Patents by Inventor Katsuhiko Kamiya
Katsuhiko Kamiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11772343Abstract: The invention relates to a functionalized laminated optical element comprising: —An optical base element; —A functional film structure consisting of a single layer or a multilayer structure; —A layer of a pressure-sensitive adhesive of optical quality, placed between one surface of the optical base element and the functional film structure so as to permanently retain said functional film structure on the surface of the optical base element. Said functionalized laminated optical element maintains its integrity after typical processing of an optical article which includes wheel edging. More particularly the invention relates to the use of a specific adhesive system for improving the wheel edging resistance of functionalized laminated optical element. The functional laminated optical may be an ophthalmic lens.Type: GrantFiled: March 29, 2016Date of Patent: October 3, 2023Assignee: Essilor InternationalInventors: Violaine Coue, Catherine Berger, Manuela Desousa, Tatsuya Suzuki, Katsuhiko Kamiya, Kiyoe Shigetomi, Shinji Hoshino, Junichi Nakayama
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Patent number: 10836937Abstract: Provided is a PSA composition for forming a PSA comprising a (meth)acrylic polymer, comprising, as monomeric components constituting the (meth)acrylic polymer: (A) a C2-18 alkyl (meth)acrylate, (B) an alicyclic monomer, and (C) a monomer having at least either a hydroxyl group or a carboxyl group. The average number of carbons of alkyl group in the (A) is 8 or less. The monomeric components comprise the (C) at 3% by weight or greater while the weights Wb and Wc of the (B) and (C) satisfy a relationship 0.8?Wb/Wc.Type: GrantFiled: June 14, 2016Date of Patent: November 17, 2020Assignee: NITTO DENKO CORPORATIONInventors: Tatsuya Suzuki, Katsuhiko Kamiya, Kiyoe Shigetomi, Shinji Hoshino
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Publication number: 20190111641Abstract: The invention relates to a functionalized laminated optical element comprising: —An optical base element; —A functional film structure consisting of a single layer or a multilayer structure; —A layer of a pressure-sensitive adhesive of optical quality, placed between one surface of the optical base element and the functional film structure so as to permanently retain said functional film structure on the surface of the optical base element. Said functionalized laminated optical element maintains its integrity after typical processing of an optical article which includes wheel edging. More particularly the invention relates to the use of a specific adhesive system for improving the wheel edging resistance of functionalized laminated optical element. The functional laminated optical may be an ophthalmic lens.Type: ApplicationFiled: March 29, 2016Publication date: April 18, 2019Inventors: Violaine COUE, Catherine BERGER, Manuela DESOUSA, Tatsuya SUZUKI, Katsuhiko KAMIYA, Kiyoe SHIGETOMI, Shinji HOSHINO, Junichi NAKAYAMA
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Patent number: 9657197Abstract: A pressure-sensitive adhesive of the invention include a (meth)acryl-based polymer obtained by polymerization of a monomer component including 30 to 99.5% by weight of an alkyl (meth)acrylate having an alkyl group of 10 to 18 carbon atoms at an ester end and 0.5 to 50% by weight of a cyclic nitrogen-containing monomer. The pressure-sensitive adhesive has a satisfactory level of adhesive performance and can form a pressure-sensitive adhesive layer with a lower dielectric constant and reliable moisture resistance.Type: GrantFiled: September 12, 2012Date of Patent: May 23, 2017Assignee: NITTO DENKO CORPORATIONInventors: Masatsugu Higashi, Kiyoe Shigetomi, Koji Shitara, Akiko Tanaka, Katsuhiko Kamiya, Azusa Iseki
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Patent number: 9650547Abstract: Provided is a pressure-sensitive adhesive capable of realizing a pressure-sensitive adhesive layer having satisfactory adhesion performance and a high ink step absorbability. A radiation-curable pressure-sensitive adhesive, which contains a (meth)acryl-based polymer obtained by polymerizing a monomer component containing 30 to 90% by weight of an alkyl(meth)acrylate having an alkyl group of 10 to 22 carbon atoms at an ester end, and having a radically polymerizable functional group containing a carbon-carbon double bond.Type: GrantFiled: July 30, 2013Date of Patent: May 16, 2017Assignee: NITTO DENKO CORPORATIONInventors: Kiyoe Shigetomi, Shou Takarada, Masahiko Ando, Katsuhiko Kamiya, Takahiro Nonaka
