Abstract: A method of cutting a workpiece made of a highly-hard material is provided. The workpiece is cut by a machining device including a workpiece holder that holds the workpiece, a spindle device that rotates the workpiece holder, a tool holder that holds a tool, and a relative moving mechanism that relatively moves the workpiece holder and the tool holder at least in two axial directions orthogonal to each other. In the machining device, positioning errors in the axial directions are within 5 nm.

Abstract: A wafer processing method for dividing a wafer into individual devices along a plurality of crossing streets formed on the front side of the wafer, the individual devices being respectively formed in a plurality of regions partitioned by the streets. The wafer processing method includes the steps of attaching the front side of the wafer to a dicing tape supported to an annular dicing frame, grinding the back side of the wafer to reduce the thickness of the wafer to a predetermined thickness, forming a break start point along each street from the back side of the wafer, applying an external force to the wafer to break the wafer along each street where the break start point is formed, thereby dividing the wafer into the individual devices, attaching the back side of the wafer to a front side of an adhesive tape supported to an annular frame and next removing the adhesive tape from the front side of the adhesive tape, and peeling off and picking up each device from the adhesive tape.

Abstract: An object of the present invention is to provide a mist measuring apparatus in which visual confirmation performance is enhanced, and high-accuracy detection is enabled. In the mist measuring apparatus including a housing, and a light source that is provided in this housing and emits light to a misty cutting fluid, the housing is provided around an ejection part of the misty cutting fluid, the light emitted from the light source is a visible ray, and the housing is provided with an observation part for observing scattered light from the misty cutting fluid.

Abstract: A method of cutting a workpiece made of a highly-hard material is provided. The workpiece is cut by a machining device including a workpiece holder that holds the workpiece, a spindle device that rotates the workpiece holder, a tool holder that holds a tool, and a relative moving mechanism that relatively moves the workpiece holder and the tool holder at least in two axial directions orthogonal to each other. In the machining device, positioning errors in the axial directions are within 5 nm.

Abstract: An object of the present invention is to provide a mist measuring apparatus in which visual confirmation performance is enhanced, and high-accuracy detection is enabled. In the mist measuring apparatus including a housing, and a light source that is provided in this housing and emits light to a misty cutting fluid, the housing is provided around an ejection part of the misty cutting fluid, the light emitted from the light source is a visible ray, and the housing is provided with an observation part for observing scattered light from the misty cutting fluid.