Abstract: The present invention provides a positive resist composition comprising (A) at least one resin selected from the group consisting of {circle around (1)} resin which is itself insoluble or poorly soluble in an alkali aqueous solution but cause a chemical change by the action of an acid to become soluble in an alkali aqueous solution with a proviso that the resin is not novolak resin and {circle around (2)} alkali-soluble resin, (B) novolak resin containing protective group which can be dissociated by the action of an acid and (C) an acid generator.

Abstract: A chemical amplifying type positive resist composition having excellent sensitivity and resolution, manifesting no generation of scum is provided, which comprises a resin which has a polymerization unit derived from hydroxystyrene and a polymerization unit derived from 2-ethyl-2-adamantyl (meth)acrylate, and is insoluble or poorly soluble itself in an alkali, but becomes alkali-soluble after dissociation of the above-mentioned acid unstable group by the action of an acid; a radiation sensitive acid generating agent; and polypropylene glycol.

Abstract: The present invention provides a chemical amplification type positive resist composition comprising (A) resin having a phenol skeleton wherein the phenol skeleton has protective group which can be dissociated by the action of an acid, the phenol skeleton itself is insoluble or poorly soluble in an alkali aqueous solution and the phenol skeleton becomes soluble in an alkali aqueous solution after dissociation of the protective group, (B) resin obtained by protecting a part of hydroxyl group in poly(p-hydroxystyrene) with pivaloyl group and (C) an acid generator.

Abstract: A chemical amplification type positive resist composition, which can attain high sensitivity while maintaining high resolution, and comprises (A) a compound of the following formula (I): 1

Abstract: A chemical amplification type positive resist composition that enables a resist pattern free from deformation in a side wall thereof and excellent in evenness and is excellent in sensitivity as well as resolution is provided and the chemical amplification type positive resist composition comprises a resin which has a polymerization unit derived from p-hydroxystyrene and a polymerization unit having a group unstable against acid, and is insoluble or hardly soluble in an alkaline medium itself but becoming alkaline-soluble after the acid-unstable group being cleaved by the action of the generated acid; an acid generating agent; and a compound represented by the following formula (I): wherein R1 and R2 each independently represents an alkyl group having 1 to 15 carbon atoms, an alkyl group having 1 to 8 carbon atoms wherein at least 3 hydrogen atoms are substituted by fluorine atoms, or an aryl group having 6 to 10 carbon atoms.

Abstract: The present invention provides a positive resist composition comprising

Abstract: A photoresist composition comprising a binder component, an acid generator and a surface active agent containing fluorine atom(s) is provided, and the photoresist composition reduces development deficiency generated at the time of development significantly without lowering the resolution, the profile, or the like. The surface active agent is poly trifluorobutyl methyl siloxane.

Abstract: The present invention provides a chemical amplification type positive resist composition comprising

Abstract: A chemical amplification type positive resist composition that enables a resist pattern free from deformation in a side wall thereof and excellent in evenness and is excellent in sensitivity as well as resolution is provided and the chemical amplification type positive resist composition comprises a resin which has a polymerization unit derived from p-hydroxystyrene and a polymerization unit having a group unstable against acid, and is insoluble or hardly soluble in an alkaline medium itself but becoming alkaline-soluble after the acid-unstable group being cleaved by the action of the generated acid; an acid generating agent; and a compound represented by the following formula (I): 1

Abstract: A chemical amplifying type positive resist composition comprising (A) a resin becoming alkali-soluble due to the action of an acid, (B) an acid generating agent, (C) a basic compound, and (D) a polyvalent carboxylic acid ester is provided, and it exhibits higher resolution without impairing resist performance such as application ability and sensitivity

Abstract: A chemical amplifying type positive resist composition having excellent sensitivity and resolution, manifesting no generation of scum is provided, which comprises a resin which has a polymerization unit derived from hydroxystyrene and a polymerization unit derived from 2-ethyl-2-adamantyl (meth)acrylate, and is insoluble or poorly soluble itself in an alkali, but becomes alkali-soluble after dissociation of the above-mentioned acid unstable group by the action of an acid; a radiation sensitive acid generating agent; and polypropylene glycol.

Abstract: A photoresist composition comprising a binder component, an acid generator and a surface active agent containing fluorine atom(s) is provided, and the photoresist composition reduces development deficiency generated at the time of development significantly without lowering the resolution, the profile, or the like.

Abstract: A positive-working resist composition comprising (A) a quinonediazide compound, (B) an alkali-soluble resin, and (C) a solvent system comprising 2-heptanone, ethyl lactate and .gamma.-butylactone in which the quinonediazide compound exhibits a very high solubility and which characteristics such as sensitivity, profile and coatability are excellent.