Patents by Inventor Katsuhiko Sumita
Katsuhiko Sumita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11791284Abstract: Provided is a method suitable for efficiently manufacturing a semiconductor device while preventing warpage of the wafer laminate in manufacturing a semiconductor device in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method includes at least: preparing a plurality of first wafer laminates each having a laminate configuration including a first and second wafers each having an element forming surface and a back surface opposite from the element forming surface, the laminate configuration wherein the element forming surface sides of the first and second wafers are bonded to each other; thinning the first wafer of the first wafer laminate to form a first wafer laminate having the thinned first wafer; and bonding the thinned first wafer sides of two first wafer laminates having undergone the thinning to each other to form a second wafer laminate.Type: GrantFiled: October 18, 2019Date of Patent: October 17, 2023Assignee: Daicel CorporationInventors: Naoko Tsuji, Akira Yamakawa, Katsuhiko Sumita
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Publication number: 20210358867Abstract: Provided is a method suitable for efficiently manufacturing a semiconductor device while preventing warpage of the wafer laminate in manufacturing a semiconductor device in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method includes at least: preparing a plurality of first wafer laminates each having a laminate configuration including a first and second wafers each having an element forming surface and a back surface opposite from the element forming surface, the laminate configuration wherein the element forming surface sides of the first and second wafers are bonded to each other; thinning the first wafer of the first wafer laminate to form a first wafer laminate having the thinned first wafer; and bonding the thinned first wafer sides of two first wafer laminates having undergone the thinning to each other to form a second wafer laminate.Type: ApplicationFiled: October 18, 2019Publication date: November 18, 2021Applicant: DAICEL CORPORATIONInventors: Naoko TSUJI, Akira YAMAKAWA, Katsuhiko SUMITA
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Patent number: 10622658Abstract: A release layer of a release film for producing a membrane electrode assembly of a polymer electrolyte fuel cell comprises a cyclic olefin polymer comprising an olefin unit having a C3-10alkyl group as a side chain thereof. The release layer may have a glass transition temperature of about 210 to 350° C. The release layer may have a transition point of a dynamic storage modulus E? in a range from ?50 to 100° C. An ion exchange layer comprising an ion exchange polymer may be laminated on the release layer of the release film by a roll-to-roll processing to produce a laminate. The release film may be separated from the laminate to give the membrane electrode assembly. The release film achieves improved production of a membrane electrode assembly (an electrolyte membrane and/or an electrode membrane) of a polymer electrolyte fuel cell.Type: GrantFiled: November 4, 2014Date of Patent: April 14, 2020Assignees: DAICEL CORPORATION, DAICEL VALUE COATING LTD.Inventors: Hiroshi Onomichi, Katsuhiko Sumita, Yoshimichi Okano, Kanae Nishimura, Kazuyuki Okada, Takayuki Yaegashi, Ken Suzuki
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Publication number: 20160276689Abstract: A release layer of a release film for producing a membrane electrode assembly of a polymer electrolyte fuel cell comprises a cyclic olefin polymer comprising an olefin unit having a C3-10alkyl group as a side chain thereof. The release layer may have a glass transition temperature of about 210 to 350° C. The release layer may have a transition point of a dynamic storage modulus E? in a range from ?50 to 100° C. An ion exchange layer comprising an ion exchange polymer may be laminated on the release layer of the release film by a roll-to-roll processing to produce a laminate. The release film may be separated from the laminate to give the membrane electrode assembly. The release film achieves improved production of a membrane electrode assembly (an electrolyte membrane and/or an electrode membrane) of a polymer electrolyte fuel cell.Type: ApplicationFiled: November 4, 2014Publication date: September 22, 2016Applicants: DAICEL CORPORATION, DAICEL VALUE COATING LTD.Inventors: Hiroshi ONOMICHI, Katsuhiko SUMITA, Yoshimichi OKANO, Kanae NISHIMURA, Kazuyuki OKADA, Takayuki YAEGASHI, Ken SUZUKI
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Publication number: 20080302470Abstract: In a transfer sheet which comprises a support and a transfer layer releasable from the support, the transfer layer comprises (i) an adhesive layer formed on one surface of the support and (ii) a masking layer formed on the adhesive layer and containing a masking agent and a binder resin which may have a crosslinking group, and the transfer layer is adjusted to have an elongation at break of not less than 30% (e.g., 30 to 200%). The masking layer may comprise a white pigment such as a titanium oxide and a urethane-series resin which may have an isocyanate group. The transfer sheet may comprise an image-receiving layer at least containing a urethane-series resin particle formed on the masking layer. Moreover, the transfer sheet may comprise an anchor layer between the masking layer and the image-receiving layer. The transfer layer is capable of recording an image thereon the image being transferred from a recording sheet.Type: ApplicationFiled: January 13, 2005Publication date: December 11, 2008Inventors: Katsuhiko Sumita, Shuji Nakamura
