Patents by Inventor Katsuhiko Kikuchi
Katsuhiko Kikuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170021691Abstract: A steel, having a high corrosion resistance and low-temperature toughness, for a vehicle suspension spring part, the steel includes 0.21 to 0.35% by mass of C, more than 0.6% by mass but 1.5% by mass or less of Si, 1 to 3% by mass of Mn, 0.3 to 0.8% by mass of Cr, 0.005 to 0.080% by mass of sol. Al, 0.005 to 0.060% by mass of Ti, 0.005 to 0.060% by mass of Nb, not more than 150 ppm of N, not more than 0.035% by mass of P, not more than 0.035% by mass of S, 0.01 to 1.00% by mass of Cu, and 0.01 to 1.00% by mass of Ni, the balance being Fe and unavoidable impurities, with Ti+Nb?0.07% by mass, wherein crystal grains of the steel after hardening have a prior austenite grain size number of 7.5 to 10.5, and the steel having a tensile strength of not less than 1,300 MPa.Type: ApplicationFiled: September 26, 2016Publication date: January 26, 2017Applicants: NHK SPRING CO., LTD., JFE BARS & SHAPES CORPORATIONInventors: Akira TANGE, Kiyoshi KURIMOTO, Yurika GOTO, Katsuhiko KIKUCHI, Kunikazu TOMITA, Kazuaki FUKUOKA, Kazuaki HATTORI
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Patent number: 9411036Abstract: A light source position detection apparatus (10) has a condensing lens (32) that condenses light emitted from the sun, an image pickup device (33) that receives the light condensed by the condensing lens (32), and a CPU (21) that detects the position of the sun based on per-pixel light reception information received by the image pickup device (33), and the CPU (21) changes the shutter speed of the image pickup device (33) and adjusts the quantity of the light received by the image pickup device in response to the quantity of light emitted from the sun. The light source position detection apparatus (10) can detect the position of a light source with high accuracy, and can detect the position of the light source with high accuracy even when the light source is hidden behind clouds, for example.Type: GrantFiled: December 14, 2012Date of Patent: August 9, 2016Assignees: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, ISHIKAWA TRADING CO., LTDInventors: Sanekazu Igari, Katsuhiko Kikuchi, Toshio Shiomi, Hideo Ishikawa
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Publication number: 20150309153Abstract: A light source position detection apparatus (10) has a condensing lens (32) that condenses light emitted from the sun, an image pickup device (33) that receives the light condensed by the condensing lens (32), and a CPU (21) that detects the position of the sun based on per-pixel light reception information received by the image pickup device (33), and the CPU (21) changes the shutter speed of the image pickup device (33) and adjusts the quantity of the light received by the image pickup device in response to the quantity of light emitted from the sun. The light source position detection apparatus (10) can detect the position of a light source with high accuracy, and can detect the position of the light source with high accuracy even when the light source is hidden behind clouds, for example.Type: ApplicationFiled: December 14, 2012Publication date: October 29, 2015Applicant: National Institute of Advanced Industrial Science and TechnologyInventors: Sanekazu IGARI, Katsuhiko KIKUCHI, Toshi SHIOMI, Hideo ISHIKAWA
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Publication number: 20140060709Abstract: Steel, excellent in corrosion resistance and low-temperature toughness, for a vehicle suspension spring part, includes 0.15 to 0.35% by mass of C, more than 0.6% by mass but 1.5% by mass or less of Si, 1 to 3% by mass of Mn, 0.3 to 0.8% by mass of Cr, 0.005 to 0.080% by mass of sol. Al, 0.005 to 0.060% by mass of Ti, 0.005 to 0.060% by mass of Nb, not more than 150 ppm of N, not more than 0.035% by mass of P, not more than 0.035% by mass of S, 0.01 to 1.00% by mass of Cu, and 0.01 to 1.00% by mass of Ni, the balance consisting of Fe and unavoidable impurities, with Ti+Nb?0.07% by mass. The steel has a tensile strength of not less than 1,300 MPa.Type: ApplicationFiled: November 11, 2013Publication date: March 6, 2014Applicants: JFE BARS & SHAPES CORPORATION, NHK SPRING CO., LTD.Inventors: Akira TANGE, Kiyoshi KURIMOTO, Yurika GOTO, Katsuhiko KIKUCHI, Kunikazu TOMITA, Kazuaki FUKUOKA, Kazuaki HATTORI
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Patent number: 8242587Abstract: An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.Type: GrantFiled: July 22, 2008Date of Patent: August 14, 2012Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.Inventors: Hiromichi Ebine, Katsuhiko Kikuchi, Satoshi Shimada, Masahide Hayashi
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Patent number: 8206521Abstract: According to one embodiment, a high-strength stabilizer steel for vehicles having excellent corrosion resistance and low-temperature toughness, containing 0.07 to 0.20% C, more than 0.6% and 1.5% or less Si, 1 to 3% Mn, 0.1 to 1.0% Cr, 0.005 to 0.080% sAl, 0.005 to 0.060% Ti, 0.005 to 0.060% Nb, 0.070% or less Ti+Nb, 150 ppm or less N, 0.035% or less P, 0.035% or less S, 0.01 to 1.00% Cu, 0.01 to 1.00% Ni, the remainder being Fe, and unavoidable impurities, wherein a structure before molding a stabilizer is any one of a bainite, a martensite, and a mixed structure of bainite/martensite and an original austenitic crystal grain size number after a heat treatment of the stabilizer is Gh 9 or more.Type: GrantFiled: August 11, 2011Date of Patent: June 26, 2012Assignees: NHK Spring Co., Ltd., JFE Bars & Shapes CorporationInventors: Katsuhiko Kikuchi, Kunikazu Tomita, Yutaka Tamai, Kazuaki Hattori, Kanji Inoue, Akira Tange, Norihiko Mori, Yurika Goto, Kiyoshi Kurimoto
