Abstract: According to a flexible OLED device production method of the present disclosure, a multilayer stack (100) is provided which includes a glass base (10), a functional layer region (20) including a TFT layer (20A) and an OLED layer (20B), and a synthetic resin film (30) provided between the glass base (10) and the functional layer region (20) and bound to the glass base (10). In a dry gas atmosphere whose dew point is not more than ?50° C., the multilayer stack (100) is separated into a first portion (110) and a second portion (120), and a surface (30s) of the synthetic resin film (30) is exposed to the dry gas atmosphere, the first portion (110) including the functional layer region (20) and the synthetic resin film (30), the second portion (120) including the glass base (10). The first portion (110) is transported from the dry gas atmosphere to a reduced-pressure atmosphere R, and a protection layer (60) is formed on the surface (30s) of the synthetic resin film (30) in the reduced-pressure atmosphere R.

Abstract: A method for attaching display panel comprises: preparing a frame-shaped body comprising a first rod-like member and two second rod-like members, the two second rod-like members being substantially parallel to each other and crossing the first rod-like member; bonding the first rod-like member and the two second rod-like members to a given plane surface or a given curved surface; and moving a display panel having a width to be supported between the two second rod-like members from one of the ends of two second rod-like members towards the first rod-like member along a first surface of the two second rod-like members and a second surface of the two second rod-like members, the first surface and the second surface facing each other.

Abstract: A method for manufacturing an organic EL device according to an embodiment of the present invention includes: a step for preparing an element substrate having a substrate and a plurality of organic electroluminescent elements (3) which are supported by the substrate; and a step for forming a thin film encapsulation structure (10) covering the organic electroluminescent elements.

Abstract: According to a flexible light-emitting device production method of the present disclosure, after an intermediate region (30i) and flexible substrate regions (30d) of a plastic film (30) of a multilayer stack (100) are divided from one another, the interface between the flexible substrate regions (30d) and a glass base (10) is irradiated with lift-off light. The multilayer stack (100) is separated into a first portion (110) and a second portion (120) while the multilayer stack (100) is in contact with a stage (212). The first portion (110) includes a plurality of light-emitting devices (1000) which are in contact with the stage (212). The light-emitting devices (1000) include a plurality of functional layer regions (20) and the flexible substrate regions (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i). The stage (212) has ejection holes in a region which is to face the intermediate region (30i), from which a fluid is ejected in the separation step.

Abstract: Provided is a vapor deposition mask that suppresses heat conduction at a frame thereof, that achieves weight reduction, and that can tolerate high stress at a portion of the frame to which particularly high stress is applied. The present invention has: a mask main body (10) at which an opening pattern is formed; and a frame (15) to which at least a portion of a peripheral edge part of the mask main body is joined. At least a portion of the frame is formed as a rod-like lateral frame (15b) that is formed by laminating, via connection surface plates (153), unit structures (155) for a sandwich structure in which a surface plate (152) is stuck to a surface that faces at least portions of core parts (151) that contain vacant space.

Abstract: According to a flexible light-emitting device production method of the present disclosure, after an intermediate region (30i) and a flexible substrate region (30d) of a plastic film (30) of a multilayer stack (100) are divided, the interface between the flexible substrate region (30d) and a glass base (10) is irradiated with lift-off light. The multilayer stack (100) is separated into the first portion (110) and the second portion (120) while the multilayer stack (100) is kept in contact with the stage (210). The first portion (110) includes a plurality of light-emitting devices (1000) which are in contact with the stage (210). The light-emitting devices (1000) include a plurality of functional layer regions (20) and the flexible substrate region (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i).

Abstract: This organic EL display device (100) has multiple pixels, and comprises: an element substrate (1) which has a substrate and multiple organic EL elements supported on the substrate and arranged in each of the multiple pixels; and a thin-film sealing structure (10) covering the multiple pixels. The thin-film sealing structure has a first inorganic barrier layer (12) and an organic barrier layer (14) contacting the upper surface or the lower surface of the first inorganic barrier layer. The element substrate further has a bank layer (33) defining each of the multiple pixels and multiple spacers (31) arranged in the gaps between the pixels, and the multiple spacers (31) are covered by the bank layer (33).