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Publication number: 20170002235Abstract: A pressure-sensitive adhesive of the invention include a (meth)acryl-based polymer obtained by polymerization of a monomer component including 30 to 99.5% by weight of an alkyl (meth)acrylate having an alkyl group of 10 to 18 carbon atoms at an ester end and 0.5 to 50% by weight of a cyclic nitrogen-containing monomer. The pressure-sensitive adhesive has a satisfactory level of adhesive performance and can form a pressure-sensitive adhesive layer with a lower dielectric constant and reliable moisture resistance.Type: ApplicationFiled: September 15, 2016Publication date: January 5, 2017Applicant: NITTO DENKO CORPORATIONInventors: Masatsugu HIGASHI, Kiyoe SHIGETOMI, Koji SHITARA, Akiko TANAKA, Katsuhiko KAMIYA, Azusa ISEKI
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Patent number: 9527944Abstract: Provided is a pressure-sensitive adhesive layer for a transparent conductive film having a patterned transparent conductive thin film, which has transparent as the pressure-sensitive adhesive layer for transparent conductive film and can prevent the patterned transparent conductive thin film from degrading the appearance of the conductive film. A pressure-sensitive adhesive layer for a transparent conductive film having a patterned transparent conductive thin film, wherein the pressure-sensitive adhesive layer is made from an acrylic pressure-sensitive adhesive composition containing: 100 parts by weight of an acryl-based polymer obtained by polymerization of a monomer component including an alkyl(meth)acrylate; and 30 to 150 parts by weight of a styrene-based oligomer, the pressure-sensitive adhesive layer has a refractive index of 1.50 or more, the pressure-sensitive adhesive layer has a haze of 2% or less as measured at a thickness of 30 ?m.Type: GrantFiled: December 4, 2012Date of Patent: December 27, 2016Assignee: NITTO DENKO CORPORATIONInventors: Akiko Tanaka, Aimi Matsuura, Katsuhiko Kamiya, Masatsugu Higashi, Mizue Yamasaki
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Publication number: 20160369136Abstract: Provided is a PSA composition for forming a PSA comprising a (meth)acrylic polymer, comprising, as monomeric components constituting the (meth)acrylic polymer: (A) a C2-18 alkyl (meth)acrylate, (B) an alicyclic monomer, and (C) a monomer having at least either a hydroxyl group or a carboxyl group. The average number of carbons of alkyl group in the (A) is 8 or less. The monomeric components comprise the (C) at 3% by weight or greater while the weights Wb and Wc of the (B) and (C) satisfy a relationship 0.8?Wb/Wc.Type: ApplicationFiled: June 14, 2016Publication date: December 22, 2016Applicant: NITTO DENKO CORPORATIONInventors: Tatsuya SUZUKI, Katsuhiko KAMIYA, Kiyoe SHIGETOMI, Shinji HOSHINO
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Publication number: 20150010754Abstract: A pressure-sensitive adhesive of the present invention comprises a (meth)acryl-based polymer obtained by polymerization of a monomer component containing 40 to 99.5% by weight of an alkyl (meth)acrylate having an alkyl group of 10 to 18 carbon atoms at an ester end and more than 0 to 50% by weight or less of an alicyclic structure-containing monomer. The pressure-sensitive adhesive is capable of forming a pressure-sensitive adhesive layer that has a sufficiently low level of dielectric constant and a satisfactory level of adhesion performance.Type: ApplicationFiled: November 27, 2012Publication date: January 8, 2015Applicant: NITTO DENKO CORPORATIONInventors: Masatsugu Higashi, Azusa Iseki, Akiko Tanaka, Katsuhiko Kamiya
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Publication number: 20140272201Abstract: It is an object of the invention to provide a pressure-sensitive adhesive capable of forming a pressure-sensitive adhesive layer having high resistance to sebum and high resistance to moisture-induced clouding and also having low dielectric constant. The invention relates to a pressure-sensitive adhesive comprising a (meth)acryl-based polymer obtained by polymerization of a monomer component containing 65 to 88 parts by weight of an alkyl (meth)acrylate having an alkyl group of 8 to 22 carbon atoms and 12 to 35 parts by weight of an alkyl (meth)acrylate having a secondary hydroxyl group based on 100 parts by weight of the total amount of the alkyl (meth)acrylate having an alkyl group of 8 to 22 carbon atoms and the alkyl (meth)acrylate having a secondary hydroxyl group.Type: ApplicationFiled: March 10, 2014Publication date: September 18, 2014Applicant: NITTO DENKO CORPORATIONInventors: Ai TAKEDA, Katsuhiko KAMIYA, Kiyoe SHIGETOMI, Takahiro NONAKA
