Filed: September 15, 2016
    Publication date: January 5, 2017
    Applicant: NITTO DENKO CORPORATION
    Inventors: Masatsugu HIGASHI, Kiyoe SHIGETOMI, Koji SHITARA, Akiko TANAKA, Katsuhiko KAMIYA, Azusa ISEKI
  • Patent number: 9527944
    Abstract: Provided is a pressure-sensitive adhesive layer for a transparent conductive film having a patterned transparent conductive thin film, which has transparent as the pressure-sensitive adhesive layer for transparent conductive film and can prevent the patterned transparent conductive thin film from degrading the appearance of the conductive film. A pressure-sensitive adhesive layer for a transparent conductive film having a patterned transparent conductive thin film, wherein the pressure-sensitive adhesive layer is made from an acrylic pressure-sensitive adhesive composition containing: 100 parts by weight of an acryl-based polymer obtained by polymerization of a monomer component including an alkyl(meth)acrylate; and 30 to 150 parts by weight of a styrene-based oligomer, the pressure-sensitive adhesive layer has a refractive index of 1.50 or more, the pressure-sensitive adhesive layer has a haze of 2% or less as measured at a thickness of 30 ?m.
    Type: Grant
    Filed: December 4, 2012
    Date of Patent: December 27, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Akiko Tanaka, Aimi Matsuura, Katsuhiko Kamiya, Masatsugu Higashi, Mizue Yamasaki
  • Publication number: 20160369136
    Abstract: Provided is a PSA composition for forming a PSA comprising a (meth)acrylic polymer, comprising, as monomeric components constituting the (meth)acrylic polymer: (A) a C2-18 alkyl (meth)acrylate, (B) an alicyclic monomer, and (C) a monomer having at least either a hydroxyl group or a carboxyl group. The average number of carbons of alkyl group in the (A) is 8 or less. The monomeric components comprise the (C) at 3% by weight or greater while the weights Wb and Wc of the (B) and (C) satisfy a relationship 0.8?Wb/Wc.
    Type: Application
    Filed: June 14, 2016
    Publication date: December 22, 2016
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tatsuya SUZUKI, Katsuhiko KAMIYA, Kiyoe SHIGETOMI, Shinji HOSHINO
  • Publication number: 20150010754
    Abstract: A pressure-sensitive adhesive of the present invention comprises a (meth)acryl-based polymer obtained by polymerization of a monomer component containing 40 to 99.5% by weight of an alkyl (meth)acrylate having an alkyl group of 10 to 18 carbon atoms at an ester end and more than 0 to 50% by weight or less of an alicyclic structure-containing monomer. The pressure-sensitive adhesive is capable of forming a pressure-sensitive adhesive layer that has a sufficiently low level of dielectric constant and a satisfactory level of adhesion performance.
    Type: Application
    Filed: November 27, 2012
    Publication date: January 8, 2015
    Applicant: NITTO DENKO CORPORATION
    Inventors: Masatsugu Higashi, Azusa Iseki, Akiko Tanaka, Katsuhiko Kamiya
  • Publication number: 20140272201
    Abstract: It is an object of the invention to provide a pressure-sensitive adhesive capable of forming a pressure-sensitive adhesive layer having high resistance to sebum and high resistance to moisture-induced clouding and also having low dielectric constant. The invention relates to a pressure-sensitive adhesive comprising a (meth)acryl-based polymer obtained by polymerization of a monomer component containing 65 to 88 parts by weight of an alkyl (meth)acrylate having an alkyl group of 8 to 22 carbon atoms and 12 to 35 parts by weight of an alkyl (meth)acrylate having a secondary hydroxyl group based on 100 parts by weight of the total amount of the alkyl (meth)acrylate having an alkyl group of 8 to 22 carbon atoms and the alkyl (meth)acrylate having a secondary hydroxyl group.
