Abstract: A film deposition apparatus for sequentially supplying reaction gases, which mutually react, into a chamber to deposit a film on a substrate includes a turntable rotatable and including a concave portion on an upper surface, a bottom portion of the concave portion having a through hole, a substrate supporting member attachable to and detachable from the concave portion, an upper surface of the substrate supporting member mounting the substrate, a lower surface of the substrate supporting member having a first protruding portion, a drive mechanism moving up and down the turntable and revolving the turntable, a lid member located lower than the turntable, an upper surface of the lid member having a second protruding portion, and a control unit revolving the turntable to cause the first protruding portion to contact the second protruding portion and cause the substrate supporting member to be spun a predetermined angle relative to the turntable.

Abstract: A method for managing an atmosphere in a storage container in a processing apparatus including a substrate transfer region and a container transfer region which are partitioned by a partition wall; a load port; a container keeping rack; and a cover opening/closing mechanism, includes substituting the internal atmosphere of the storage container that stores non-processed substrates with the inert gas for using the cover opening/closing mechanism; transferring the storage container of which the internal atmosphere has been substituted with the inert gas, to the container keeping rack and placing and keeping the storage container on the container keeping rack; and putting the storage container on standby on the container keeping rack while maintaining the atmosphere substituted with the inert gas.

Abstract: A film deposition apparatus includes a chamber and a turntable provided in the chamber. The turntable includes a concave portion in its upper surface. A bottom portion of the concave portion has a through hole. A substrate supporting member is detachably placed on the concave portion so that a lower surface thereof is exposed from the through hole, and includes a substrate receiving portion. A drive mechanism moves up and down and rotates the turntable. A rotary unit rotatable by air is provided under the turntable. An air supply unit is provided. A controller causes the drive mechanism to rotate and move down the turntable so that the rotary unit supports the exposed lower surface of the substrate supporting member. The controller causes the air supply unit to supply air to the rotary unit so that the substrate supporting member rotates a predetermined angle relative to the turntable.

Abstract: A film deposition apparatus for sequentially supplying reaction gases, which mutually react, into a chamber to deposit a film on a substrate includes a turntable rotatable and including a concave portion on an upper surface, a bottom portion of the concave portion having a through hole, a substrate supporting member attachable to and detachable from the concave portion, an upper surface of the substrate supporting member mounting the substrate, a lower surface of the substrate supporting member having a first protruding portion, a drive mechanism moving up and down the turntable and revolving the turntable, a lid member located lower than the turntable, an upper surface of the lid member having a second protruding portion, and a control unit revolving the turntable to cause the first protruding portion to contact the second protruding portion and cause the substrate supporting member to be spun a predetermined angle relative to the turntable.

Abstract: According to an embodiment of present disclosure, a spacer is provided. The spacer includes at least a protrusion formed to protrude from an outer periphery of the spacer. The protrusion serves to locate the spacer in place in a transfer mechanism configured to transfer the spacer when the spacer is fixed by the transfer mechanism in such a way that the protrusion comes in contact with the transfer mechanism, and configured to allow the spacer to rotate or move in case the spacer is deviated from a predetermined transfer position when the spacer is engaged with the transfer mechanism.

Abstract: Provided is a cover opening/closing apparatus which includes: a wafer conveyance port having an opening edge and configured to be opened/closed by an opening/closing door; and a cover removal apparatus installed on the opening/closing door and configured to remove a cover of a FOUP which is formed with a substrate outlet having a opening edge. When the cover removal apparatus removes the cover of the FOUP, the opening edge of the substrate outlet is closely contacted with the opening edge of the wafer conveyance port. The cover removal apparatus includes: a latch key which is engaged with the cover of the FOUP, a driving unit configured to drive the latch key, and an accommodation unit configured to accommodate the driving unit. The cover opening/closing apparatus further includes an exhaust system configured to exhaust a space within the accommodation unit.