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Publication number: 20140248489Abstract: A pressure-sensitive adhesive of the invention include a (meth)acryl-based polymer obtained by polymerization of a monomer component including 30 to 99.5% by weight of an alkyl (meth)acrylate having an alkyl group of 10 to 18 carbon atoms at an ester end and 0.5 to 50% by weight of a cyclic nitrogen-containing monomer. The pressure-sensitive adhesive has a satisfactory level of adhesive performance and can form a pressure-sensitive adhesive layer with a lower dielectric constant and reliable moisture resistance.Type: ApplicationFiled: September 12, 2012Publication date: September 4, 2014Applicant: NITTO DENKO CORPORATIONInventors: Masatsugu Higashi, Kiyoe Shigetomi, Koji Shitara, Akiko Tanaka, Katsuhiko Kamiya, Azusa Iseki
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Publication number: 20140039128Abstract: An object of the present invention is to provide a radiation-curable pressure-sensitive adhesive layer that satisfies both reworkability and adhesion reliance. Further, another object of the present invention is to provide a pressure-sensitive adhesive sheet containing the radiation-curable pressure-sensitive adhesive layer. The invention relates to a radiation-curable pressure-sensitive adhesive layer, which has an adhesive strength of 1.0 N/20 mm or less before radiation curing and an adhesive strength of 3.0 N/20 mm or more after radiation curing, and a peeling adhesive strength of 40.0 N/(20 mm×20 mm) or less before radiation curing, to an acrylic plate.Type: ApplicationFiled: July 30, 2013Publication date: February 6, 2014Applicant: NITTO DENKO CORPORATIONInventors: Kiyoe Shigetomi, Shou Takarada, Masahiko Ando, Katsuhiko Kamiya, Takahiro Nonaka, Shinya Yamamoto
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Publication number: 20140037952Abstract: Provided is a pressure-sensitive adhesive capable of realizing a pressure-sensitive adhesive layer having satisfactory adhesion performance and a high ink step absorbability. A radiation-curable pressure-sensitive adhesive, which contains a (meth)acryl-based polymer obtained by polymerizing a monomer component containing 30 to 90% by weight of an alkyl(meth)acrylate having an alkyl group of 10 to 22 carbon atoms at an ester end, and having a radically polymerizable functional group containing a carbon-carbon double bond.Type: ApplicationFiled: July 30, 2013Publication date: February 6, 2014Applicant: NITTO DENKO CORPORATIONInventors: Kiyoe SHIGETOMI, Shou TAKARADA, Masahiko ANDO, Katsuhiko KAMIYA, Takahiro NONAKA
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Patent number: 8617928Abstract: Provided is a dicing die-bonding film which is excellent in balance between retention of a semiconductor wafer upon dicing and releasability upon picking up. Disclosed is a dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a substrate material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer including an acrylic acid ester as a main monomer, 10 to 40 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and is also cured by irradiation with ultraviolet rays under predetermined conditions after film formation on the substrate material, and wherein the die-bonding film contains an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays.Type: GrantFiled: December 16, 2008Date of Patent: December 31, 2013Assignee: Nitto Denko CorporationInventors: Katsuhiko Kamiya, Takeshi Matsumura, Shuuhei Murata, Hironao Ootake
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Publication number: 20130273361Abstract: Provided is an active energy ray-curable pressure-sensitive adhesive for re-release, which has a small influence on an environment or a human body, can be easily handled, can largely change its pressure-sensitive adhesiveness before and after irradiation with an active energy ray, and can express high pressure-sensitive adhesiveness before the irradiation with the active energy ray and express high releasability after the irradiation with the active energy ray. The active energy ray-curable pressure-sensitive adhesive for re-release includes an active energy ray-curable polymer (P), in which the polymer (P) includes one of a polymer obtained by causing a carboxyl group-containing polymer (P3) and an oxazoline group-containing monomer (m3) to react with each other, and a polymer obtained by causing an oxazoline group-containing polymer (P4) and a carboxyl group-containing monomer (m2) to react with each other.Type: ApplicationFiled: June 11, 2013Publication date: October 17, 2013Inventors: Katsuhiko KAMIYA, Tomokazu Takahashi, Chie Kitano, Mika Okada, Takeshi Matsumura, Shuhei Murata, Hironao Otake, Masatsugu Koso
