Abstract: A semiconductor device includes a semiconductor element. The semiconductor element has a semiconductor layer, a first-conductivity-type layer, a saturation current suppression layer, a current dispersion layer, a base region, a source region, trench gate structures, an interlayer insulation film, a source electrode, a drain electrode, and a second deep layer. The first-conductivity-type layer is disposed above the semiconductor layer. The saturation current suppression layer disposed above the first-conductivity-type layer includes a first deep layer and a JEFT portion. The base region is disposed above the saturation current suppression layer. The source region and the contact region are disposed above the region. Each of the trench gate structures has a gate trench, a gate insulation film, and a gate electrode. The second deep layer is disposed among the trench gate structures and is connected to the first deep layer.

Abstract: A vehicle lighting device includes a high-light source group, a low-light source group, a high-beam lens to transmit light from the high-beam light source and emit the light to outside, a low-beam lens to transmit light from the low-beam light source and emit the light to outside, a circuit board having the high-beam light source and the low-beam light source mounted thereon together, and a reflector that guides light emitted from the low-beam light source to the low-beam lens, where the circuit board is inclined in a front-rear direction and an up-down direction.

Abstract: In a wireless communication base station device, a modulation unit carries out modulation processing for Dch data after coding to generate a Dch data symbol. A modulation unit carries out modulation processing for Lch data after coding to generate an Lch data symbol. An allocation unit allocates the Dch data symbol and Lch data symbol to each sub-carrier composing an OFDM symbol and outputs the allocated sub-carrier to a multiplex unit. In this case, the allocation unit allocates the Dch data symbol to a plurality of resource blocks where one Dch is arranged at an interval equal to integral multiples of the number of resource blocks composing a resource block group.

Abstract: A workpiece processing apparatus which coats a front surface of a workpiece with a resin, the workpiece having devices formed in regions demarcated by a plurality of planned dividing lines formed in a lattice pattern. The workpiece processing apparatus includes a cassette mounting base mounted with a cassette housing a plurality of workpieces, a resin coating unit that coats the front surface of the workpiece with the resin, a resin curing unit that cures the resin by applying an external stimulus to the coated resin, a resin grinding unit that flattens the cured resin by grinding the cured resin by a rotating grinding stone, and a conveying mechanism that conveys the workpiece between the units.

Abstract: A peeling method for peeling off a substrate provided over a front surface of a support plate through a peel layer from the support plate after dividing the substrate into a plurality of small pieces, the peeling method comprising: a first holding step of holding the support plate by a first holding unit; a dividing step of causing a cutting blade to cut into the substrate, or applying a laser beam of such a wavelength as to be absorbed in the substrate to the substrate, along division lines set on the substrate, to divide the substrate into the plurality of small pieces; a start point region forming step of blowing a fluid to the peel layer exposed at an end portion of a small piece among the plurality of small pieces, to form a start point region which will serve as a start point when peeling off the small piece from the support plate; a second holding step of holding the small piece by a second holding unit; and a peeling step of relatively moving the first holding unit and the second holding unit in direc

Abstract: A liquid discharge device determines, in a state of a liquid discharger discharging liquid onto a continuous form sheet conveyed by a conveyor at a first conveying speed, in response to a seam of the continuous form sheet detected by a seam detection sensor, whether a heater temperature detected by a temperature detection sensor is a threshold or higher; causes, in response to the heater temperature being determined to be the threshold or higher, the conveyor to stop conveying the continuous form sheet, until the heater temperature decreases to be less than the threshold; and causes, in response to the heater temperature having decreased to be less than the threshold, the conveyor to convey the continuous form sheet at a second conveying speed slower than the first conveying speed until the seam of the continuous form sheet is wound up around a winding roller.

Abstract: A processing apparatus used in processing a workpiece having a device in each of a plurality of regions that includes a chuck table holding the workpiece, positioning means positioning the workpiece before grinding, resin coating means including a rotatable spinner table for coating the workpiece with a resin, cleaning means, a grinding unit, and a transfer unit. The transfer unit includes a first transfer unit transferring the workpiece from the positioning means to the spinner table and from the spinner table to the chuck table, a second transfer unit transferring the workpiece from the chuck table to the cleaning means, and a front/back surface inversion transfer unit taking over the workpiece from the cleaning means to the second transfer unit.