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Publication number: 20110290382Abstract: According to one embodiment, a high-strength stabilizer steel for vehicles having excellent corrosion resistance and low-temperature toughness, containing 0.07 to 0.20% C, more than 0.6% and 1.5% or less Si, 1 to 3% Mn, 0.1 to 1.0% Cr, 0.005 to 0.080% sAl, 0.005 to 0.060% Ti, 0.005 to 0.060% Nb, 0.070% or less Ti+Nb, 150 ppm or less N, 0.035% or less P, 0.035% or less S, 0.01 to 1.00% Cu, 0.01 to 1.00% Ni, the remainder being Fe, and unavoidable impurities, wherein a structure before molding a stabilizer is any one of a bainite, a martensite, and a mixed structure of bainite/martensite and an original austenitic crystal grain size number after a heat treatment of the stabilizer is Gh 9 or more.Type: ApplicationFiled: August 11, 2011Publication date: December 1, 2011Applicants: JFE BARS & SHAPES CORPORATION, NHK SPRING CO., LTD.Inventors: Katsuhiko KIKUCHI, Kunikazu Tomita, Yutaka Tamai, Kazuaki Hattori, Kanji Inoue, Akira Tange, Norihiko Mori, Yurika Goto, Kiyoshi Kurimoto
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Patent number: 7800358Abstract: After the periphery of the magnetic sensitive element is surrounded by an elastic member, the magnetic sensitive element is mold-formed with resin material. Soft epoxy or gel resin is employed as the elastic member, poured in an element-mounting space and solidified. The magnetic sensitive element is surrounded by silicone rubber. Such construction allows the magnetic sensitive element not to be affected by vibration and allows the elastic member to absorb the stress which is created due to the thermal deformation of the molded resin.Type: GrantFiled: June 30, 2006Date of Patent: September 21, 2010Assignee: Hitachi, Ltd.Inventors: Yoshiyuki Akiyama, Kenji Nakabayashi, Hiroshi Onuki, Takatoshi Yamamoto, Katsuhiko Kikuchi, Kazuya Ishihara
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Publication number: 20100038560Abstract: A probe cleaning apparatus includes a cleaning-conditions database. The probe cleaning apparatus removes contamination from a probe by irradiating the probe by a laser beam, refers to the cleaning-conditions database based on information about the probe, such as material and shape, and controls properties of the laser beam, such as output intensity, pulse interval, wavelength, and pulse width, so that the probe cleaning apparatus removes the contamination from the probe without damaging the probe by heat.Type: ApplicationFiled: July 23, 2009Publication date: February 18, 2010Applicants: FUJITSU LIMITED, FUJITSU MICROELECTRONICS LIMITEDInventors: Fumihiko Tokura, Katsuhiko Kikuchi, Yuji Akasaki
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Publication number: 20080283997Abstract: An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.Type: ApplicationFiled: July 22, 2008Publication date: November 20, 2008Applicants: HITACHI CAR ENGINEERING CO.,LTD., HITACHI, LTD.Inventors: Hiromichi EBINE, Katsuhiko Kikuchi, Satoshi Shimada, Masahide Hayashi
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Patent number: 7414307Abstract: An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.Type: GrantFiled: May 28, 2004Date of Patent: August 19, 2008Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.Inventors: Hiromichi Ebine, Katsuhiko Kikuchi, Satoshi Shimada, Masahide Hayashi
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Publication number: 20080193736Abstract: A resin-impregnated porous filler having meso-pores, micro-pores, and macro-pores is obtained by inserting a coupling agent or an inorganic material between layers of a stratified clay mineral to prepare a crosslinked structure between the layers; making the stratified clay mineral three-dimensional; and impregnating the macro-pores with resin.Type: ApplicationFiled: November 30, 2007Publication date: August 14, 2008Inventors: Katsuhiko Kikuchi, Hiroshi Idei
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Patent number: 7260992Abstract: An outer case connector portion, a gauge housing case, and the like for use with a pressure sensor, for example, are generally made of a thermoplastic or thermosetting resin. However, the resin physically causes curing shrinkage. Especially when a metal is insert molded with a resin, curing shrinkage of the resin generates a gap at the interface between the resin and the metal. By filling an anaerobic, high-permeability adhesive in the gap, hermetic sealing can be ensured and reliability can be enhanced. Inexpensive hermetic sealing and enhanced reliability are realized.Type: GrantFiled: January 17, 2003Date of Patent: August 28, 2007Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.Inventors: Masahide Hayashi, Katsuhiko Kikuchi, Hiromichi Ebine