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Publication number: 20130251990Abstract: A pressure-sensitive adhesive of the invention includes a (meth)acryl-based polymer obtained by polymerization of a monomer component including: an alkyl(meth)acrylate (a1) having a branched alkyl group of 8 to 24 carbon atoms at an ester end; and an alkyl(meth)acrylate (a2) having a linear alkyl group of 8 to 24 carbon atoms at an ester end. The pressure-sensitive adhesive can has a satisfactory level of adhesive performance and can form a pressure-sensitive adhesive layer with a lower dielectric constant.Type: ApplicationFiled: March 20, 2013Publication date: September 26, 2013Applicant: NITTO DENKO CORPORATIONInventors: Masatsugu HIGASHI, Koji SHITARA, Akiko TANAKA, Katsuhiko KAMIYA
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Publication number: 20120277368Abstract: The present invention relates to an aqueous dispersion pressure-sensitive adhesive composition containing: an acrylic emulsion polymer (A); and a compound (B) in which the compound (B) has a solubility in water (25° C.) of 1 g/100 g or more, and has, in the molecule, at least one nitrogen atom and two or more substituents represented by the following formula (1) and bonded to the nitrogen atom: (wherein R represents a divalent group selected from the group consisting of linear or branched alkylene having a carbon number of 1 to 10, phenylene, alkyl group-substituted phenylene, halogen-substituted phenylene, and heteroatom-containing alkylene).Type: ApplicationFiled: April 27, 2012Publication date: November 1, 2012Applicant: NITTO DENKO CORPORATIONInventors: Masatsugu KOSO, Katsuhiko KAMIYA, Hironao OOTAKE
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Patent number: 8119236Abstract: A dicing die-bonding film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic polymer comprising acrylic ester A represented by CH2?CHCOOR1 (where R1 is an alkyl group having 6-10 carbon atoms), acrylic ester B represented by CH2?CHCOOR2 (where R2 is an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond where the ratios of components are 40-10 mol % of the acrylic ester B with respect to 60-90 mol % of the acrylic ester A, 10-30 mol % hydroxyl group-containing monomer with respect to 100 mol % of the total of the acrylic ester A and the acrylic ester B, and 70-90 mol % isocyanate compound with respect to 100 mol % of the monomer containing a hydroxl group.Type: GrantFiled: July 31, 2009Date of Patent: February 21, 2012Assignee: Nitto Denko CorporationInventors: Katsuhiko Kamiya, Takeshi Matsumura, Shuuhei Murata, Hironao Ootake
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Publication number: 20120003470Abstract: Provided is an active energy ray-curable pressure-sensitive adhesive for re-release, which has a small influence on an environment or a human body, can be easily handled, can largely change its pressure-sensitive adhesiveness before and after irradiation with an active energy ray, and can express high pressure-sensitive adhesiveness before the irradiation with the active energy ray and express high releasability after the irradiation with the active energy ray. The active energy ray-curable pressure-sensitive adhesive for re-release includes an active energy ray-curable polymer (P), in which the polymer (P) includes one of a polymer obtained by causing a carboxyl group-containing polymer (P3) and an oxazoline group-containing monomer (m3) to react with each other, and a polymer obtained by causing an oxazoline group-containing polymer (P4) and a carboxyl group-containing monomer (m2) to react with each other.Type: ApplicationFiled: July 5, 2011Publication date: January 5, 2012Applicant: NITTO DENKO CORPORATIONInventors: Katsuhiko KAMIYA, Tomokazu TAKAHASHI, Chie KITANO, Mika OKADA, Takeshi MATSUMURA, Shuhei MURATA, Hironao OTAKE, Masatsugu KOSO
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Publication number: 20110104873Abstract: Provided is a dicing die-bonding film which is excellent in balance between retention of a semiconductor wafer upon dicing and releasability upon picking up. Disclosed is a dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a substrate material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer including an acrylic acid ester as a main monomer, 10 to 40 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and is also cured by irradiation with ultraviolet rays under predetermined conditions after film formation on the substrate material, and wherein the die-bonding film contains an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays.Type: ApplicationFiled: December 16, 2008Publication date: May 5, 2011Applicant: NITTO DENKO CORPORATIONInventors: Katsuhiko Kamiya, Takeshi Matsumura, Shuuhei Murata, Hironao Ootake