Abstract: A substrate conveying method conveying a layered body having first and second substrates stacked with a spacer member provided between their respective bottom surfaces facing each other includes receiving the first substrate by holding the first substrate from below its bottom surface using a first holding mechanism provided on a side of a first fork provided above a second fork, and turning the first fork upside down and placing the received first substrate on the second fork; receiving the spacer member held in a substrate holding part by holding the spacer member from above using a second holding mechanism provided on the same side of the first fork as the first holding mechanism, and placing the received spacer member on the first substrate; and holding the second substrate from above its top surface using the first holding mechanism, and placing the received second substrate on the spacer member.

Abstract: According to one embodiment, a semiconductor module has a substrate, two nonvolatile memories disposed on a first surface of the substrate, a controller to control the nonvolatile memories, disposed on the first surface of the substrate and between the two nonvolatile memories, and a plurality of terminals that are electrically connected to the two nonvolatile memories and to the controller, disposed on a second surface of the substrate.

Abstract: A substrate transport apparatus includes a first fork which is disposed to be movable in a forward/backward direction to a substrate holding part to transport a stacked member to or receive the stacked member from the substrate holding part. A second fork is arranged to be reversible and disposed above the first fork to be movable in a forward/backward direction to an accommodating part that accommodates substrates and spacer members to transport a substrate or a spacer member between the accommodating part and the first fork. A first grip module is disposed on a first surface of the second fork to hold and support the substrate from an upward direction. A second grip module is disposed on the first surface of the second fork on the same side as the first grip module to hold and support the spacer member from an upward direction.

Abstract: Disclosed is a substrate heat treatment apparatus. The apparatus includes: a conveyance storage unit which includes a first storage section and a second storage section each of which stores a plurality of conveyance containers, and a conveyance mechanism configured to convey the conveyance containers, each of the conveyance containers accommodating a plurality of wafers; and a heat treatment unit including a heat treatment furnace which accommodates a holder configured to hold the plurality of wafers in multiple stages, and performs the heat treatment on the wafers. A mounting stage of a transfer section is provided below the first storage section in the conveyance storage unit. On the mounting stage, the conveyance containers are mounted so that the wafers within the conveyance containers are transferred to the holder in the heat treatment unit.

Abstract: A substrate conveying container opening/closing device includes an elevator carriage provided in a substrate transfer area and configured to be moved up and down by an elevator mechanism, a cover member for opening and closing an opening of a wall, a seal member for sealing a gap between the cover member and the periphery of the opening, a lid detaching/attaching mechanism provided in the cover member and configured to detach and attach the lid, a guide unit provided in the elevator carriage and configured to guide the cover member upward so that the cover member can advance from a retracting position toward the wall, a guideway provided in the wall to extend in a direction perpendicular to a seal surface of the opening, and a rotating body provided in the cover member and configured to roll downward along the guideway as the elevator carriage is moved downward.

Abstract: A method for managing an atmosphere in a storage container in a processing apparatus including a substrate transfer region and a container transfer region which are partitioned by a partition wall; a load port; a container keeping rack; and a cover opening/closing mechanism, includes substituting the internal atmosphere of the storage container that stores non-processed substrates with the inert gas for using the cover opening/closing mechanism; transferring the storage container of which the internal atmosphere has been substituted with the inert gas, to the container keeping rack and placing and keeping the storage container on the container keeping rack; and putting the storage container on standby on the container keeping rack while maintaining the atmosphere substituted with the inert gas.

Abstract: According to one embodiment, a semiconductor module has a substrate, two nonvolatile memories disposed on a first surface of the substrate, a controller to control the nonvolatile memories, disposed on the first surface of the substrate and between the two nonvolatile memories, and a plurality of terminals that are electrically connected to the two nonvolatile memories and to the controller, disposed on a second surface of the substrate.