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Publication number: 20070000455Abstract: After the periphery of the magnetic sensitive element is surrounded by an elastic member, the magnetic sensitive element is mold-formed with resin material. Soft epoxy or gel resin is employed as the elastic member, poured in an element-mounting space and solidified. The magnetic sensitive element is surrounded by silicone rubber. Such construction allows the magnetic sensitive element not to be affected by vibration and allows the elastic member to absorb the stress which is created due to the thermal deformation of the molded resin.Type: ApplicationFiled: June 30, 2006Publication date: January 4, 2007Applicant: HITACHI, LTD.Inventors: Yoshiyuki Akiyama, Kenji Nakabayashi, Hiroshi Onuki, Takatoshi Yamamoto, Katsuhiko Kikuchi, Kazuya Ishihara
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Patent number: 6964200Abstract: The invention is intended to provide a small and highly reliable pressure sensor, which has a smaller number of components and can be produced by using a mold for resin molding in common. A sensor unit (11) is molded with resin and includes a semiconductor chip (1) for converting the change in pressure of a medium introduced through an introduction hole for measurement into an electric signal. A lead member (12) has one end exposed in a connector (23) and is electrically connected to the semiconductor chip (1) in the sensor unit (11) beforehand. Pressure is applied to the semiconductor chip (1) through a pipe (22). An outer case (21) is integrally formed of synthetic resin by insert molding of the sensor unit (11), the lead member (12) and the pipe (22).Type: GrantFiled: March 29, 2001Date of Patent: November 15, 2005Assignee: Hitachi, Ltd.Inventors: Atsushi Miyazaki, Katsuhiko Kikuchi, Masaaki Suzuki, Ryozo Tomosaki
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Publication number: 20050115328Abstract: An outer case connector portion, a gauge housing case, and the like for use with a pressure sensor, for example, are generally made of a thermoplastic or thermosetting resin. However, the resin physically causes curing shrinkage. Especially, when a metal is insert molded with a resin, curing shrinkage of the resin generates a gap at the interface between the resin and the metal. By filling an anaerobic, high-permeability adhesive in the gap, hermetic sealing can be ensured and reliability can be enhanced. Inexpensive hermetic sealing and enhanced reliability are realized.Type: ApplicationFiled: January 17, 2003Publication date: June 2, 2005Inventors: Masahide Hayashi, Katsuhiko Kikuchi, Hiromichi Ebine
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Publication number: 20040238940Abstract: An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.Type: ApplicationFiled: May 28, 2004Publication date: December 2, 2004Inventors: Hiromichi Ebine, Katsuhiko Kikuchi, Satoshi Shimada, Masahide Hayashi
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Publication number: 20040055387Abstract: The invention is intended to provide a small and highly reliable pressure sensor, which has a smaller number of components and can be produced by using a mold for resin molding in common. A sensor unit (11) is molded with resin. and includes a semiconductor chip (1) for converting the change in pressure of a medium introduced through an introduction hole for measurement into an electric signal. A lead member (12) has one end exposed in a connector (23) and is electrically connected to the semiconductor chip (1) in the sensor unit (11) beforehand. Pressure is applied to the semiconductor chip (1) through a pipe (22). An outer case (21) is integrally formed of synthetic resin by insert molding of the sensor unit (11), the lead member (12) and the pipe (22).Type: ApplicationFiled: August 29, 2003Publication date: March 25, 2004Inventors: Atsushi Miyazaki, Katsuhiko Kikuchi, Masaaski Suzuki, Ryozo Tomosaki
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Patent number: 6637406Abstract: A fuel injection system for an internal combustion engine, and particularly a supercharged one that employs both an in-cylinder injector and a manifold injector. By using two fuel injectors, one in-cylinder and one in the intake manifold, it is possible to operate under light loads with stratified charge and obtain a good homogenous mixture for combustion in other engine speed and load ranges.Type: GrantFiled: June 25, 2001Date of Patent: October 28, 2003Assignee: Yamaha Hatsudoki Kabushiki KaishaInventors: Tetsurou Yamada, Katsuhiko Kikuchi
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Patent number: 6601453Abstract: The present invention provides a pressure detector capable of easily responding to changes in specification. The pressure detector has a sensor unit for detecting pressure and electronic parts for reducing electrical disturbance which are electrically joined to an exposed part of lead material of an opening of an external case. Thermoset resin is injected and set in the opening to obtain fixed members. An external electronic part for compensating for transient voltage resistance and electromagnetic failure resistance of a single one-chip semiconductor sensor can be mounted, and cost can be reduced by miniaturization, light weight, and reduction in man-hours required for assembly.Type: GrantFiled: March 20, 2002Date of Patent: August 5, 2003Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.Inventors: Atsushi Miyazaki, Katsuhiko Kikuchi, Hiromichi Ebine, Satoshi Shimada, Masahide Hayashi