Abstract: A probe card holding apparatus is provided and may be configured to hold a probe card in a test head. The probe card may include a clamp head formed at a center part of a back surface of the probe card, and a holding device provided at the test head and configured to engage with the clamp head.

Abstract: A probe card holding apparatus is provided and may be configured to hold a probe card in a test head. The probe card may include a clamp head formed at a center part of a back surface of the probe card, and a holding device provided at the test head and configured to engage with the clamp head.

Abstract: An electronic device test apparatus comprising: a test apparatus body for testing IC devices formed on a wafer for electrical characteristics; a probe card for electrically connecting the IC devices and the test apparatus body; a prober for pushing the wafer against the probe card so as to electrically connect the IC devices and the probe card; an abutting mechanism extending toward the back surface of the probe card and abutting against the back surface of the probe card; and a lock mechanism fixing the extension of the abutting mechanism in the state with the abutting mechanism abutting against the back surface of the probe card.

Abstract: An electronic device test apparatus comprising: a test apparatus body for testing IC devices formed on a wafer for electrical characteristics; a probe card for electrically connecting the IC devices and the test apparatus body; a prober for pushing the wafer against the probe card so as to electrically connect the IC devices and the probe card; an abutting mechanism extending toward the back surface of the probe card and abutting against the back surface of the probe card; and a lock mechanism fixing the extension of the abutting mechanism in the state with the abutting mechanism abutting against the back surface of the probe card.

Abstract: A semiconductor test system includes a semiconductor test apparatus for providing a test signal to a device under test and performing a test on the device under test, a performance board for electrically coupling the semiconductor test apparatus and the device under test and a conveyance apparatus for conveying the device under test to electrically couple the device under test to the performance board. The conveyance apparatus includes a box for containing the performance board therein and a conveyance arm for conveying the device under test in order to press the device under test to the performance board and pressing the performance board to an inner face of the box via the device under test, so that a rear face of the performance board is pressed to the box, wherein the rear face corresponds to a position to which the device under test is pressed.

Abstract: A semiconductor test system includes a semiconductor test apparatus for providing a test signal to a device under test and performing a test on the device under test, a performance board for electrically coupling the semiconductor test apparatus and the device under test and a conveyance apparatus for conveying the device under test to electrically couple the device under test to the performance board. The conveyance apparatus includes a box for containing the performance board therein and a conveyance arm for conveying the device under test in order to press the device under test to the performance board and pressing the performance board to an inner face of the box via the device under test, so that a rear face of the performance board is pressed to the box, wherein the rear face corresponds to a position to which the device under test is pressed.

Abstract: The module-type connector according to the present invention defines the connectable connectors with a rigid supporting plate which extends along the connecting direction in order to make it easy to properly fit a male connector to a female connector. In the module-type connector, the contacting portions of the contacts that are shifted in the separation direction of the corresponding terminal with which the contacting portions contact are almost uniformly distributed. Further, the male connector that receives a preliminary load from different levels in the direction so that opposing elastic contacting portions are widened by engaging between the first end portion of each contact within a housing and the different levels of the housing, has at least a protruding portion that protrudes from the contacting surface of the plurality of contacts toward the contacting surface thereof and that is provided between contacts.

Abstract: The module-type connector according to the present invention defines the connectable connectors with a rigid supporting plate which extends along the connecting direction in order to make it easy to properly fit a male connector to a female connector. In the module-type connector, the contacting portions of the contacts that are shifted in the separation direction of the corresponding terminal with which the contacting portions contact are almost uniformly distributed. Further, the male connector that receives a preliminary load from different levels in the direction so that opposing elastic contacting portions are widened by engaging between the first end portion of each contact within a housing and the different levels of the housing, has at least a protruding portion that protrudes from the contacting surface of the plurality of contacts toward the contacting surface thereof and that is provided between contacts.