Abstract: A stretchable shirt collar includes an inner collar band and an outer collar band. The inner collar band includes an exposed layer and a hidden layer. A stretchable inner collar interlining is disposed intermediate the exposed layer and the hidden layer of the inner collar band, and is fused to the exposed layer. The outer collar band includes an exposed layer and a hidden layer. A stretchable outer collar interlining is disposed intermediate the exposed layer and the hidden layer of the outer collar band, and is fused to the exposed layer. The stretchable inner collar interlining and the stretchable outer collar interlining comprise a layer of knit interlock fabric laminated to a layer of stretchable film adhesive. The elements of the stretchable shirt collars are sewn together with stretchable thread.

Abstract: A stretchable shirt collar includes an inner collar band and an outer collar band. The inner collar band includes an exposed layer and a hidden layer. A stretchable inner collar interlining is disposed intermediate the exposed layer and the hidden layer of the inner collar band, and is fused to the exposed layer. The outer collar band includes an exposed layer and a hidden layer. A stretchable outer collar interlining is disposed intermediate the exposed layer and the hidden layer of the outer collar band, and is fused to the exposed layer. The stretchable inner collar interlining and the stretchable outer collar interlining comprise a layer of knit interlock fabric laminated to a layer of stretchable film adhesive. The elements of the stretchable shirt collars are sewn together with stretchable thread.

Abstract: There is provided a multilayer printed wiring board including semiconductor element therewithin, which can realize high density wiring. A multilayer printed wiring board 1 includes a first printed wiring board 10 having a semiconductor element 2 mounted on a wiring pattern 12, a second printed wiring board 21 laminated on the wiring pattern 12 through a first insulating layer 20, a third printed wiring board 31 laminated on the second printed wiring board 21 through a second insulating layer 30, and a space region penetrating through the first insulating layer 20 and the second printed wiring board 21 in the thickness direction and adapted so that the semiconductor element 2 can be accommodated therewithin.

Abstract: There is provided a multilayer printed wiring board including semiconductor element therewithin, which can realize high density wiring. A multilayer printed wiring board 1 includes a first printed wiring board 10 having a semiconductor element 2 mounted on a wiring pattern 12, a second printed wiring board 21 laminated on the wiring pattern 12 through a first insulating layer 20, a third printed wiring board 31 laminated on the second printed wiring board 21 through a second insulating layer 30, and a space region penetrating through the first insulating layer 20 and the second printed wiring board 21 in the thickness direction and adapted so that the semiconductor element 2 can be accommodated therewithin.