Abstract: Provided is a transporting apparatus which suppresses wafers accommodated therein from being contaminated by particles existing inside the transporting apparatus even when wafers charged with electricity are accommodated in the accommodating apparatus. The transporting apparatus includes: a holding table including a first positioning pin that positions an article to be transported and configured to transfer an object to be processed which is accommodated in the article; an arm unit configured to grasp the article so as to dispose the article on the holding table; and a support unit configured to fix the article disposed on the holding table. In particular, at least one of the first positioning pin, the arm unit, and the support unit includes a ground element.

Abstract: According to an embodiment of present disclosure, a spacer is provided. The spacer includes at least a protrusion formed to protrude from an outer periphery of the spacer. The protrusion serves to locate the spacer in place in a transfer mechanism configured to transfer the spacer when the spacer is fixed by the transfer mechanism in such a way that the protrusion comes in contact with the transfer mechanism, and configured to allow the spacer to rotate or move in case the spacer is deviated from a predetermined transfer position when the spacer is engaged with the transfer mechanism.

Abstract: Provided is a cover opening/closing apparatus which includes: a wafer conveyance port having an opening edge and configured to be opened/closed by an opening/closing door; and a cover removal apparatus installed on the opening/closing door and configured to remove a cover of a FOUP which is formed with a substrate outlet having a opening edge. When the cover removal apparatus removes the cover of the FOUP, the opening edge of the substrate outlet is closely contacted with the opening edge of the wafer conveyance port. The cover removal apparatus includes: a latch key which is engaged with the cover of the FOUP, a driving unit configured to drive the latch key, and an accommodation unit configured to accommodate the driving unit. The cover opening/closing apparatus further includes an exhaust system configured to exhaust a space within the accommodation unit.

Abstract: In one embodiment, a preliminary solder layer made of a Sn alloy is formed on a connecting pad of a wiring substrate. A solder bump made of a Sn alloy is formed on an electrode pad of a semiconductor chip. After contacting the preliminary solder layer and the solder bump, the preliminary solder layer and the solder bump are melted by heating to a temperature of their melting points or higher to form a solder connecting part made of a Sn alloy containing Ag and Cu. Only the preliminary solder layer of the preliminary solder layer and the solder bump is composed of a Sn alloy containing Ag.

Abstract: A substrate conveying container opening/closing device includes an elevator carriage provided in a substrate transfer area and configured to be moved up and down by an elevator mechanism, a cover member for opening and closing an opening of a wall, a seal member for sealing a gap between the cover member and the periphery of the opening, a lid detaching/attaching mechanism provided in the cover member and configured to detach and attach the lid, a guide unit provided in the elevator carriage and configured to guide the cover member upward so that the cover member can advance from a retracting position toward the wall, a guideway provided in the wall to extend in a direction perpendicular to a seal surface of the opening, and a rotating body provided in the cover member and configured to roll downward along the guideway as the elevator carriage is moved downward.

Abstract: A substrate transport apparatus includes a first fork which is disposed to be movable in a forward/backward direction to a substrate holding part to transport a stacked member to or receive the stacked member from the substrate holding part. A second fork is arranged to be reversible and disposed above the first fork to be movable in a forward/backward direction to an accommodating part that accommodates substrates and spacer members to transport a substrate or a spacer member between the accommodating part and the first fork. A first grip module is disposed on a first surface of the second fork to hold and support the substrate from an upward direction. A second grip module is disposed on the first surface of the second fork on the same side as the first grip module to hold and support the spacer member from an upward direction.

Abstract: A substrate conveying method conveying a layered body having first and second substrates stacked with a spacer member provided between their respective bottom surfaces facing each other includes receiving the first substrate by holding the first substrate from below its bottom surface using a first holding mechanism provided on a side of a first fork provided above a second fork, and turning the first fork upside down and placing the received first substrate on the second fork; receiving the spacer member held in a substrate holding part by holding the spacer member from above using a second holding mechanism provided on the same side of the first fork as the first holding mechanism, and placing the received spacer member on the first substrate; and holding the second substrate from above its top surface using the first holding mechanism, and placing the received second substrate on the spacer member.