Abstract: This organic EL device (100A) comprises a peripheral region (R2) and an active region (R1) containing a plurality of organic EL elements (3), and includes an element substrate (20) having a plurality of organic EL elements, and a thin film seal structure (10A) covering the plurality of organic EL elements. The thin film seal structure comprises a first inorganic barrier layer (12), an organic barrier layer (14) in contact with the upper surface of the first inorganic barrier layer, and a second inorganic barrier layer (16) in contact with the upper surface of the first inorganic barrier layer and the upper surface of the organic barrier layer. The peripheral region comprises a first protruding structure (22a) containing a section extending along at least one edge of the active region, and an extending section (12e) of the first inorganic barrier layer extending over the first protruding structure. The first protruding structure includes a first part and second part.

Abstract: An organic EL display device (100) is provided with an element substrate (20) that has a substrate (1) and a plurality of organic EL elements (3) supported on the substrate, and a thin film encapsulation structure (10) that covers the plurality of organic EL elements. The thin film encapsulation structure is provided with a first inorganic barrier layer (12), an organic barrier layer (14) formed upon the first inorganic barrier layer, and a second inorganic barrier layer (16) formed upon the organic barrier layer. A first surface 14S of the organic barrier layer in contact with the second inorganic barrier layer has a plurality of fine first protrusions, and the maximum height Rz1 of the first surface roughness profile is 20 nm to less than 100 nm.

Abstract: An organic EL light-emitting element is provided in which, by means of an organic material that is oligomeric, an organic layer coated film 25 is formed in a high-definition pixel pattern in a 100-2500 ?m2 area; a manufacturing method of said organic EL light-emitting element is also provided. The coated film 25 is formed by dropwise injection of a liquid composition containing an organic material oligomer in openings of insulation banks that are formed at a height of 0.5-1 ?m.

Abstract: A vapor deposition mask (100) includes a resin layer (10) including a plurality of openings (11); a magnetic metal layer (20) located so as to overlap the resin layer, the magnetic metal layer including a mask portion (20a) having such a shape as to expose the plurality of openings and a peripheral portion (20b) located so as to enclose the mask portion; and a frame (30) secured to the peripheral portion of the magnetic metal layer. The resin layer is not joined to the mask portion of the magnetic metal layer but is joined to at least a part of the peripheral portion of the magnetic metal layer.

Abstract: According to a flexible light-emitting device production method of the present disclosure, after an intermediate region (30i) and flexible substrate regions (30d) of a plastic film (30) of a multilayer stack (100) are divided from one another, the interface between the flexible substrate regions (30d) and a glass base (10) is irradiated with lift-off light. The multilayer stack (100) is separated into a first portion (110) and a second portion (120) while the multilayer stack (100) is in contact with a stage (210). The first portion (110) includes a plurality of light-emitting devices (1000) which are in contact with the stage (210). The light-emitting devices (1000) include a plurality of functional layer regions (20) and the flexible substrate regions (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i).

Abstract: An organic EL device (100D) according to an embodiment of the present invention has: a substrate (1); a drive circuit layer (2) having a plurality or TFTs formed on the substrate; interlayer insulation layers (2Pa, 2Pb) formed on the drive circuit layer; an organic EL element layer (3) formed on the interlayer insulation layers; and a thin-film sealing structure (10DE) formed so as to cover the organic EL element layer. The interlayer insulation layers have contact holes (CH1, CH2). Contact parts (C1, C2) that connect the drive circuit layer and the organic EL element layer are formed inside the contact holes. The surface (2Pb_Sb) of the interlayer insulation layers and the surface (C_Sb) of the contact parts are flush, and the arithmetic average roughness Ra of the surfaces are 50 nm or less.

Abstract: According to a flexible light-emitting device production method of the present disclosure, after an intermediate region (30i) and flexible substrate regions (30d) of a plastic film (30) of a multilayer stack (100) are divided from one another, the interface between the flexible substrate regions (30d) and a glass base (10) is irradiated with lift-off light. The multilayer stack (100) is separated into a first portion (110) and a second portion (120) while the multilayer stack (100) is in contact with a stage (210). The first portion (110) includes a plurality of light-emitting devices (1000) which are in contact with the stage (210). The light-emitting devices (1000) include a plurality of functional layer regions (20) and the flexible substrate regions (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i).