    Type: Application
    Filed: March 10, 2014
    Publication date: September 18, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Ai TAKEDA, Katsuhiko KAMIYA, Kiyoe SHIGETOMI, Takahiro NONAKA
  • Publication number: 20140248489
    Abstract: A pressure-sensitive adhesive of the invention include a (meth)acryl-based polymer obtained by polymerization of a monomer component including 30 to 99.5% by weight of an alkyl (meth)acrylate having an alkyl group of 10 to 18 carbon atoms at an ester end and 0.5 to 50% by weight of a cyclic nitrogen-containing monomer. The pressure-sensitive adhesive has a satisfactory level of adhesive performance and can form a pressure-sensitive adhesive layer with a lower dielectric constant and reliable moisture resistance.
    Type: Application
    Filed: September 12, 2012
    Publication date: September 4, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Masatsugu Higashi, Kiyoe Shigetomi, Koji Shitara, Akiko Tanaka, Katsuhiko Kamiya, Azusa Iseki
  • Publication number: 20140039128
    Abstract: An object of the present invention is to provide a radiation-curable pressure-sensitive adhesive layer that satisfies both reworkability and adhesion reliance. Further, another object of the present invention is to provide a pressure-sensitive adhesive sheet containing the radiation-curable pressure-sensitive adhesive layer. The invention relates to a radiation-curable pressure-sensitive adhesive layer, which has an adhesive strength of 1.0 N/20 mm or less before radiation curing and an adhesive strength of 3.0 N/20 mm or more after radiation curing, and a peeling adhesive strength of 40.0 N/(20 mm×20 mm) or less before radiation curing, to an acrylic plate.
    Type: Application
    Filed: July 30, 2013
    Publication date: February 6, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kiyoe Shigetomi, Shou Takarada, Masahiko Ando, Katsuhiko Kamiya, Takahiro Nonaka, Shinya Yamamoto
  • Publication number: 20140037952
    Abstract: Provided is a pressure-sensitive adhesive capable of realizing a pressure-sensitive adhesive layer having satisfactory adhesion performance and a high ink step absorbability. A radiation-curable pressure-sensitive adhesive, which contains a (meth)acryl-based polymer obtained by polymerizing a monomer component containing 30 to 90% by weight of an alkyl(meth)acrylate having an alkyl group of 10 to 22 carbon atoms at an ester end, and having a radically polymerizable functional group containing a carbon-carbon double bond.
    Type: Application
    Filed: July 30, 2013
    Publication date: February 6, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kiyoe SHIGETOMI, Shou TAKARADA, Masahiko ANDO, Katsuhiko KAMIYA, Takahiro NONAKA
  • Patent number: 8617928
    Abstract: Provided is a dicing die-bonding film which is excellent in balance between retention of a semiconductor wafer upon dicing and releasability upon picking up. Disclosed is a dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a substrate material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer including an acrylic acid ester as a main monomer, 10 to 40 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and is also cured by irradiation with ultraviolet rays under predetermined conditions after film formation on the substrate material, and wherein the die-bonding film contains an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays.
    Type: Grant
    Filed: December 16, 2008
    Date of Patent: December 31, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Katsuhiko Kamiya, Takeshi Matsumura, Shuuhei Murata, Hironao Ootake
  • Publication number: 20130273361
    Abstract: Provided is an active energy ray-curable pressure-sensitive adhesive for re-release, which has a small influence on an environment or a human body, can be easily handled, can largely change its pressure-sensitive adhesiveness before and after irradiation with an active energy ray, and can express high pressure-sensitive adhesiveness before the irradiation with the active energy ray and express high releasability after the irradiation with the active energy ray. The active energy ray-curable pressure-sensitive adhesive for re-release includes an active energy ray-curable polymer (P), in which the polymer (P) includes one of a polymer obtained by causing a carboxyl group-containing polymer (P3) and an oxazoline group-containing monomer (m3) to react with each other, and a polymer obtained by causing an oxazoline group-containing polymer (P4) and a carboxyl group-containing monomer (m2) to react with each other.
