Abstract: A solder joint determination method is disclosed that is able to inspect a joint portion between an electrode and a soldered portion and determine a soldering condition of the joint portion reliably with high precision. The method includes the steps of: scanning a surface of the electrode with the light beam; detecting a height of the electrode relative to the circuit board from data of the scanning of the electrode; scanning a surface of the solder near the electrode with the light beam; detecting a height of the solder relative to the circuit board from data of the scanning of the solder; and determining the solder joint condition between the electronic part and the solder based on the height of the electrode and the height of the solder relative to the circuit board.

Abstract: A solder joint determination method is disclosed that is able to inspect a joint portion between an electrode and a soldered portion and determine a soldering condition of the joint portion reliably with high precision. The method includes the steps of: scanning a surface of the electrode with the light beam; detecting a height of the electrode relative to the circuit board from data of the scanning of the electrode; scanning a surface of the solder near the electrode with the light beam; detecting a height of the solder relative to the circuit board from data of the scanning of the solder; and determining the solder joint condition between the electronic part and the solder based on the height of the electrode and the height of the solder relative to the circuit board.

Abstract: A method for assembling and testing an electronic circuit baseboard includes at least a step of soldering at least one electronic part to an electronic circuit baseboard using Pb excluded solder. One of erroneous wiring, erroneous mounting, malfunction, and defective soldering of the least one electronic part is tested by contacting a probe pin to various probe pin contact sections on the electronic circuit baseboard. During the step of soldering, the Pb excluded solder is also supplied to at least one of the various probe pin contact sections in order to suppress oxidation thereof.

Abstract: A method for assembling and testing an electronic circuit baseboard includes at least a step of soldering at least one electronic part to an electronic circuit baseboard using Pb excluded solder. One of erroneous wiring, erroneous mounting, malfunction, and defective soldering of the least one electronic part is tested by contacting a probe pin to various probe pin contact sections on the electronic circuit baseboard. During the step of soldering, the Pb excluded solder is also supplied to at least one of the various probe pin contact sections in order to suppress oxidation thereof.

Abstract: A printed circuit board inspection device is disclosed that is configured to measure the shape of a pasted solder and the shape of parts after mounting the parts in an inspection of a solder paste on a printed circuit board. This printed circuit board inspection device for a printed circuit board on which a solder paste is printed and at least one part is mounted on the solder paste, includes an inspecting section. The inspecting section calculates an amount of the solder paste not covered by an electrode of the part mounted on the solder paste based on image data captured by an imaging device, the image data showing the part mounted on the solder paste. If the calculated amount of not-covered solder paste is greater than a predetermined upper limit or smaller than a predetermined lower limit, the inspecting section determines that the solder paste is incorrectly printed.

Abstract: A dispenser includes a supporting section configured to retain a circuit board at a predetermined height. A dispenser nozzle includes a nozzle tip having at least one hole, the nozzle tip configured to provide an adhesive substance to the circuit board. A driving mechanism is configured to drive the supporting section in a first direction and drive the dispenser nozzle in a second direction and a third direction. A circuit board fabricating method includes dispensing at least one droplet of an adhesive substance, having a shape extending toward a first direction, onto a predetermined point on a circuit board. A chip is placed onto the predetermined point to cover the droplet. The chip is soldered onto the predetermined point.

Abstract: A method for soldering parts mounted on a print circuit baseboard with Pb-free material. A reflow soldering process is performed to parts mounted on one side surface of the print circuit baseboard. A flow soldering process is then performed to parts mounted on the other side surface of the print circuit baseboard with a jet flow solder process. Either a composition or a melting point of alloys generated when the reflow and flow soldering are performed is differentiated so that the alloy on one side surface does not melt during a flow soldering process to the other side surface.

Abstract: A method for assembling and testing an electronic circuit baseboard includes at least a step of soldering at least one electronic part to an electronic circuit baseboard using Pb excluded solder. One of erroneous wiring, erroneous mounting, malfunction, and defective soldering of the least one electronic part is tested by contacting a probe pin to various probe pin contact sections on the electronic circuit baseboard. During the step of soldering, the Pb excluded solder is also supplied to at least one of the various probe pin contact sections in order to suppress oxidation thereof.

Abstract: An ophthalmic composition comprises active vitamin D as an effective component and is used for preventing deterioration of the optical transparency, occurrence of high intraocular pressure diseases or defective sight, observed after an ophthalmic operation, due to hyperplasia of the anterior ocular cells in the tissues damaged by the ophthalmic operation, which are in course of a healing process, and/or excess production of cellular materials. The ophthalmic composition can be dropped in the eye after operations such as those for cataract, for transplantation of intraocular lenses and for cornea to maintain the intraocular transparency of the anterior ocular region, to control the hyperplasia of the anterior ocular cells in the tissues damaged by the ophthalmic operation, which are in course of a healing process, and/or excess production of cellular materials and to thus prevent any reduction of visual acuity.

Abstract: A method for soldering parts mounted on a print circuit baseboard with Pb-free material. A reflow soldering process is performed to parts mounted on one side surface of the print circuit baseboard. A flow soldering process is then performed to parts mounted on the other side surface of the print circuit baseboard with a jet flow solder process. Either a composition or a melting point of alloys generated when the reflow and flow soldering are performed is differentiated so that the alloy on one side surface does not melt during a flow soldering process to the other side surface.

Abstract: An ophthalmic composition for prophylaxis and/or treatment of keratoconjunctivitis sicca, which is locally administered to the eyes and which comprises, as an effective component, at least one member selected from the group consisting of vitamin D, active vitamin D, and active vitamin D analogues.

Abstract: An ophthalmic composition for prophylaxis and/or treatment of keratoconjunctivitis sicca, which is locally administered to the eyes and which comprises, as an effective component, at least one member selected from the group consisting of vitamin D, active vitamin D, and active vitamin D analogues.

Abstract: An ophthalmic composition comprises active vitamin D as an effective component and is used for preventing deterioration of the optical transparency, occurrence of high intraocular pressure diseases or defective sight, observed after an ophthalmic operation, due to hyperplasia of the anterior ocular cells in the tissues damaged by the ophthalmic operation, which are in course of a healing process, and/or excess production of cellular materials. The ophthalmic composition can be dropped in the eye after operations such as those for cataract, for transplantation of intraocular lenses and for cornea to maintain the intraocular transparency of the anterior ocular region, to control the hyperplasia of the anterior ocular cells in the tissues damaged by the ophthalmic operation, which are in course of a healing process, and/or excess production of cellular materials and to thus prevent any reduction of visual acuity.

Abstract: An ophthalmic composition for prophylaxis and/or treatment of keratoconjunctivitis sicca, which is locally administered to the eyes and which comprises, as an effective component, at least one member selected from the group consisting of vitamin D, active vitamin D, and active vitamin D analogues.

Abstract: An ophthalmic composition for preventing corneal haze and corneal refraction anomaly observed after anterior ocular tissues are damaged or during corneal diseases comprises, as an effective component, vitamin D such as ergocalciferols and cholecalciferols or active vitamin D.