Abstract: A piezo-electric oscillator has a reduced manufacturing cost using a general purpose piezo-electric vibrator, while coping with miniaturization. The piezo-electric oscillator has resin; a substrate having an upper face, a bottom face, a conductive terminal portion, and a mounting terminal portion at the bottom face; and a piezo-electric vibrator including a package, a conductive portion, a cover plate, a piezo-electric vibration piece, an external terminal portion; and an oscillation circuit element having an oscillation circuit. The piezo-electric vibration piece is housed within the package and, the package is fixed to the upper face of the substrate and sealed with the cover plate. The external terminal portion at a surface of the package is electrically coupled with the piezo-electric vibration piece and, at least the conductive portion excluding the mounting terminal portion is sealed with the resin. The oscillation circuit element is fixed to a face of the package opposite to the substrate.

Abstract: To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection with a piezoelectric resonator are formed on the upper lead frame and the connection leads are erected upwards so as to form connection terminals, and mounting leads for mounting to a mounting board are formed on the lower lead frame and the mounting leads are erected downwards so as to form mounting terminals, and an IC forming an oscillating circuit is mounted on the layered lead frame, the piezoelectric resonator formed by sealing a piezoelectric resonator element within a package is mounted on the layered lead frame, and the layered lead frame and the piezoelectric resonator are sealed within a resin package such that the principal surface of the mounting terminals are exposed outwards, thereby forming a completed article.

Abstract: Aspects of the invention provide a package for accommodating a piezoelectric resonator that can include more mounting electrodes than connecting electrodes of the piezoelectric resonator element. The mounting electrodes can be electrically connected with a wiring pattern. In the lower surface of a package body, there can be formed external terminals at the four corners thereof. The external terminals are bonded to a mounting board. The external terminals are electrically connected to the mounting electrodes, respectively. The external terminal is not connected electrically to either of the mounting electrodes. Therefore, positions of the external terminals for operating the piezoelectric resonator can be changed based on whether a pair of connecting electrodes of the piezoelectric vibration element is bonded to the mounting electrodes, or it is connected to the mounting electrodes. Accordingly, it can be possible to easily change positions of external terminals for connecting to a circuit on a board.

Abstract: To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection with a piezoelectric resonator are formed on the upper lead frame and the connection leads are erected upwards so as to form connection terminals, and mounting leads for mounting to a mounting board are formed on the lower lead frame and the mounting leads are erected downwards so as to form mounting terminals, and an IC forming an oscillating circuit is mounted on the layered lead frame, the piezoelectric resonator formed by sealing a piezoelectric resonator element within a package is mounted on the layered lead frame, and the layered lead frame and the piezoelectric resonator are sealed within a resin package such that the principal surface of the mounting terminals are exposed outwards, thereby forming a completed article.

Abstract: To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection with a piezoelectric resonator are formed on the upper lead frame and the connection leads are erected upwards so as to form connection terminals, and mounting leads for mounting to a mounting board are formed on the lower lead frame and the mounting leads are erected downwards so as to form mounting terminals, and an IC forming an oscillating circuit is mounted on the layered lead frame, the piezoelectric resonator formed by sealing a piezoelectric resonator element within a package is mounted on the layered lead frame, and the layered lead frame and the piezoelectric resonator are sealed within a resin package such that the principal surface of the mounting terminals are exposed outwards, thereby forming a completed article.

Abstract: To make a substantial mounting area smaller. A piezoelectric resonator has a piezoelectric resonator element accommodated in a package. The piezoelectric resonator element includes a pair of connection electrodes which are connected to excitation electrodes. The respective connection electrodes are joined to mount electrodes formed in the package. The piezoelectric resonator includes four external electrodes at the outer surface of the bottom of the package. The external electrodes disposed along the shorter latus of the package on one side in the lengthwise direction thereof are electrically connected with the mount electrodes to which the respective connection electrodes of the piezoelectric resonator element are connected.