    Type: Application
    Filed: June 11, 2013
    Publication date: October 17, 2013
    Inventors: Katsuhiko KAMIYA, Tomokazu Takahashi, Chie Kitano, Mika Okada, Takeshi Matsumura, Shuhei Murata, Hironao Otake, Masatsugu Koso
  • Publication number: 20130251990
    Abstract: A pressure-sensitive adhesive of the invention includes a (meth)acryl-based polymer obtained by polymerization of a monomer component including: an alkyl(meth)acrylate (a1) having a branched alkyl group of 8 to 24 carbon atoms at an ester end; and an alkyl(meth)acrylate (a2) having a linear alkyl group of 8 to 24 carbon atoms at an ester end. The pressure-sensitive adhesive can has a satisfactory level of adhesive performance and can form a pressure-sensitive adhesive layer with a lower dielectric constant.
    Type: Application
    Filed: March 20, 2013
    Publication date: September 26, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Masatsugu HIGASHI, Koji SHITARA, Akiko TANAKA, Katsuhiko KAMIYA
  • Publication number: 20120277368
    Abstract: The present invention relates to an aqueous dispersion pressure-sensitive adhesive composition containing: an acrylic emulsion polymer (A); and a compound (B) in which the compound (B) has a solubility in water (25° C.) of 1 g/100 g or more, and has, in the molecule, at least one nitrogen atom and two or more substituents represented by the following formula (1) and bonded to the nitrogen atom: (wherein R represents a divalent group selected from the group consisting of linear or branched alkylene having a carbon number of 1 to 10, phenylene, alkyl group-substituted phenylene, halogen-substituted phenylene, and heteroatom-containing alkylene).
    Type: Application
    Filed: April 27, 2012
    Publication date: November 1, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Masatsugu KOSO, Katsuhiko KAMIYA, Hironao OOTAKE
  • Patent number: 8119236
    Abstract: A dicing die-bonding film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic polymer comprising acrylic ester A represented by CH2?CHCOOR1 (where R1 is an alkyl group having 6-10 carbon atoms), acrylic ester B represented by CH2?CHCOOR2 (where R2 is an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond where the ratios of components are 40-10 mol % of the acrylic ester B with respect to 60-90 mol % of the acrylic ester A, 10-30 mol % hydroxyl group-containing monomer with respect to 100 mol % of the total of the acrylic ester A and the acrylic ester B, and 70-90 mol % isocyanate compound with respect to 100 mol % of the monomer containing a hydroxl group.
    Type: Grant
    Filed: July 31, 2009
    Date of Patent: February 21, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Katsuhiko Kamiya, Takeshi Matsumura, Shuuhei Murata, Hironao Ootake
  • Publication number: 20120003470
    Abstract: Provided is an active energy ray-curable pressure-sensitive adhesive for re-release, which has a small influence on an environment or a human body, can be easily handled, can largely change its pressure-sensitive adhesiveness before and after irradiation with an active energy ray, and can express high pressure-sensitive adhesiveness before the irradiation with the active energy ray and express high releasability after the irradiation with the active energy ray. The active energy ray-curable pressure-sensitive adhesive for re-release includes an active energy ray-curable polymer (P), in which the polymer (P) includes one of a polymer obtained by causing a carboxyl group-containing polymer (P3) and an oxazoline group-containing monomer (m3) to react with each other, and a polymer obtained by causing an oxazoline group-containing polymer (P4) and a carboxyl group-containing monomer (m2) to react with each other.
    Type: Application
    Filed: July 5, 2011
    Publication date: January 5, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Katsuhiko KAMIYA, Tomokazu TAKAHASHI, Chie KITANO, Mika OKADA, Takeshi MATSUMURA, Shuhei MURATA, Hironao OTAKE, Masatsugu KOSO
  • Publication number: 20110104873
    Abstract: Provided is a dicing die-bonding film which is excellent in balance between retention of a semiconductor wafer upon dicing and releasability upon picking up. Disclosed is a dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a substrate material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer including an acrylic acid ester as a main monomer, 10 to 40 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and is also cured by irradiation with ultraviolet rays under predetermined conditions after film formation on the substrate material, and wherein the die-bonding film contains an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays.
    Type: Application
    Filed: December 16, 2008
    Publication date: May 5, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Katsuhiko Kamiya, Takeshi Matsumura, Shuuhei Murata, Hironao Ootake