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Patent number: 6858311Abstract: A surface protective film which can be easily peeled off from an adhesive silicone rubber composition layer, is free of a plasticizer or the like which may have an adverse effect on adhesion of the adhesive silicone rubber composition layer to a semiconductor chip or semiconductor chip attaching portion, and has no adverse effect on thickness uniformity or surface flatness of the adhesive silicone rubber composition layer, and a process for producing the same. More specifically, a surface protective film for protecting an adhesive silicone rubber composition layer (C), comprising a base film (A) coated, at least on one side, with a cellulose-based resin layer (B) having an SP value of 21.0 to 29.0 (MPa)1/2, determined by the Fedors method, and process for producing the same.Type: GrantFiled: May 9, 2003Date of Patent: February 22, 2005Assignee: Daicel Chemical Industries, Ltd.Inventors: Katsuhiko Sumita, Masaya Omura
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Patent number: 6777100Abstract: A surface protective film which can be easily peeled off from an adhesive resin layer it protects, is free of any component which may have an adverse effect on adhesion of the adhesive resin layer to an object to which it is bonded, and has no adverse effect on thickness uniformity or surface flatness of the adhesive resin layer, and a process for producing the same. More specifically, a surface protective film for protecting an adhesive resin layer, comprising a base film (A) coated, at least on one side, with a cellulose-based resin layer (B) having an SP value of 21.0 to 29.0(MPa)1/2, determined by the Fedors method, and process for producing the same.Type: GrantFiled: May 16, 2003Date of Patent: August 17, 2004Assignee: Daicel Chemical Industries, Ltd.Inventors: Katsuhiko Sumita, Masaya Omura
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Publication number: 20040067371Abstract: A surface protective film which can be easily peeled off from an adhesive silicone rubber composition layer, is free of a plasticizer or the like which may have an adverse effect on adhesion of the adhesive silicone rubber composition layer to a semiconductor chip or semiconductor chip attaching portion, and has no adverse effect on thickness uniformity or surface flatness of the adhesive silicone rubber composition layer, and a process for producing the same. More specifically, a surface protective film for protecting an adhesive silicone rubber composition layer (C), comprising a base film (A) coated, at least on one side, with a cellulose-based resin layer (B) having an SP value of 21.0 to 29.0(MPa)1/2, determined by the Fedors method, and process for producing the same.Type: ApplicationFiled: May 9, 2003Publication date: April 8, 2004Inventors: Katsuhiko Sumita, Masaya Omura
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Publication number: 20030232165Abstract: A surface protective film which can be easily peeled off from an adhesive resin layer it protects, is free of any component which may have an adverse effect on adhesion of the adhesive resin layer to an object to which it is bonded, and has no adverse effect on thickness uniformity or surface flatness of the adhesive resin layer, and a process for producing the same. More specifically, a surface protective film for protecting an adhesive resin layer, comprising a base film (A) coated, at least on one side, with a cellulose-based resin layer (B) having an SP value of 21.0 to 29.0(MPa)1/2, determined by the Fedors method, and process for producing the same.Type: ApplicationFiled: May 16, 2003Publication date: December 18, 2003Inventors: Katsuhiko Sumita, Masaya Omura
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Publication number: 20010021439Abstract: The imaging material of the present invention is an image-receiving sheet comprising at least a porous layer, which is fabricated by incorporating an organic acid having a solubility in 100 g of water at 20° C. of 0.01 to 2 g is incorporated into the porous layer. The imaging sheet may be constituted of a laminate of a substrate and a porous layer formed on at least one side of the substrate, or of a porous support. The organic acid may be an aromatic polycarboxylic acid, particularly an aromatic dicarboxylic acid. The image-receiving sheet of the present invention is excellent in ink absorption, blocking resistance, surface gloss, water resistance of recorded images, weatherability, visibility, and color reproducibility.Type: ApplicationFiled: January 5, 2001Publication date: September 13, 2001Inventors: Katsuhiko Sumita, Masaya Omura