Abstract: There is provided a carrier plate removing method for removing a carrier plate from a workpiece disposed on a top surface of a carrier plate via a provisional bonding layer. The carrier plate removing method includes a stepped portion forming step of forming a stepped portion in which the workpiece projects sideward as compared with the carrier plate by processing the carrier plate so as to remove a peripheral portion of the carrier plate along a peripheral edge of the carrier plate from an undersurface side opposite from the top surface of the carrier plate, a carrier plate holding step of holding the carrier plate by a carrier plate holding unit, and a removing step of removing the carrier plate from the workpiece by applying a force from the carrier plate side to the stepped portion, and moving the workpiece in a direction of separating from the carrier plate.

Abstract: A manufacturing method for a device chip includes a wafer preparation step of preparing a wafer including a base substrate, a laser beam absorbing layer layered on a front surface of the base substrate, and a device layer being layered on the laser beam absorbing layer and having devices formed in respective separate regions demarcated by a plurality of crossing division lines, a device layer dividing step of forming respective division grooves that divide at least the device layer into individual device chips along the plurality of division lines, and a lift-off step of, after the device layer dividing step is carried out, applying a laser beam of such a wavelength as to be absorbed in the laser beam absorbing layer, from the base substrate side, and lifting off a device chip from the front surface of the base substrate.

Abstract: A liquid discharge device determines, in a state of a liquid discharger discharging liquid onto a continuous form sheet conveyed by a conveyor at a first conveying speed, in response to a seam of the continuous form sheet detected by a seam detection sensor, whether a heater temperature detected by a temperature detection sensor is a threshold or higher; causes, in response to the heater temperature being determined to be the threshold or higher, the conveyor to stop conveying the continuous form sheet, until the heater temperature decreases to be less than the threshold; and causes, in response to the heater temperature having decreased to be less than the threshold, the conveyor to convey the continuous form sheet at a second conveying speed slower than the first conveying speed until the seam of the continuous form sheet is wound up around a winding roller.

Abstract: There is provided a carrier plate removing method for removing a carrier plate from a workpiece disposed on a top surface of a carrier plate via a provisional bonding layer. The carrier plate removing method includes a stepped portion forming step of forming a stepped portion in which the workpiece projects sideward as compared with the carrier plate by processing the carrier plate so as to remove a peripheral portion of the carrier plate along a peripheral edge of the carrier plate from an undersurface side opposite from the top surface of the carrier plate, a carrier plate holding step of holding the carrier plate by a carrier plate holding unit, and a removing step of removing the carrier plate from the workpiece by applying a force from the carrier plate side to the stepped portion, and moving the workpiece in a direction of separating from the carrier plate.

Abstract: A method of removing a carrier plate is used to peel off and remove the carrier plate from a workpiece of a disk-shaped composite substrate in which the workpiece is disposed on a face side of the carrier plate with a temporary adhesive layer interposed therebetween. The method includes a step forming step of forming a step protruding laterally from the carrier plate more on a reverse side of the carrier plate than on the face side of the carrier plate, by removing an outer circumferential portion of the workpiece, an outer circumferential portion of the temporary adhesive layer, and a face-side side of an outer circumferential edge of the carrier plate, a starting point region forming step of forming a starting point region that acts as a starting point in peeling off the carrier plate from the workpiece.

Abstract: A method of manufacturing a molded chip includes a preparing step of sticking device faces of a plurality of device chips arrayed to a protective member that is thermally insulative, thereby forming a chip group; a molding step of, after the preparing step, supplying a molding resin to reverse sides of the device chips and gaps between the device chips, thereby forming a molded wafer in which the reverse sides and side faces of the device chips are covered with a resin molding; and a molded wafer dividing step of, after the molding step, dividing the molded wafer along centers of the gaps filled with the resin molding into molded chips on the basis of an image in which a face side of the molded wafer has been captured.