Abstract: To provide a piezoelectric oscillator in which the size in the thickness direction can be made smaller and the space required for mounting can be made smaller, and a portable telephone and electronic equipment using the piezoelectric oscillator, a resonator package accommodating a piezoelectric resonating element therein, and an IC chip fixed onto a rear surface of the resonator package and having an oscillating circuit therein are provided, and an inner lead portions of a lead frame are fixed onto the rear surface of the resonator package and the resonator package and the IC chip are resin molded except for an outer lead portion of the lead frame.

Abstract: To provide a piezoelectric oscillator in which, even after a first package and a second package are bonded to each other, the connection state can be easily observed externally, so that testability can be enhanced, and connection failure can be easily found out to perform a repair. A piezoelectric oscillator includes a first package housing a piezoelectric resonator element therein and having external terminal portions connected to excitation electrodes of the piezoelectric resonator element, and a second package housing an oscillating circuit element, the first package being superposed on and fixed to the second package. Herein, in the second package, the oscillating circuit element, which is connected to a lead frame, is molded out of resin, and connection terminal portions and mounting terminals formed of the lead frame are exposed at the second package.

Abstract: Exemplary embodiments of the invention provide a piezoelectric oscillator that enables reduction in thickness. A piezoelectric oscillator is configured to include: an electronic component electrically connected with one side face of a plurality of leads that are formed from a lead frame, a mold material that seals the electronic component such that the other side face of the plurality of leads is exposed, and a piezoelectric resonator element bonded to the other side face of the plurality of leads via a conductive material. Namely, a connection terminal is formed in the other side face of the plurality of leads. Moreover, the lead protruding from the mold material is bent downwards to form a mounting terminal.

Abstract: Aspects of the invention provide a package for accommodating a piezoelectric resonator that can include more mounting electrodes than connecting electrodes of the piezoelectric resonator element. The mounting electrodes can be electrically connected with a wiring pattern. In the lower surface of a package body, there can be formed external terminals at the four corners thereof. The external terminals are bonded to a mounting board. The external terminals are electrically connected to the mounting electrodes, respectively. The external terminal is not connected electrically to either of the mounting electrodes. Therefore, positions of the external terminals for operating the piezoelectric resonator can be changed based on whether a pair of connecting electrodes of the piezoelectric vibration element is bonded to the mounting electrodes, or it is connected to the mounting electrodes. Accordingly, it can be possible to easily change positions of external terminals for connecting to a circuit on a board.

Abstract: A piezo-electric oscillator has a reduced manufacturing cost using a general purpose piezo-electric vibrator, while coping with miniaturization. The piezo-electric oscillator has resin; a substrate having an upper face, a bottom face, a conductive terminal portion, and a mounting terminal portion at the bottom face; and a piezo-electric vibrator including a package, a conductive portion, a cover plate, a piezo-electric vibration piece, an external terminal portion; and an oscillation circuit element having an oscillation circuit. The piezo-electric vibration piece is housed within the package and, the package is fixed to the upper face of the substrate and sealed with the cover plate. The external terminal portion at a surface of the package is electrically coupled with the piezo-electric vibration piece and, at least the conductive portion excluding the mounting terminal portion is sealed with the resin. The oscillation circuit element is fixed to a face of the package opposite to the substrate.

Abstract: The invention provides a piezoelectric oscillator having a reduced horizontal size and capable of being mounted in a small area. The invention also provides a portable telephone and an electronic device using such a piezoelectric oscillator. The piezoelectric oscillator includes a first package and a second package which are firmly connected to each other such that the second package is located on the first package. An oscillator circuit element is disposed in the first package, and a piezoelectric resonator is disposed in the second package. The first package includes a first lead frame and a second lead frame. End parts of the first lead frame are bent downward such that the bent portions at the lower end are exposed to the outside and serve as the first connection terminals. The second lead frame is placed on the first lead frame. End parts of the second lead frame are bent upward so as to serve as second connection terminals. The first connection terminals described above are used as mounting terminals.