Abstract: A deposition mask, which are capable of enhancing close contact between a substrate for vapor deposition and a peripheral region of each opening in the deposition mask during vapor deposition, suppressing the occurrences of film blurs and shadows during vapor deposition, and performing high definition patterning, a method for manufacturing the same, and a vapor deposition method using the deposition mask, are provided. A deposition mask (1) comprises a resin film (11) having a pattern of openings (12) for forming a thin layer pattern by vapor deposition on a substrate for vapor deposition (2).

Abstract: A reflective liquid crystal display device (30) including a reflection electrode (31), a liquid crystal layer (32), and a counter electrode (33) is formed above an insulating layer (25) in a first region (R) of a TFT substrate (20). An organic EL display device (40) including a first electrode (41), an organic layer (43), and a second electrode (44) is formed on the insulating layer (25) of the TFT substrate (20) in a second region (T). A coating layer (45) is formed at least on a surface of the organic EL display device (40) so as to wrap the second electrode (44) and the organic layer (43) of the organic EL display device (40). A part of the coating layer (45) is in contact with the insulating layer (25). As a result, a complex display apparatus capable of preventing the organic layer from deteriorating and excellent in reliability can be obtained.

Abstract: A flexible emitting light device production apparatus of the present disclosure includes: a stage (520) for supporting a flexible emitting light supporting substrate (10), the flexible display supporting substrate including a glass base (11) and a synthetic resin film (12) provided on the glass base; a polisher head (535) configured to approach a selected region of a surface (12s) of the synthetic resin film (12) and polish the region so that a polish recess (12c) is formed in the surface (12s); and a repair head (536) for supplying a liquid material (20a) to the polish recess (12c) formed in the surface (12s) of the synthetic resin film (12) and heating the liquid material (20a), thereby forming a sintered layer (20) from the liquid material (20a).

Abstract: According to a flexible light-emitting device production method of the present disclosure, after an intermediate region (30i) and a flexible substrate region (30d) of a plastic film (30) of a multilayer stack (100) are divided, the interface between the plastic film (30) and a glass base (10) is irradiated with lift-off light. The multilayer stack (100) is separated into the first portion (110) and the second portion (120) while the multilayer stack (100) is kept in contact with the stage (212). The first portion (110) includes the intermediate region (30i) and a light-emitting device (1000) which are adhered to the stage (212). The light-emitting device (1000) includes a functional layer region (20) and the flexible substrate region (30d). The second portion (120) includes the glass base (10). The intermediate region (30i) adhered to the stage (212) is removed from the stage while the light-emitting device (1000) is kept adhered to the stage.

Abstract: According to a flexible light-emitting device production method of the present disclosure, after an intermediate region (30i) and a flexible substrate region (30d) of a plastic film (30) of a multilayer stack (100) are divided, the interface between the flexible substrate region (30d) and a glass base (10) is irradiated with lift-off light. The multilayer stack (100) is separated into the first portion (110) and the second portion (120) while the multilayer stack (100) is kept in contact with the stage (210). The first portion (110) includes a plurality of light-emitting devices (1000) which are in contact with the stage (210). The light-emitting devices (1000) include a plurality of functional layer regions (20) and the flexible substrate region (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i).

Abstract: According to a flexible light-emitting device production method of the present disclosure, after an intermediate region (30i) and flexible substrate regions (30d) of a plastic film (30) of a multilayer stack (100) are divided from one another, the interface between the flexible substrate regions (30d) and a glass base (10) is irradiated with lift-off light. The multilayer stack (100) is separated into a first portion (110) and a second portion (120) while the multilayer stack (100) is in contact with a stage (212). The first portion (110) includes a plurality of light-emitting devices (1000) which are in contact with the stage (212). The light-emitting devices (1000) include a plurality of functional layer regions (20) and the flexible substrate regions (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i).