Abstract: A manufacturing method of a semiconductor device with a metal film includes a cut groove forming step of causing a cutting blade to cut into a first surface of a workpiece and forming cut grooves with a depth that exceeds the finished thickness of the workpiece along planned dividing lines, a protective member sticking step of sticking a protective member to the first surface of the workpiece, a grinding step of grinding the side of a second surface until the thickness of the workpiece becomes the finished thickness to divide the workpiece into semiconductor devices, a metal film covering step of covering, by a metal film, the side surface of each of the semiconductor devices for which the protective member is stuck to the side of the first surface and the side of the second surface after the grinding, and a protective member removing step of removing the protective member.

Abstract: A wiring board manufacturing method includes a sheet laminate forming step of impregnating a glass cloth with a synthetic resin to form a plurality of sheets and next stacking these sheets to form a sheet laminate having a first surface and a second surface, a core member forming step of stacking a release plate on the first surface of the sheet laminate, stacking an electrode plate on the second surface of the sheet laminate, next using a pressure plate to press the release plate, the sheet laminate, and the electrode plate in their stacked condition, thereby uniting them together to form a core member, and a grinding step of grinding the release plate of the core member in a condition where the electrode plate of the core member is held on a chuck table, thereby making a thickness of the core member uniform.

Abstract: A peeling method for peeling off a substrate provided over a front surface of a support plate through a peel layer from the support plate after dividing the substrate into a plurality of small pieces, the peeling method comprising: a first holding step of holding the support plate by a first holding unit; a dividing step of causing a cutting blade to cut into the substrate, or applying a laser beam of such a wavelength as to be absorbed in the substrate to the substrate, along division lines set on the substrate, to divide the substrate into the plurality of small pieces; a start point region forming step of blowing a fluid to the peel layer exposed at an end portion of a small piece among the plurality of small pieces, to form a start point region which will serve as a start point when peeling off the small piece from the support plate; a second holding step of holding the small piece by a second holding unit; and a peeling step of relatively moving the first holding unit and the second holding unit in direc

Abstract: A peeling method for peeling off a substrate provided over a support plate through a peel layer from the support plate includes: a first holding step of holding one of the support plate and the substrate by a first holding unit; a start point region forming step of blowing a fluid to an end portion of the peel layer exposed at an end portion of the support plate and the substrate, to form a start point region which will serve as a start point when peeling off the substrate from the support plate; a second holding step of holding the other of the support plate and the substrate by a second holding unit; and a peeling step of relatively moving the first holding unit and the second holding unit in directions for spacing away from each other, to peel off the substrate from the support plate.

Abstract: A method of removing a carrier plate is used to peel off and remove the carrier plate from a workpiece of a disk-shaped composite substrate in which the workpiece is disposed on a face side of the carrier plate with a temporary adhesive layer interposed therebetween. The method includes a step forming step of forming a step protruding laterally from the carrier plate more on a reverse side of the carrier plate than on the face side of the carrier plate, by removing an outer circumferential portion of the workpiece, an outer circumferential portion of the temporary adhesive layer, and a face-side side of an outer circumferential edge of the carrier plate, a starting point region forming step of forming a starting point region that acts as a starting point in peeling off the carrier plate from the workpiece.

Abstract: There is provided a removal method of a carrier plate used when the carrier plate is removed from a workpiece bonded to a region excluding an outer rim part in a front surface of the carrier plate by a temporary bonding layer disposed on the whole of the front surface of the carrier plate. This removal method of a carrier plate includes a temporary bonding layer removal step of removing part or all of an outer rim part of the temporary bonding layer, a holding step of holding the workpiece from the upper side by a holding unit after removing part or all of the outer rim part of the temporary bonding layer, and a carrier plate removal step of removing the carrier plate from the workpiece by applying a downward force to the outer rim part of the carrier plate from the side of the front surface.

Abstract: A carrier plate removing method for removing a carrier plate from a workpiece previously provided through a temporary bonding layer on the front side of the carrier plate is provided. The carrier plate removing method includes a shoulder portion forming step of processing a peripheral portion of the carrier plate along a peripheral edge thereof from the front side of the carrier plate on which the workpiece is provided, thereby forming a shoulder portion as a lower part connected to the back side of the carrier plate, the lower part projecting horizontally outward from the side surface of an upper part connected to the front side of the carrier plate.