Abstract: To provide a piezoelectric oscillator in which the size in the thickness direction can be made smaller and the space required for mounting can be made smaller, and a portable telephone and electronic equipment using the piezoelectric oscillator, a resonator package accommodating a piezoelectric resonating element therein, and an IC chip fixed onto a rear surface of the resonator package and having an oscillating circuit therein are provided, and an inner lead portions of a lead frame are fixed onto the rear surface of the resonator package and the resonator package and the IC chip are resin molded except for an outer lead portion of the lead frame.

Abstract: To make a substantial mounting area smaller. A piezoelectric resonator has a piezoelectric resonator element accommodated in a package. The piezoelectric resonator element includes a pair of connection electrodes which are connected to excitation electrodes. The respective connection electrodes are joined to mount electrodes formed in the package. The piezoelectric resonator includes four external electrodes at the outer surface of the bottom of the package. The external electrodes disposed along the shorter latus of the package on one side in the lengthwise direction thereof are electrically connected with the mount electrodes to which the respective connection electrodes of the piezoelectric resonator element are connected.

Abstract: To provide a piezoelectric oscillator in which, even after a first package and a second package are bonded to each other, the connection state can be easily observed externally, so that testability can be enhanced, and connection failure can be easily found out to perform a repair. A piezoelectric oscillator includes a first package housing a piezoelectric resonator element therein and having external terminal portions connected to excitation electrodes of the piezoelectric resonator element, and a second package housing an oscillating circuit element, the first package being superposed on and fixed to the second package. Herein, in the second package, the oscillating circuit element, which is connected to a lead frame, is molded out of resin, and connection terminal portions and mounting terminals formed of the lead frame are exposed at the second package.

Abstract: The invention provides a piezoelectric oscillator having a reduced horizontal size and capable of being mounted in a small area. The invention also provides a portable telephone and an electronic device using such a piezoelectric oscillator. The piezoelectric oscillator includes a first package and a second package which are firmly connected to each other such that the second package is located on the first package. An oscillator circuit element is disposed in the first package, and a piezoelectric resonator is disposed in the second package. The first package includes a first lead frame and a second lead frame. End parts of the first lead frame are bent downward such that the bent portions at the lower end are exposed to the outside and serve as the first connection terminals. The second lead frame is placed on the first lead frame. End parts of the second lead frame are bent upward so as to serve as second connection terminals. The first connection terminals described above are used as mounting terminals.

Abstract: To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection with a piezoelectric resonator are formed on the upper lead frame and the connection leads are erected upwards so as to form connection terminals, and mounting leads for mounting to a mounting board are formed on the lower lead frame and the mounting leads are erected downwards so as to form mounting terminals, and an IC forming an oscillating circuit is mounted on the layered lead frame, the piezoelectric resonator formed by sealing a piezoelectric resonator element within a package is mounted on the layered lead frame, and the layered lead frame and the piezoelectric resonator are sealed within a resin package such that the principal surface of the mounting terminals are exposed outwards, thereby forming a completed article.

Abstract: The invention provides a process comprising treating a lanolin fatty acid with boric acid to convert hydroxy fatty acids therein to boric acid esters, subjecting the reaction mixture to vacuum distillation to fractionate the boric acid esters of hydroxy fatty acids from non-hydroxy fatty acids, hydrolyzing the boric acid esters, and subjecting the hydrolysate to vacuum distillation to provide .alpha.-hydroxy fatty acids and .omega.-hydroxy fatty acids, the resultant respective lanolin fatty acids and esters, and cosmetic products and drug products for external use containing them.According to the invention, pale-colored, substantially odor-free lanolin fatty acids can be obtained easily and with high efficiency and these compounds can be effectively utilized in the pharmaceutical and cosmetic field.